Parametric results for: DSP56301VF80 under Digital Signal Processors

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Manufacturer Part Number: dsp56301vf80
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DSP56301VF80
NXP Semiconductors
Check for Price Obsolete DIGITAL SIGNAL PROCESSOR, OTHER CMOS NXP SEMICONDUCTORS unknown 8542.31.00.01
DSP56301VF80
Freescale Semiconductor
Check for Price No Transferred 24 4096 24 24 80 MHz YES 3.3 V DIGITAL SIGNAL PROCESSOR, OTHER CMOS YES YES FIXED POINT MULTIPLE YES 3.6 V 3 V INDUSTRIAL S-PBGA-B252 Not Qualified e0 3 100 °C -40 °C 220 30 252 PLASTIC/EPOXY BGA BGA252,16X16,50 SQUARE GRID ARRAY Tin/Lead (Sn/Pb) BALL 1.27 mm BOTTOM 1.9 mm 21 mm 21 mm FREESCALE SEMICONDUCTOR INC not_compliant 8542.31.00.01 BGA MOLD ARRAY PROCESS, BGA-252 252 3A991
DSP56301VF80
Motorola Mobility LLC
Check for Price No Obsolete 24 4096 24 24 80 MHz YES 3.3 V DIGITAL SIGNAL PROCESSOR, OTHER CMOS YES YES FIXED POINT MULTIPLE YES 3.6 V 3 V INDUSTRIAL S-PBGA-B252 Not Qualified 1 100 °C -40 °C 252 PLASTIC/EPOXY BGA BGA252,16X16,50 SQUARE GRID ARRAY BALL 1.27 mm BOTTOM 1.9 mm 21 mm 21 mm MOTOROLA INC unknown 8542.31.00.01 BGA BGA, BGA252,16X16,50 252 3A991.A.2
DSP56301VF80
Motorola Semiconductor Products
Check for Price No Obsolete 24 4096 24 24 80 MHz YES 3.3 V DIGITAL SIGNAL PROCESSOR, OTHER CMOS YES YES FIXED POINT MULTIPLE YES 3.6 V 3 V INDUSTRIAL S-PBGA-B252 Not Qualified 1 100 °C -40 °C 252 PLASTIC/EPOXY BGA BGA252,16X16,50 SQUARE GRID ARRAY BALL 1.27 mm BOTTOM 1.9 mm 21 mm 21 mm MOTOROLA INC unknown 8542.31.00.01 MOLD ARRAY PROCESS, BGA-252 3A991.A.2