Findchips: Parametric Search Results for HCS21

Parametric results for: HCS21 under Sockets and Chip Carriers

Select parts from the table below to compare.

Compare


Select Parts		Part Number

		HCS217-01GG Advanced Interconnections Corp
		HCS21D/SAMPLE Intersil Corporation
		HCS216-01TG Advanced Interconnections Corp
		1-HCS215-49TT Advanced Interconnections Corp
		1-HCS215-49TG Advanced Interconnections Corp
		HCS217-04TG Advanced Interconnections Corp
		HCS212-354TT Advanced Interconnections Corp
		HCS21KMSR Intersil Corporation
		5962R9577901V9A Harris Semiconductor
		5962R9577901V9X Intersil Corporation

			Most Relevant			Technical			Compliance	Operating Conditions		Physical										Dimensions			Other
Composite Price	Rohs Code	Part Life Cycle Code	Number of Contacts	Contact Material	Terminal Pitch	Device Socket Type	Device Type Used On	Additional Feature	JESD-609 Code	Operating Temperature-Max	Operating Temperature-Min	Contact Configuration	Contact Finish Mating	Contact Finish Termination	Contact Style	Housing Material	Mating Contact Pitch	Mounting Style	PCB Contact Pattern	PCB Contact Row Spacing	Termination Type	Body Depth	Body Breadth	Body Length	Ihs Manufacturer	Reach Compliance Code	ECCN Code	HTS Code	Part Package Code	Package Description	Pin Count	Family	JESD-30 Code	Length	Logic IC Type	Number of Functions	Number of Inputs	Number of Terminals	Package Body Material	Package Code	Package Shape	Package Style	Propagation Delay (tpd)	Qualification Status	Seated Height-Max	Supply Voltage-Max (Vsup)	Supply Voltage-Min (Vsup)	Supply Voltage-Nom (Vsup)	Surface Mount	Technology	Terminal Form	Terminal Position	Width	Load Capacitance (CL)	Package Equivalence Code	Prop. Delay@Nom-Sup	Schmitt Trigger	Screening Level	Temperature Grade	Terminal Finish	Total Dose

Check for Price

Obsolete

217

BE-CU

2.54 mm

IC SOCKET

PGA217

2.5 OZ. AVG. INSERTION FORCE

260 °C

-60 °C

17X17

AU ON NI

Gold (Au) - with Nickel (Ni) barrier

RND PIN-SKT

GLASS FILLED THERMOPLASTIC

0.1 inch

STRAIGHT

RECTANGULAR

100 µm

SOLDER

0.165 inch

1.7 inch

ADVANCED INTERCONNECTIONS CORP

compliant

EAR99

8536.69.40.40

Check for Price

Obsolete

2.54 mm

INTERSIL CORP

unknown

8542.39.00.01

DIP

DIP,

HC/UH

R-CDIP-T14

19.43 mm

AND GATE

CERAMIC, METAL-SEALED COFIRED

DIP

RECTANGULAR

IN-LINE

20 ns

Not Qualified

5.08 mm

5.5 V

4.5 V

5 V

CMOS

THROUGH-HOLE

DUAL

7.62 mm

Check for Price

Obsolete

216

BE-CU

2.54 mm

IC SOCKET

PGA216

2.5 OZ. AVG. INSERTION FORCE

260 °C

-60 °C

21X21

AU ON NI

Tin/Lead (Sn/Pb) - with Nickel (Ni) barrier

RND PIN-SKT

GLASS FILLED THERMOPLASTIC

0.1 inch

STRAIGHT

RECTANGULAR

100 µm

SOLDER

0.165 inch

2.1 inch

ADVANCED INTERCONNECTIONS CORP

compliant

EAR99

8536.69.40.40

Check for Price

Obsolete

215

BE-CU

2.54 mm

IC SOCKET

PGA215

2.5 OZ. AVG. INSERTION FORCE

260 °C

-60 °C

16X16

SN-PB ON NI

Tin/Lead (Sn/Pb) - with Nickel (Ni) barrier

RND PIN-SKT

GLASS FILLED THERMOPLASTIC

0.1 inch

STRAIGHT

RECTANGULAR

100 µm

SOLDER

0.095 inch

1.6 inch

ADVANCED INTERCONNECTIONS CORP

compliant

EAR99

8536.69.40.40

Check for Price

Obsolete

215

BE-CU

2.54 mm

IC SOCKET

PGA215

2.5 OZ. AVG. INSERTION FORCE

260 °C

-60 °C

16X16

AU ON NI

Tin/Lead (Sn/Pb) - with Nickel (Ni) barrier

RND PIN-SKT

GLASS FILLED THERMOPLASTIC

0.1 inch

STRAIGHT

RECTANGULAR

100 µm

SOLDER

0.095 inch

1.6 inch

ADVANCED INTERCONNECTIONS CORP

compliant

EAR99

8536.69.40.40

Check for Price

Obsolete

217

BE-CU

2.54 mm

IC SOCKET

PGA217

2.5 OZ. AVG. INSERTION FORCE

260 °C

-60 °C

17X17

AU ON NI

Tin/Lead (Sn/Pb) - with Nickel (Ni) barrier

RND PIN-SKT

GLASS FILLED THERMOPLASTIC

0.1 inch

STRAIGHT

RECTANGULAR

100 µm

SOLDER

0.12 inch

1.7 inch

ADVANCED INTERCONNECTIONS CORP

compliant

EAR99

8536.69.40.40

Check for Price

Obsolete

212

BE-CU

2.54 mm

IC SOCKET

PGA212

260 °C

-60 °C

15X15

SN-PB

Tin/Lead (Sn/Pb) - with Nickel (Ni) barrier

RND PIN-SKT

GLASS FILLED THERMOPLASTIC

0.1 inch

STRAIGHT

RECTANGULAR

100 µm

SOLDER

0.165 inch

1.5 inch

ADVANCED INTERCONNECTIONS CORP

compliant

EAR99

8536.69.40.40

Check for Price

Obsolete

2.54 mm

125 °C

-55 °C

INTERSIL CORP

not_compliant

8542.39.00.01

DFP

DFP, FL14,.3

HC/UH

R-CDFP-F14

9.525 mm

AND GATE

CERAMIC, METAL-SEALED COFIRED

DFP

RECTANGULAR

FLATPACK

22 ns

Not Qualified

5.08 mm

5.5 V

4.5 V

5 V

YES

CMOS

FLAT

DUAL

7.62 mm

50 pF

FL14,.3

22 ns

MIL-PRF-38535 Class V

MILITARY

TIN LEAD

200k Rad(Si) V

Check for Price

Transferred

125 °C

-55 °C

HARRIS SEMICONDUCTOR

unknown

8542.39.00.01

DIE,

HC/UH

X-XUUC-N14

AND GATE

UNSPECIFIED

DIE

UNSPECIFIED

UNCASED CHIP

20 ns

Not Qualified

5.5 V

4.5 V

5 V

YES

CMOS

NO LEAD

UPPER

50 pF

MILITARY

TIN LEAD

100k Rad(Si) V

Check for Price

Obsolete

125 °C

-55 °C

INTERSIL CORP

unknown

8542.39.00.01

DIE

DIE,

HC/UH

R-XUUC-N14

AND GATE

UNSPECIFIED

DIE

RECTANGULAR

UNCASED CHIP

22 ns

Not Qualified

5.5 V

4.5 V

5 V

YES

CMOS

NO LEAD

UPPER

MIL-PRF-38535 Class V

MILITARY

100k Rad(Si) V

1 2 3 4 5 Next

Compare

HCS217-01GG

Advanced Interconnections Corp

Check for Price

Obsolete

217

BE-CU

2.54 mm

IC SOCKET

PGA217

2.5 OZ. AVG. INSERTION FORCE

260 °C

-60 °C

17X17

AU ON NI

Gold (Au) - with Nickel (Ni) barrier

RND PIN-SKT

GLASS FILLED THERMOPLASTIC

0.1 inch

STRAIGHT

RECTANGULAR

100 µm

SOLDER

0.165 inch

1.7 inch

ADVANCED INTERCONNECTIONS CORP

compliant

EAR99

8536.69.40.40

HCS21D/SAMPLE

Intersil Corporation

Check for Price

Obsolete

2.54 mm

INTERSIL CORP

unknown

8542.39.00.01

DIP

DIP,

HC/UH

R-CDIP-T14

19.43 mm

AND GATE

CERAMIC, METAL-SEALED COFIRED

DIP

RECTANGULAR

IN-LINE

20 ns

Not Qualified

5.08 mm

5.5 V

4.5 V

5 V

CMOS

THROUGH-HOLE

DUAL

7.62 mm

HCS216-01TG

Advanced Interconnections Corp

Check for Price

Obsolete

216

BE-CU

2.54 mm

IC SOCKET

PGA216

2.5 OZ. AVG. INSERTION FORCE

260 °C

-60 °C

21X21

AU ON NI

Tin/Lead (Sn/Pb) - with Nickel (Ni) barrier

RND PIN-SKT

GLASS FILLED THERMOPLASTIC

0.1 inch

STRAIGHT

RECTANGULAR

100 µm

SOLDER

0.165 inch

2.1 inch

ADVANCED INTERCONNECTIONS CORP

compliant

EAR99

8536.69.40.40

1-HCS215-49TT

Advanced Interconnections Corp

Check for Price

Obsolete

215

BE-CU

2.54 mm

IC SOCKET

PGA215

2.5 OZ. AVG. INSERTION FORCE

260 °C

-60 °C

16X16

SN-PB ON NI

Tin/Lead (Sn/Pb) - with Nickel (Ni) barrier

RND PIN-SKT

GLASS FILLED THERMOPLASTIC

0.1 inch

STRAIGHT

RECTANGULAR

100 µm

SOLDER

0.095 inch

1.6 inch

ADVANCED INTERCONNECTIONS CORP

compliant

EAR99

8536.69.40.40

1-HCS215-49TG

Advanced Interconnections Corp

Check for Price

Obsolete

215

BE-CU

2.54 mm

IC SOCKET

PGA215

2.5 OZ. AVG. INSERTION FORCE

260 °C

-60 °C

16X16

AU ON NI

Tin/Lead (Sn/Pb) - with Nickel (Ni) barrier

RND PIN-SKT

GLASS FILLED THERMOPLASTIC

0.1 inch

STRAIGHT

RECTANGULAR

100 µm

SOLDER

0.095 inch

1.6 inch

ADVANCED INTERCONNECTIONS CORP

compliant

EAR99

8536.69.40.40

HCS217-04TG

Advanced Interconnections Corp

Check for Price

Obsolete

217

BE-CU

2.54 mm

IC SOCKET

PGA217

2.5 OZ. AVG. INSERTION FORCE

260 °C

-60 °C

17X17

AU ON NI

Tin/Lead (Sn/Pb) - with Nickel (Ni) barrier

RND PIN-SKT

GLASS FILLED THERMOPLASTIC

0.1 inch

STRAIGHT

RECTANGULAR

100 µm

SOLDER

0.12 inch

1.7 inch

ADVANCED INTERCONNECTIONS CORP

compliant

EAR99

8536.69.40.40

HCS212-354TT

Advanced Interconnections Corp

Check for Price

Obsolete

212

BE-CU

2.54 mm

IC SOCKET

PGA212

260 °C

-60 °C

15X15

SN-PB

Tin/Lead (Sn/Pb) - with Nickel (Ni) barrier

RND PIN-SKT

GLASS FILLED THERMOPLASTIC

0.1 inch

STRAIGHT

RECTANGULAR

100 µm

SOLDER

0.165 inch

1.5 inch

ADVANCED INTERCONNECTIONS CORP

compliant

EAR99

8536.69.40.40

HCS21KMSR

Intersil Corporation

Check for Price

Obsolete

2.54 mm

125 °C

-55 °C

INTERSIL CORP

not_compliant

8542.39.00.01

DFP

DFP, FL14,.3

HC/UH

R-CDFP-F14

9.525 mm

AND GATE

CERAMIC, METAL-SEALED COFIRED

DFP

RECTANGULAR

FLATPACK

22 ns

Not Qualified

5.08 mm

5.5 V

4.5 V

5 V

YES

CMOS

FLAT

DUAL

7.62 mm

50 pF

FL14,.3

22 ns

MIL-PRF-38535 Class V

MILITARY

TIN LEAD

200k Rad(Si) V

5962R9577901V9A

Harris Semiconductor

Check for Price

Transferred

125 °C

-55 °C

HARRIS SEMICONDUCTOR

unknown

8542.39.00.01

DIE,

HC/UH

X-XUUC-N14

AND GATE

UNSPECIFIED

DIE

UNSPECIFIED

UNCASED CHIP

20 ns

Not Qualified

5.5 V

4.5 V

5 V

YES

CMOS

NO LEAD

UPPER

50 pF

MILITARY

TIN LEAD

100k Rad(Si) V

5962R9577901V9X

Intersil Corporation

Check for Price

Obsolete

125 °C

-55 °C

INTERSIL CORP

unknown

8542.39.00.01

DIE

DIE,

HC/UH

R-XUUC-N14

AND GATE

UNSPECIFIED

DIE

RECTANGULAR

UNCASED CHIP

22 ns

Not Qualified

5.5 V

4.5 V

5 V

YES

CMOS

NO LEAD

UPPER

MIL-PRF-38535 Class V

MILITARY

100k Rad(Si) V

1 2 3 4 5 Next