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F1240NBGI
Integrated Device Technology Inc
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$11.2092 | Yes | Yes | Transferred | 5 V | TELECOM CIRCUIT | 1 | S-XQCC-N32 | e3 | 1 | 260 | 32 | UNSPECIFIED | HVQCCN | SQUARE | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE | YES | TIN | NO LEAD | 500 µm | QUAD | 5 mm | 5 mm | 800 µm | INTEGRATED DEVICE TECHNOLOGY INC | VFQFPN | QFN-32 | 32 | NBG32P2 | compliant | EAR99 | 8542.33.00.01 | |||
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F1240NBGI
Renesas Electronics Corporation
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$13.5292 | Yes | Yes | Active | 5 V | TELECOM CIRCUIT | 1 | S-XQCC-N32 | e3 | 1 | 260 | 32 | UNSPECIFIED | HVQCCN | SQUARE | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE | YES | MATTE TIN | NO LEAD | 500 µm | QUAD | 5 mm | 5 mm | 800 µm | RENESAS ELECTRONICS CORP | VFQFPN | 32 | NBG32P2 | compliant | NLR | 8542330001 | Renesas Electronics | |||
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F1240NBGI8
Integrated Device Technology Inc
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Check for Price | Yes | Yes | Transferred | 5 V | TELECOM CIRCUIT | 1 | S-XQCC-N32 | e3 | 1 | 260 | 32 | UNSPECIFIED | HVQCCN | SQUARE | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE | YES | TIN | NO LEAD | 500 µm | QUAD | 5 mm | 5 mm | 800 µm | INTEGRATED DEVICE TECHNOLOGY INC | VFQFPN | QFN-32 | 32 | NBG32P2 | compliant | EAR99 | 8542.33.00.01 | |||
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F1240NBGI8
Renesas Electronics Corporation
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Check for Price | Yes | Yes | Active | 5 V | TELECOM CIRCUIT | 1 | S-XQCC-N32 | e3 | 1 | 260 | 32 | UNSPECIFIED | HVQCCN | SQUARE | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE | YES | MATTE TIN | NO LEAD | 500 µm | QUAD | 5 mm | 5 mm | 800 µm | RENESAS ELECTRONICS CORP | VFQFPN | 32 | NBG32P2 | compliant | NLR | 8542330001 | Renesas Electronics |