Parametric results for: HCS169-01TT under Sockets and Chip Carriers

All Filters Additional Feature Body Breadth Body Depth Body Length Contact Configuration Contact Finish Mating Contact Finish Termination Contact Material Contact Style Device Socket Type Device Type Used On Housing Material JESD-609 Code Manufacturer Mating Contact Pitch Mounting Style Number of Contacts Operating Temperature-Max Operating Temperature-Min PCB Contact Pattern PCB Contact Row Spacing Part Life Cycle Code Rohs Code Terminal Pitch Termination Type

2.5 OZ. AVG. INSERTION FORCE 2

4 hits Apply

1.3 inch 4

4 hits Apply

0.165 inch 4

4 hits Apply

1.3 inch 4

4 hits Apply

13X13 4

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SN-PB ON NI 2 TIN LEAD OVER NICKEL 1

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TIN LEAD OVER NICKEL 2 Tin/Lead (Sn/Pb) - with Nickel (Ni) barrier 2

4 hits Apply

Contact Material (2)

BE-CU 2 BERYLLIUM COPPER ALLOY 1

4 hits Apply

RND PIN-SKT 4

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IC SOCKET 4

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PGA169 4

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GLASS FILLED THERMOPLASTIC 2 POLYPHENYLENE SULFIDE 2

4 hits Apply

e0 4

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Manufacturer (1)

Advanced Interconnections Corp 4

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0.1 inch 4

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STRAIGHT 4

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Number of Contacts (1)

169 4

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260.0 °C 2

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-60.0 °C 2

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RECTANGULAR 4

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100 µm 4

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Obsolete 4

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No 3

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Terminal Pitch (1)

2.54 mm 4

4 hits Apply

SOLDER 4

4 hits Apply