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1-HCS050-29TT
Advanced Interconnections Corp
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Check for Price | No | Obsolete | 50 | BE-CU | 2.54 mm | IC SOCKET | PGA50 | 2.5 OZ. AVG. INSERTION FORCE | e0 | 260 °C | -60 °C | 14X14 | SN-PB ON NI | Tin/Lead (Sn/Pb) - with Nickel (Ni) barrier | RND PIN-SKT | GLASS FILLED THERMOPLASTIC | 0.1 inch | STRAIGHT | RECTANGULAR | 100 µm | SOLDER | 0.165 inch | 1.4 inch | 1.4 inch | ADVANCED INTERCONNECTIONS CORP | compliant | EAR99 | 8536.69.40.40 | ||
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HCS050-29TT
Advanced Interconnections Corp
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Check for Price | No | Obsolete | 50 | BE-CU | 2.54 mm | IC SOCKET | PGA50 | 2.5 OZ. AVG. INSERTION FORCE | e0 | 260 °C | -60 °C | 14X14 | SN-PB ON NI | Tin/Lead (Sn/Pb) - with Nickel (Ni) barrier | RND PIN-SKT | GLASS FILLED THERMOPLASTIC | 0.1 inch | STRAIGHT | RECTANGULAR | 100 µm | SOLDER | 0.165 inch | 1.4 inch | 1.4 inch | ADVANCED INTERCONNECTIONS CORP | compliant | EAR99 | 8536.69.40.40 | ||
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2-HCS050-29TT
Advanced Interconnections Corp
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Check for Price | No | Obsolete | 50 | BE-CU | 2.54 mm | IC SOCKET | PGA50 | 2.5 OZ. AVG. INSERTION FORCE | e0 | 260 °C | -60 °C | 14X14 | SN-PB ON NI | Tin/Lead (Sn/Pb) - with Nickel (Ni) barrier | RND PIN-SKT | GLASS FILLED THERMOPLASTIC | 0.1 inch | STRAIGHT | RECTANGULAR | 100 µm | SOLDER | 0.165 inch | 1.4 inch | 1.4 inch | ADVANCED INTERCONNECTIONS CORP | compliant | EAR99 | 8536.69.40.40 |