Parametric results for: GX1-266B-85-1.8 under Microprocessors

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Manufacturer Part Number: gx1266b8518
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GX1-266B-85-1.8
Rochester Electronics LLC
GX1-266B-85-1.8
AMD
GX1-266B-85-1.8
Texas Instruments
GX1-266B-85-1.8
National Semiconductor Corporation
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Rohs Code
Part Life Cycle Code
Bit Size Speed External Data Bus Width
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Surface Mount
Supply Voltage-Nom uPs/uCs/Peripheral ICs Type
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Supply Voltage-Max
Supply Voltage-Min
Temperature Grade
JESD-30 Code
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JESD-609 Code
Moisture Sensitivity Level
Operating Temperature-Max
Peak Reflow Temperature (Cel)
Time@Peak Reflow Temperature-Max (s)
Number of Terminals
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Package Style
Terminal Finish
Terminal Form
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Active 266 MHz 32 32 33 MHz YES 1.8 V MICROPROCESSOR CMOS YES FLOATING POINT YES YES 1.89 V 1.71 V OTHER S-PBGA-B352 COMMERCIAL 85 °C 352 PLASTIC/EPOXY BGA SQUARE GRID ARRAY BALL 1.27 mm BOTTOM 1.75 mm 35 mm 35 mm ROCHESTER ELECTRONICS INC BGA BGA, 352 unknown
Obsolete 32 266 MHz 32 32 33 MHz YES 1.8 V MICROPROCESSOR CMOS YES FLOATING POINT YES YES 1.89 V 1.71 V OTHER S-PBGA-B352 Not Qualified 85 °C 352 PLASTIC/EPOXY BGA BGA352,26X26,50 SQUARE GRID ARRAY BALL 1.27 mm BOTTOM 1.75 mm 35 mm 35 mm ADVANCED MICRO DEVICES INC BGA EBGA-352 352 compliant 3A991.A.2 8542.31.00.01
No Transferred 32 266 MHz 32 32 33 MHz YES 1.8 V MICROPROCESSOR CMOS YES FLOATING POINT YES YES 1.89 V 1.71 V OTHER S-PBGA-B352 Not Qualified e0 3 85 °C 220 30 352 PLASTIC/EPOXY BGA BGA352,26X26,50 SQUARE GRID ARRAY TIN LEAD BALL 1.27 mm BOTTOM 2.23 mm 35 mm 35 mm NATIONAL SEMICONDUCTOR CORP BGA BGA, BGA352,26X26,50 352 compliant 3A991.A.2 8542.31.00.01
No Transferred 32 266 MHz 32 32 33 MHz YES 1.8 V MICROPROCESSOR CMOS YES FLOATING POINT YES YES 1.89 V 1.71 V OTHER S-PBGA-B352 Not Qualified e0 3 85 °C 220 30 352 PLASTIC/EPOXY BGA BGA352,26X26,50 SQUARE GRID ARRAY TIN LEAD BALL 1.27 mm BOTTOM 2.23 mm 35 mm 35 mm NATIONAL SEMICONDUCTOR CORP BGA-352 not_compliant
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GX1-266B-85-1.8
Rochester Electronics LLC
Check for Price Active 266 MHz 32 32 33 MHz YES 1.8 V MICROPROCESSOR CMOS YES FLOATING POINT YES YES 1.89 V 1.71 V OTHER S-PBGA-B352 COMMERCIAL 85 °C 352 PLASTIC/EPOXY BGA SQUARE GRID ARRAY BALL 1.27 mm BOTTOM 1.75 mm 35 mm 35 mm ROCHESTER ELECTRONICS INC BGA BGA, 352 unknown
GX1-266B-85-1.8
AMD
Check for Price Obsolete 32 266 MHz 32 32 33 MHz YES 1.8 V MICROPROCESSOR CMOS YES FLOATING POINT YES YES 1.89 V 1.71 V OTHER S-PBGA-B352 Not Qualified 85 °C 352 PLASTIC/EPOXY BGA BGA352,26X26,50 SQUARE GRID ARRAY BALL 1.27 mm BOTTOM 1.75 mm 35 mm 35 mm ADVANCED MICRO DEVICES INC BGA EBGA-352 352 compliant 3A991.A.2 8542.31.00.01
GX1-266B-85-1.8
Texas Instruments
Check for Price No Transferred 32 266 MHz 32 32 33 MHz YES 1.8 V MICROPROCESSOR CMOS YES FLOATING POINT YES YES 1.89 V 1.71 V OTHER S-PBGA-B352 Not Qualified e0 3 85 °C 220 30 352 PLASTIC/EPOXY BGA BGA352,26X26,50 SQUARE GRID ARRAY TIN LEAD BALL 1.27 mm BOTTOM 2.23 mm 35 mm 35 mm NATIONAL SEMICONDUCTOR CORP BGA BGA, BGA352,26X26,50 352 compliant 3A991.A.2 8542.31.00.01
GX1-266B-85-1.8
National Semiconductor Corporation
Check for Price No Transferred 32 266 MHz 32 32 33 MHz YES 1.8 V MICROPROCESSOR CMOS YES FLOATING POINT YES YES 1.89 V 1.71 V OTHER S-PBGA-B352 Not Qualified e0 3 85 °C 220 30 352 PLASTIC/EPOXY BGA BGA352,26X26,50 SQUARE GRID ARRAY TIN LEAD BALL 1.27 mm BOTTOM 2.23 mm 35 mm 35 mm NATIONAL SEMICONDUCTOR CORP BGA-352 not_compliant