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HCPL-5530#200
Broadcom Limited
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Check for Price | No | Active | 20 mA | 1.9 V | 2 | NO | THROUGH HOLE MOUNT | 8 mA | 1.5 kV | 0.4 MBps | 0.0125 | HIGH RELIABILITY | COMPLEX | 9 % | LOGIC IC OUTPUT OPTOCOUPLER | 50 mW | 6 µs | 2 V | 125 °C | -55 °C | 2 | BROADCOM INC | DIP-8 | compliant | 3A001.A.2.C | 8541.40.80.00 | IC Outputs | |||||
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HCPL-5530#200
Avago Technologies
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Check for Price | Yes | No | Active | 20 mA | 1.9 V | 2 | NO | THROUGH HOLE MOUNT | 8 mA | 1.5 kV | 0.4 MBps | 0.0125 | HIGH RELIABILITY | COMPLEX | 9 % | LOGIC IC OUTPUT OPTOCOUPLER | 50 mW | 6 µs | 2 V | 125 °C | -55 °C | 2 | AVAGO TECHNOLOGIES INC | HERMETIC SEALED, CERAMIC, DIP-8 | compliant | 3A001.A.2.C | 8541.40.80.00 | IC Outputs | ||||
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HCPL-5530#200
Agilent Technologies Inc
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Check for Price | No | Transferred | 20 mA | 1.9 V | 2 | NO | THROUGH HOLE MOUNT | 8 mA | 1.5 kV | 0.4 MBps | 0.0125 | HIGH RELIABILITY | COMPLEX | 9 % | LOGIC IC OUTPUT OPTOCOUPLER | 50 mW | 6 µs | 2 V | e0 | 125 °C | -55 °C | 2 | Tin/Lead (Sn/Pb) | AGILENT TECHNOLOGIES INC | HERMETIC SEALED, CERAMIC, DIP-8 | unknown | 3A001.A.2.C | 8541.40.80.00 | IC Outputs | |||
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HCPL-5530#200
Hewlett Packard Co
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Check for Price | No | Transferred | 20 mA | 1.9 V | 2 | NO | THROUGH HOLE MOUNT | 8 mA | 1.5 kV | 0.4 MBps | 0.0125 | OPEN COLLECTOR, HIGH RELIABILITY | SEPARATE, 2 CHANNELS | 9 % | LOGIC IC OUTPUT OPTOCOUPLER | 50 mW | 6 µs | 2 V | e0 | 125 °C | -55 °C | 2 | Tin/Lead (Sn/Pb) | HEWLETT PACKARD CO | HERMETIC SEALED, DIP-8 | unknown | 3A001.A.2.C | 8541.40.80.00 | IC Outputs |