Findchips: Parametric Search Results for GS8170DW72AGC-250


Select Parts		Part Number

		GS8170DW72AGC-250T GSI Technology
		GS8170DW72AGC-250IT GSI Technology
		GS8170DW72AGC-250 GSI Technology
		GS8170DW72AGC-250I GSI Technology

				Most Relevant					Technical											Compliance			Operating Conditions				Physical										Dimensions			Other
Composite Price	Pbfree Code	Rohs Code	Part Life Cycle Code	Memory Density	Memory Width	Organization	Supply Voltage-Nom (Vsup)	Access Time-Max	Memory IC Type	Additional Feature	Number of Functions	Number of Words Code	Number of Words	Operating Mode	Parallel/Serial	Supply Voltage-Max (Vsup)	Supply Voltage-Min (Vsup)	Technology	Temperature Grade	JESD-30 Code	Qualification Status	JESD-609 Code	Moisture Sensitivity Level	Operating Temperature-Max	Operating Temperature-Min	Peak Reflow Temperature (Cel)	Number of Terminals	Package Body Material	Package Code	Package Shape	Package Style	Surface Mount	Terminal Finish	Terminal Form	Terminal Pitch	Terminal Position	Seated Height-Max	Length	Width	Ihs Manufacturer	Part Package Code	Package Description	Pin Count	Reach Compliance Code	ECCN Code	HTS Code

Check for Price

Yes

Obsolete

18.8744 Mbit

256KX72

1.8 V

2.1 ns

STANDARD SRAM

PIPELINED ARCHITECTURE

256000

262.144 k

SYNCHRONOUS

PARALLEL

1.95 V

1.7 V

CMOS

COMMERCIAL

R-PBGA-B209

Not Qualified

70 °C

260

209

PLASTIC/EPOXY

LBGA

RECTANGULAR

GRID ARRAY, LOW PROFILE

YES

TIN SILVER COPPER

BALL

1 mm

BOTTOM

1.7 mm

22 mm

14 mm

GSI TECHNOLOGY

BGA

14 X 22 MM, 1 MM PITCH, LEAD FREE, BGA-209

209

compliant

3A991.B.2.A

8542.32.00.41

Check for Price

Yes

Obsolete

18.8744 Mbit

256KX72

1.8 V

2.1 ns

STANDARD SRAM

PIPELINED ARCHITECTURE

256000

262.144 k

SYNCHRONOUS

PARALLEL

1.95 V

1.7 V

CMOS

INDUSTRIAL

R-PBGA-B209

Not Qualified

85 °C

-40 °C

260

209

PLASTIC/EPOXY

LBGA

RECTANGULAR

GRID ARRAY, LOW PROFILE

YES

TIN SILVER COPPER

BALL

1 mm

BOTTOM

1.7 mm

22 mm

14 mm

GSI TECHNOLOGY

BGA

14 X 22 MM, 1 MM PITCH, LEAD FREE, BGA-209

209

compliant

3A991.B.2.A

8542.32.00.41

Check for Price

Yes

Obsolete

18.8744 Mbit

256KX72

1.8 V

2.1 ns

STANDARD SRAM

PIPELINED ARCHITECTURE

256000

262.144 k

SYNCHRONOUS

PARALLEL

1.95 V

1.7 V

CMOS

COMMERCIAL

R-PBGA-B209

Not Qualified

70 °C

260

209

PLASTIC/EPOXY

LBGA

RECTANGULAR

GRID ARRAY, LOW PROFILE

YES

TIN SILVER COPPER

BALL

1 mm

BOTTOM

1.7 mm

22 mm

14 mm

GSI TECHNOLOGY

BGA

14 X 22 MM, 1 MM PITCH, LEAD FREE, BGA-209

209

compliant

3A991.B.2.B

8542.32.00.41

Check for Price

Yes

Obsolete

18.8744 Mbit

256KX72

1.8 V

2.1 ns

STANDARD SRAM

PIPELINED ARCHITECTURE

256000

262.144 k

SYNCHRONOUS

PARALLEL

1.95 V

1.7 V

CMOS

INDUSTRIAL

R-PBGA-B209

Not Qualified

85 °C

-40 °C

260

209

PLASTIC/EPOXY

LBGA

RECTANGULAR

GRID ARRAY, LOW PROFILE

YES

TIN SILVER COPPER

BALL

1 mm

BOTTOM

1.7 mm

22 mm

14 mm

GSI TECHNOLOGY

BGA

14 X 22 MM, 1 MM PITCH, LEAD FREE, BGA-209

209

compliant

3A991.B.2.B

8542.32.00.41

Compare

GS8170DW72AGC-250T

GSI Technology

Check for Price

Yes

Obsolete

18.8744 Mbit

256KX72

1.8 V

2.1 ns

STANDARD SRAM

PIPELINED ARCHITECTURE

256000

262.144 k

SYNCHRONOUS

PARALLEL

1.95 V

1.7 V

CMOS

COMMERCIAL

R-PBGA-B209

Not Qualified

70 °C

260

209

PLASTIC/EPOXY

LBGA

RECTANGULAR

GRID ARRAY, LOW PROFILE

YES

TIN SILVER COPPER

BALL

1 mm

BOTTOM

1.7 mm

22 mm

14 mm

GSI TECHNOLOGY

BGA

14 X 22 MM, 1 MM PITCH, LEAD FREE, BGA-209

209

compliant

3A991.B.2.A

8542.32.00.41

GS8170DW72AGC-250IT

GSI Technology

Check for Price

Yes

Obsolete

18.8744 Mbit

256KX72

1.8 V

2.1 ns

STANDARD SRAM

PIPELINED ARCHITECTURE

256000

262.144 k

SYNCHRONOUS

PARALLEL

1.95 V

1.7 V

CMOS

INDUSTRIAL

R-PBGA-B209

Not Qualified

85 °C

-40 °C

260

209

PLASTIC/EPOXY

LBGA

RECTANGULAR

GRID ARRAY, LOW PROFILE

YES

TIN SILVER COPPER

BALL

1 mm

BOTTOM

1.7 mm

22 mm

14 mm

GSI TECHNOLOGY

BGA

14 X 22 MM, 1 MM PITCH, LEAD FREE, BGA-209

209

compliant

3A991.B.2.A

8542.32.00.41

GS8170DW72AGC-250

GSI Technology

Check for Price

Yes

Obsolete

18.8744 Mbit

256KX72

1.8 V

2.1 ns

STANDARD SRAM

PIPELINED ARCHITECTURE

256000

262.144 k

SYNCHRONOUS

PARALLEL

1.95 V

1.7 V

CMOS

COMMERCIAL

R-PBGA-B209

Not Qualified

70 °C

260

209

PLASTIC/EPOXY

LBGA

RECTANGULAR

GRID ARRAY, LOW PROFILE

YES

TIN SILVER COPPER

BALL

1 mm

BOTTOM

1.7 mm

22 mm

14 mm

GSI TECHNOLOGY

BGA

14 X 22 MM, 1 MM PITCH, LEAD FREE, BGA-209

209

compliant

3A991.B.2.B

8542.32.00.41

GS8170DW72AGC-250I

GSI Technology

Check for Price

Yes

Obsolete

18.8744 Mbit

256KX72

1.8 V

2.1 ns

STANDARD SRAM

PIPELINED ARCHITECTURE

256000

262.144 k

SYNCHRONOUS

PARALLEL

1.95 V

1.7 V

CMOS

INDUSTRIAL

R-PBGA-B209

Not Qualified

85 °C

-40 °C

260

209

PLASTIC/EPOXY

LBGA

RECTANGULAR

GRID ARRAY, LOW PROFILE

YES

TIN SILVER COPPER

BALL

1 mm

BOTTOM

1.7 mm

22 mm

14 mm

GSI TECHNOLOGY

BGA

14 X 22 MM, 1 MM PITCH, LEAD FREE, BGA-209

209

compliant

3A991.B.2.B

8542.32.00.41

Parametric results for: GS8170DW72AGC-250 under SRAMs