Parametric results for: HCPL-0870 under Other Interface ICs
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HCPL-0870
Broadcom Limited
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Check for Price | No | Obsolete | 5 V | INTERFACE CIRCUIT | 1 | 5.5 V | 4.5 V | YES | INDUSTRIAL | R-PDSO-G16 | Not Qualified | e0 | 85 °C | -40 °C | 16 | PLASTIC/EPOXY | SOP | RECTANGULAR | SMALL OUTLINE | TIN LEAD | GULL WING | 1.27 mm | DUAL | 10.21 mm | 2.586 mm | 7.544 mm | BROADCOM INC | SO-16 | unknown | 8542.39.00.01 | ||||||
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HCPL-0870
Avago Technologies
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Check for Price | No | No | Obsolete | 5 V | INTERFACE CIRCUIT | 1 | 5.5 V | 4.5 V | YES | INDUSTRIAL | R-PDSO-G16 | Not Qualified | e0 | 85 °C | -40 °C | 16 | PLASTIC/EPOXY | SOP | RECTANGULAR | SMALL OUTLINE | TIN LEAD | GULL WING | 1.27 mm | DUAL | 10.21 mm | 2.586 mm | 7.544 mm | AVAGO TECHNOLOGIES INC | SOP, | compliant | 8542.39.00.01 | SOIC | 16 | |||
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HCPL-0870#500
Broadcom Limited
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Check for Price | No | Obsolete | 5 V | INTERFACE CIRCUIT | 1 | 5.5 V | 4.5 V | YES | INDUSTRIAL | R-PDSO-G16 | Not Qualified | e0 | 85 °C | -40 °C | 245 | 16 | PLASTIC/EPOXY | SOP | RECTANGULAR | SMALL OUTLINE | TIN LEAD | GULL WING | 1.27 mm | DUAL | 10.21 mm | 2.586 mm | 7.544 mm | BROADCOM LTD | SOP, | compliant | 8542.39.00.01 | |||||
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HCPL-0870#500
Hewlett Packard Co
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Check for Price | Transferred | 5 V | INTERFACE CIRCUIT | 1 | 5.5 V | 4.5 V | YES | INDUSTRIAL | R-PDSO-G16 | Not Qualified | 85 °C | -40 °C | 16 | PLASTIC/EPOXY | RECTANGULAR | SMALL OUTLINE | GULL WING | DUAL | HEWLETT PACKARD CO | , | unknown | 8542.39.00.01 | SOIC | 16 | ||||||||||||
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HCPL-0870
Agilent Technologies Inc
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Check for Price | No | Transferred | 5 V | INTERFACE CIRCUIT | 1 | 5.5 V | 4.5 V | YES | INDUSTRIAL | R-PDSO-G16 | Not Qualified | e0 | 85 °C | -40 °C | 16 | PLASTIC/EPOXY | SOP | RECTANGULAR | SMALL OUTLINE | Tin/Lead (Sn/Pb) | GULL WING | 1.27 mm | DUAL | 10.21 mm | 2.586 mm | 7.544 mm | AGILENT TECHNOLOGIES INC | SOP, | unknown | 8542.39.00.01 | SOIC | 16 | ||||
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HCPL-0870#500
Agilent Technologies Inc
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Check for Price | No | Transferred | 5 V | INTERFACE CIRCUIT | 1 | 5.5 V | 4.5 V | YES | INDUSTRIAL | R-PDSO-G16 | Not Qualified | e0 | 85 °C | -40 °C | 16 | PLASTIC/EPOXY | SOP | RECTANGULAR | SMALL OUTLINE | Tin/Lead (Sn/Pb) | GULL WING | 1.27 mm | DUAL | 10.21 mm | 2.586 mm | 7.544 mm | AGILENT TECHNOLOGIES INC | SOP, | unknown | 8542.39.00.01 | SOIC | 16 | ||||
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HCPL-0870
Hewlett Packard Co
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Check for Price | No | Transferred | 5 V | INTERFACE CIRCUIT | 1 | 5.5 V | 4.5 V | YES | INDUSTRIAL | R-PDSO-G16 | Not Qualified | e0 | 85 °C | -40 °C | 16 | PLASTIC/EPOXY | RECTANGULAR | SMALL OUTLINE | Tin/Lead (Sn/Pb) | GULL WING | DUAL | HEWLETT PACKARD CO | , | unknown | 8542.39.00.01 | SOIC | 16 | |||||||||
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HCPL-0870#500
Avago Technologies
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Check for Price | No | No | Obsolete | 5 V | INTERFACE CIRCUIT | 1 | 5.5 V | 4.5 V | YES | INDUSTRIAL | R-PDSO-G16 | Not Qualified | e0 | 85 °C | -40 °C | 245 | 16 | PLASTIC/EPOXY | SOP | RECTANGULAR | SMALL OUTLINE | TIN LEAD | GULL WING | 1.27 mm | DUAL | 10.21 mm | 2.586 mm | 7.544 mm | AVAGO TECHNOLOGIES INC | SOP, | compliant | 8542.39.00.01 | SOIC | 16 |