Findchips: Parametric Search Results for GT28F016C3B110


Select Parts		Part Number

		GT28F016C3BA90 Numonyx Memory Solutions
		GT28F016C3BA110 Numonyx Memory Solutions
		GT28F016C3BA90 Intel Corporation
		GT28F016C3BA110 Intel Corporation

			Most Relevant						Technical																					Compliance			Operating Conditions		Physical											Dimensions			Other
Composite Price	Rohs Code	Part Life Cycle Code	Memory Density	Memory Width	Sector Size	Organization	Supply Voltage-Nom (Vsup)	Access Time-Max	Memory IC Type	Additional Feature	Boot Block	Command User Interface	Common Flash Interface	Data Polling	Number of Functions	Number of Sectors/Size	Number of Words Code	Number of Words	Operating Mode	Parallel/Serial	Programming Voltage	Standby Current-Max	Supply Current-Max	Supply Voltage-Max (Vsup)	Supply Voltage-Min (Vsup)	Technology	Temperature Grade	Toggle Bit	Type	JESD-30 Code	Qualification Status	JESD-609 Code	Operating Temperature-Max	Operating Temperature-Min	Number of Terminals	Package Body Material	Package Code	Package Equivalence Code	Package Shape	Package Style	Surface Mount	Terminal Finish	Terminal Form	Terminal Pitch	Terminal Position	Seated Height-Max	Length	Width	Ihs Manufacturer	Part Package Code	Package Description	Pin Count	Reach Compliance Code	ECCN Code	HTS Code

Check for Price

Obsolete

16.7772 Mbit

2MX8

3 V

90 ns

FLASH

MINIMUM 100,000 BLOCK ERASE CYCLES; BOTTOM BOOT BLOCK

BOTTOM

2000000

2.0972 M

ASYNCHRONOUS

PARALLEL

3 V

3.6 V

2.7 V

CMOS

INDUSTRIAL

NOR TYPE

R-PBGA-B48

Not Qualified

85 °C

-40 °C

PLASTIC/EPOXY

VFBGA

RECTANGULAR

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

YES

BALL

750 µm

BOTTOM

1 mm

9.81 mm

7.58 mm

NUMONYX

BGA

CSP, MICRO, BGA-48

unknown

EAR99

8542.32.00.51

Check for Price

Obsolete

16.7772 Mbit

2MX8

3 V

110 ns

FLASH

MINIMUM 100,000 BLOCK ERASE CYCLES; BOTTOM BOOT BLOCK

BOTTOM

2000000

2.0972 M

ASYNCHRONOUS

PARALLEL

3 V

3.6 V

2.7 V

CMOS

INDUSTRIAL

NOR TYPE

R-PBGA-B48

Not Qualified

85 °C

-40 °C

PLASTIC/EPOXY

VFBGA

RECTANGULAR

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

YES

BALL

750 µm

BOTTOM

1 mm

9.81 mm

7.58 mm

NUMONYX

BGA

CSP, MICRO, BGA-48

unknown

EAR99

8542.32.00.51

Check for Price

Transferred

16.7772 Mbit

8K,64K

2MX8

3 V

90 ns

FLASH

MINIMUM 100,000 BLOCK ERASE CYCLES; BOTTOM BOOT BLOCK

BOTTOM

YES

8,31

2000000

2.0972 M

ASYNCHRONOUS

PARALLEL

3 V

5 µA

55 µA

3.6 V

2.7 V

CMOS

INDUSTRIAL

NOR TYPE

R-PBGA-B48

Not Qualified

85 °C

-40 °C

PLASTIC/EPOXY

VFBGA

BGA46,6X8,30

RECTANGULAR

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

YES

Tin/Lead (Sn/Pb)

BALL

750 µm

BOTTOM

1 mm

9.81 mm

7.58 mm

INTEL CORP

BGA

CSP, MICRO, BGA-48

unknown

EAR99

8542.32.00.51

Check for Price

Transferred

16.7772 Mbit

8K,64K

2MX8

3 V

110 ns

FLASH

MINIMUM 100,000 BLOCK ERASE CYCLES; BOTTOM BOOT BLOCK

BOTTOM

YES

8,31

2000000

2.0972 M

ASYNCHRONOUS

PARALLEL

3 V

5 µA

55 µA

3.6 V

2.7 V

CMOS

INDUSTRIAL

NOR TYPE

R-PBGA-B48

Not Qualified

85 °C

-40 °C

PLASTIC/EPOXY

VFBGA

BGA46,6X8,30

RECTANGULAR

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

YES

Tin/Lead (Sn/Pb)

BALL

750 µm

BOTTOM

1 mm

9.81 mm

7.58 mm

INTEL CORP

BGA

VFBGA, BGA46,6X8,30

unknown

EAR99

8542.32.00.51

Compare

GT28F016C3BA90

Numonyx Memory Solutions

Check for Price

Obsolete

16.7772 Mbit

2MX8

3 V

90 ns

FLASH

MINIMUM 100,000 BLOCK ERASE CYCLES; BOTTOM BOOT BLOCK

BOTTOM

2000000

2.0972 M

ASYNCHRONOUS

PARALLEL

3 V

3.6 V

2.7 V

CMOS

INDUSTRIAL

NOR TYPE

R-PBGA-B48

Not Qualified

85 °C

-40 °C

PLASTIC/EPOXY

VFBGA

RECTANGULAR

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

YES

BALL

750 µm

BOTTOM

1 mm

9.81 mm

7.58 mm

NUMONYX

BGA

CSP, MICRO, BGA-48

unknown

EAR99

8542.32.00.51

GT28F016C3BA110

Numonyx Memory Solutions

Check for Price

Obsolete

16.7772 Mbit

2MX8

3 V

110 ns

FLASH

MINIMUM 100,000 BLOCK ERASE CYCLES; BOTTOM BOOT BLOCK

BOTTOM

2000000

2.0972 M

ASYNCHRONOUS

PARALLEL

3 V

3.6 V

2.7 V

CMOS

INDUSTRIAL

NOR TYPE

R-PBGA-B48

Not Qualified

85 °C

-40 °C

PLASTIC/EPOXY

VFBGA

RECTANGULAR

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

YES

BALL

750 µm

BOTTOM

1 mm

9.81 mm

7.58 mm

NUMONYX

BGA

CSP, MICRO, BGA-48

unknown

EAR99

8542.32.00.51

GT28F016C3BA90

Intel Corporation

Check for Price

Transferred

16.7772 Mbit

8K,64K

2MX8

3 V

90 ns

FLASH

MINIMUM 100,000 BLOCK ERASE CYCLES; BOTTOM BOOT BLOCK

BOTTOM

YES

8,31

2000000

2.0972 M

ASYNCHRONOUS

PARALLEL

3 V

5 µA

55 µA

3.6 V

2.7 V

CMOS

INDUSTRIAL

NOR TYPE

R-PBGA-B48

Not Qualified

85 °C

-40 °C

PLASTIC/EPOXY

VFBGA

BGA46,6X8,30

RECTANGULAR

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

YES

Tin/Lead (Sn/Pb)

BALL

750 µm

BOTTOM

1 mm

9.81 mm

7.58 mm

INTEL CORP

BGA

CSP, MICRO, BGA-48

unknown

EAR99

8542.32.00.51

GT28F016C3BA110

Intel Corporation

Check for Price

Transferred

16.7772 Mbit

8K,64K

2MX8

3 V

110 ns

FLASH

MINIMUM 100,000 BLOCK ERASE CYCLES; BOTTOM BOOT BLOCK

BOTTOM

YES

8,31

2000000

2.0972 M

ASYNCHRONOUS

PARALLEL

3 V

5 µA

55 µA

3.6 V

2.7 V

CMOS

INDUSTRIAL

NOR TYPE

R-PBGA-B48

Not Qualified

85 °C

-40 °C

PLASTIC/EPOXY

VFBGA

BGA46,6X8,30

RECTANGULAR

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

YES

Tin/Lead (Sn/Pb)

BALL

750 µm

BOTTOM

1 mm

9.81 mm

7.58 mm

INTEL CORP

BGA

VFBGA, BGA46,6X8,30

unknown

EAR99

8542.32.00.51

Parametric results for: GT28F016C3B110 under Flash Memories