Parametric results for: HCIS157-01GG under Sockets and Chip Carriers

All Filters Additional Feature Body Breadth Body Depth Body Length Contact Configuration Contact Finish Mating Contact Finish Termination Contact Material Contact Style Device Socket Type Device Type Used On Housing Material JESD-609 Code Manufacturer Mating Contact Pitch Mounting Style Number of Contacts Operating Temperature-Max Operating Temperature-Min PCB Contact Pattern PCB Contact Row Spacing Part Life Cycle Code Rohs Code Terminal Pitch Termination Type

1.0 OZ. AVG. INSERTION FORCE 1

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1.7 inch 1

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0.165 inch 1

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1.7 inch 1

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17X17 1

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AU ON NI 1

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Gold (Au) - with Nickel (Ni) barrier 1

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Contact Material (1)

BE-CU 1

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RND PIN-SKT 1

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IC SOCKET 1

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PGA157 1

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GLASS FILLED THERMOPLASTIC 1

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e4 1

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Manufacturer (1)

Advanced Interconnections Corp 1

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0.1 inch 1

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STRAIGHT 1

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Number of Contacts (1)

157 1

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260.0 °C 1

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-60.0 °C 1

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RECTANGULAR 1

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100 µm 1

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Obsolete 1

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No 1

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Terminal Pitch (1)

2.54 mm 1

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SOLDER 1

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