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Parametric » Drivers And Interfaces » Peripheral Drivers

Parametric results for: FPF2281BUCX-F130 under Peripheral Drivers

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Select Parts		Part Number

		FPF2281BUCX-F130 onsemi
		FPF2281BUCX_F130 onsemi
		FPF2281BUCX_F130 Fairchild Semiconductor Corporation

				Technical							Compliance	Operating Conditions					Physical									Dimensions			Other
Composite Price	Pbfree Code	Rohs Code	Part Life Cycle Code	Analog IC - Other Type	Number of Channels	Number of Functions	Supply Voltage-Max (Vsup)	Supply Voltage-Min (Vsup)	Supply Voltage-Nom (Vsup)	Surface Mount	JESD-30 Code	Moisture Sensitivity Level	Operating Temperature-Max	Operating Temperature-Min	Peak Reflow Temperature (Cel)	Time@Peak Reflow Temperature-Max (s)	Number of Terminals	Package Body Material	Package Code	Package Equivalence Code	Package Shape	Package Style	Terminal Form	Terminal Pitch	Terminal Position	Length	Seated Height-Max	Width	Ihs Manufacturer	Package Description	Manufacturer Package Code	Reach Compliance Code	ECCN Code	HTS Code	Date Of Intro	Samacsys Manufacturer	Adjustable Threshold	Threshold Voltage-Nom	Part Package Code	Pin Count

Yes

Active

POWER SUPPLY SUPPORT CIRCUIT

1

1

25 V

2.5 V

5 V

YES

R-PBGA-B12

1

85 °C

-40 °C

12

PLASTIC/EPOXY

VFBGA

BGA12,3X4,16

RECTANGULAR

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

BALL

400 µm

BOTTOM

1.828 mm

625 µm

1.288 mm

ONSEMI

WLCSP-12

567QX

compliant

EAR99

8542.39.00.01

2017-11-06

onsemi

NO

+1.2V

Check for Price

Yes

Active

POWER SUPPLY SUPPORT CIRCUIT

1

1

25 V

2.5 V

5 V

YES

R-XBGA-B12

1

85 °C

-40 °C

260

30

12

UNSPECIFIED

VFBGA

BGA12,3X4,16

RECTANGULAR

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

BALL

400 µm

BOTTOM

1.828 mm

625 µm

1.288 mm

ON SEMICONDUCTOR

VFBGA, BGA12,3X4,16

compliant

EAR99

8542.39.00.01

onsemi

YES

+1.2V

Check for Price

Yes

Yes

Transferred

POWER SUPPLY SUPPORT CIRCUIT

1

1

25 V

2.5 V

5 V

YES

R-XBGA-B12

85 °C

-40 °C

12

UNSPECIFIED

VFBGA

BGA12,3X4,16

RECTANGULAR

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

BALL

400 µm

BOTTOM

1.828 mm

625 µm

1.288 mm

FAIRCHILD SEMICONDUCTOR CORP

VFBGA, BGA12,3X4,16

12BALL WLCSP, 3X4 ARRAY, 0.4MM PITCH, 250UM BALL

compliant

EAR99

8542.39.00.01

YES

1.2

CSP

12

Compare

FPF2281BUCX-F130

onsemi

Yes

Active

POWER SUPPLY SUPPORT CIRCUIT

1

1

25 V

2.5 V

5 V

YES

R-PBGA-B12

1

85 °C

-40 °C

12

PLASTIC/EPOXY

VFBGA

BGA12,3X4,16

RECTANGULAR

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

BALL

400 µm

BOTTOM

1.828 mm

625 µm

1.288 mm

ONSEMI

WLCSP-12

567QX

compliant

EAR99

8542.39.00.01

2017-11-06

onsemi

NO

+1.2V

FPF2281BUCX_F130

onsemi

Check for Price

Yes

Active

POWER SUPPLY SUPPORT CIRCUIT

1

1

25 V

2.5 V

5 V

YES

R-XBGA-B12

1

85 °C

-40 °C

260

30

12

UNSPECIFIED

VFBGA

BGA12,3X4,16

RECTANGULAR

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

BALL

400 µm

BOTTOM

1.828 mm

625 µm

1.288 mm

ON SEMICONDUCTOR

VFBGA, BGA12,3X4,16

compliant

EAR99

8542.39.00.01

onsemi

YES

+1.2V

FPF2281BUCX_F130

Fairchild Semiconductor Corporation

Check for Price

Yes

Yes

Transferred

POWER SUPPLY SUPPORT CIRCUIT

1

1

25 V

2.5 V

5 V

YES

R-XBGA-B12

85 °C

-40 °C

12

UNSPECIFIED

VFBGA

BGA12,3X4,16

RECTANGULAR

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

BALL

400 µm

BOTTOM

1.828 mm

625 µm

1.288 mm

FAIRCHILD SEMICONDUCTOR CORP

VFBGA, BGA12,3X4,16

12BALL WLCSP, 3X4 ARRAY, 0.4MM PITCH, 250UM BALL

compliant

EAR99

8542.39.00.01

YES

1.2

CSP

12