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Select Parts | Part Number |
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EPM570F256C3N
Altera Corporation
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EPM570F256C3
Altera Corporation
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EPM570F256C3
Intel Corporation
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EPM570F256C3N
Intel Corporation
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Most Relevant | Technical | Compliance | Operating Conditions | Physical | Dimensions | Other | ||||||||||||||||||||||||||||||||||||||||||||
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Composite Price
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Pbfree Code
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Rohs Code
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Part Life Cycle Code
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Supply Voltage-Nom | Propagation Delay | Number of Inputs | Number of Outputs | Number of Macro Cells | Number of I/O Lines |
Programmable Logic Type
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Temperature Grade
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Package Shape
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Technology | Organization |
Additional Feature
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Clock Frequency-Max
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In-System Programmable
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JTAG BST
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Output Function
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Supply Voltage-Max
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Supply Voltage-Min
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JESD-30 Code
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Qualification Status
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JESD-609 Code
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Moisture Sensitivity Level
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Operating Temperature-Max
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Peak Reflow Temperature (Cel)
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Time@Peak Reflow Temperature-Max (s)
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Number of Terminals
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Package Body Material
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Package Code
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Package Equivalence Code
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Package Shape
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Package Style
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Surface Mount
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Terminal Finish
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Terminal Form
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Terminal Pitch
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Terminal Position
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Width
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Length
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Seated Height-Max
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Ihs Manufacturer
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Part Package Code
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Package Description
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Pin Count
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Reach Compliance Code
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HTS Code
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ECCN Code
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Samacsys Manufacturer
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Yes | Yes | Transferred | 2.5 V | 5.4 ns | 440 | 160 | FLASH PLD | OTHER | SQUARE | CMOS | 0 DEDICATED INPUTS, 160 I/O | IT CAN ALSO OPERATE AT 3.3V | YES | YES | MACROCELL | 2.625 V | 2.375 V | S-PBGA-B256 | Not Qualified | e1 | 3 | 85 °C | 260 | 30 | 256 | PLASTIC/EPOXY | BGA | BGA256,16X16,40 | SQUARE | GRID ARRAY | YES | TIN SILVER COPPER | BALL | 1 mm | BOTTOM | 17 mm | 17 mm | 2.2 mm | ALTERA CORP | BGA | 17 X 17 MM, 1 MM PITCH, LEAD FREE, FBGA-256 | 256 | unknown | 8542.39.00.01 | ||||||
No | No | Transferred | 2.5 V | 5.4 ns | 440 | 160 | FLASH PLD | COMMERCIAL EXTENDED | SQUARE | CMOS | 0 DEDICATED INPUTS, 160 I/O | IT CAN ALSO OPERATE AT 3.3V | YES | YES | MACROCELL | 2.625 V | 2.375 V | S-PBGA-B256 | Not Qualified | e0 | 3 | 85 °C | 220 | 20 | 256 | PLASTIC/EPOXY | BGA | BGA256,16X16,40 | SQUARE | GRID ARRAY | YES | TIN LEAD | BALL | 1 mm | BOTTOM | 17 mm | 17 mm | 2.2 mm | ALTERA CORP | BGA | 17 X 17 MM, 1 MM PITCH, FBGA-256 | 256 | not_compliant | 8542.39.00.01 | ||||||
No | Active | 2.5 V | 5.4 ns | 160 | 160 | 440 | 160 | FLASH PLD | COMMERCIAL EXTENDED | SQUARE | CMOS | 0 DEDICATED INPUTS, 160 I/O | IT CAN ALSO OPERATE AT 3.3V | YES | YES | MACROCELL | 2.625 V | 2.375 V | S-PBGA-B256 | Not Qualified | e0 | 3 | 85 °C | 256 | PLASTIC/EPOXY | BGA | BGA256,16X16,40 | SQUARE | GRID ARRAY | YES | TIN LEAD | BALL | 1 mm | BOTTOM | 17 mm | 17 mm | 2.2 mm | INTEL CORP | 17 X 17 MM, 1 MM PITCH, FBGA-256 | compliant | 8542.39.00.01 | EAR99 | Intel | |||||||
Yes | Active | 2.5 V | 5.4 ns | 160 | 160 | 440 | 160 | FLASH PLD | OTHER | SQUARE | CMOS | 0 DEDICATED INPUTS, 160 I/O | IT CAN ALSO OPERATE AT 3.3V | 175.4 MHz | YES | YES | MACROCELL | 2.625 V | 2.375 V | S-PBGA-B256 | Not Qualified | e1 | 3 | 85 °C | 256 | PLASTIC/EPOXY | BGA | BGA256,16X16,40 | SQUARE | GRID ARRAY | YES | TIN SILVER COPPER | BALL | 1 mm | BOTTOM | 17 mm | 17 mm | 2.2 mm | INTEL CORP | FBGA-256 | compliant | 8542.39.00.01 | EAR99 | Intel |
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EPM570F256C3N
Altera Corporation
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$3.8247 | Yes | Yes | Transferred | 2.5 V | 5.4 ns | 440 | 160 | FLASH PLD | OTHER | SQUARE | CMOS | 0 DEDICATED INPUTS, 160 I/O | IT CAN ALSO OPERATE AT 3.3V | YES | YES | MACROCELL | 2.625 V | 2.375 V | S-PBGA-B256 | Not Qualified | e1 | 3 | 85 °C | 260 | 30 | 256 | PLASTIC/EPOXY | BGA | BGA256,16X16,40 | SQUARE | GRID ARRAY | YES | TIN SILVER COPPER | BALL | 1 mm | BOTTOM | 17 mm | 17 mm | 2.2 mm | ALTERA CORP | BGA | 17 X 17 MM, 1 MM PITCH, LEAD FREE, FBGA-256 | 256 | unknown | 8542.39.00.01 | |||||||
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EPM570F256C3
Altera Corporation
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$59.5302 | No | No | Transferred | 2.5 V | 5.4 ns | 440 | 160 | FLASH PLD | COMMERCIAL EXTENDED | SQUARE | CMOS | 0 DEDICATED INPUTS, 160 I/O | IT CAN ALSO OPERATE AT 3.3V | YES | YES | MACROCELL | 2.625 V | 2.375 V | S-PBGA-B256 | Not Qualified | e0 | 3 | 85 °C | 220 | 20 | 256 | PLASTIC/EPOXY | BGA | BGA256,16X16,40 | SQUARE | GRID ARRAY | YES | TIN LEAD | BALL | 1 mm | BOTTOM | 17 mm | 17 mm | 2.2 mm | ALTERA CORP | BGA | 17 X 17 MM, 1 MM PITCH, FBGA-256 | 256 | not_compliant | 8542.39.00.01 | |||||||
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EPM570F256C3
Intel Corporation
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Check for Price | No | Active | 2.5 V | 5.4 ns | 160 | 160 | 440 | 160 | FLASH PLD | COMMERCIAL EXTENDED | SQUARE | CMOS | 0 DEDICATED INPUTS, 160 I/O | IT CAN ALSO OPERATE AT 3.3V | YES | YES | MACROCELL | 2.625 V | 2.375 V | S-PBGA-B256 | Not Qualified | e0 | 3 | 85 °C | 256 | PLASTIC/EPOXY | BGA | BGA256,16X16,40 | SQUARE | GRID ARRAY | YES | TIN LEAD | BALL | 1 mm | BOTTOM | 17 mm | 17 mm | 2.2 mm | INTEL CORP | 17 X 17 MM, 1 MM PITCH, FBGA-256 | compliant | 8542.39.00.01 | EAR99 | Intel | ||||||||
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EPM570F256C3N
Intel Corporation
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Check for Price | Yes | Active | 2.5 V | 5.4 ns | 160 | 160 | 440 | 160 | FLASH PLD | OTHER | SQUARE | CMOS | 0 DEDICATED INPUTS, 160 I/O | IT CAN ALSO OPERATE AT 3.3V | 175.4 MHz | YES | YES | MACROCELL | 2.625 V | 2.375 V | S-PBGA-B256 | Not Qualified | e1 | 3 | 85 °C | 256 | PLASTIC/EPOXY | BGA | BGA256,16X16,40 | SQUARE | GRID ARRAY | YES | TIN SILVER COPPER | BALL | 1 mm | BOTTOM | 17 mm | 17 mm | 2.2 mm | INTEL CORP | FBGA-256 | compliant | 8542.39.00.01 | EAR99 | Intel |