Parametric results for: DS422-01TG under Sockets and Chip Carriers

All Filters Additional Feature Body Breadth Body Depth Body Length Contact Configuration Contact Finish Mating Contact Finish Termination Contact Material Contact Style Device Socket Type Device Type Used On Housing Material JESD-609 Code Manufacturer Mating Contact Pitch Mounting Style Number of Contacts Operating Temperature-Max Operating Temperature-Min PCB Contact Pattern PCB Contact Row Spacing Part Life Cycle Code Pbfree Code Rohs Code Terminal Pitch Termination Type

LOW PROFILE 1 STANDARD: UL 94V-0 4 STANDARD: UL 94V-0, LOW PROFILE 2

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0.4 inch 2 0.5 inch 4

Min (inch) - Max (inch)

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0.165 inch 6

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1.1 inch 6

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RECTANGLE 6

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AU ON NI 1 GOLD OVER NICKEL 3 NOT SPECIFIED 2

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TIN LEAD OVER NICKEL 3 Tin/Lead (Sn/Pb) - with Nickel (Ni) barrier 4

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Contact Material (3)

BERYLLIUM COPPER ALLOY 3 BRASS 2 NOT SPECIFIED 1

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RND PIN-SKT 6

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IC SOCKET 7

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DIP22 5 DIP62 2

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LIQUID CRYSTAL POLYMER 1 POLYBUTYLENE TEREPHTHALATE 2 POLYETHYLENE 3 THERMOPLASTIC POLYESTER 1

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e0 7

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Manufacturer (1)

Advanced Interconnections Corp 7

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0.1 inch 6

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STRAIGHT 6

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Number of Contacts (1)

22 7

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140.0 °C 1 260.0 °C 3

Min (°C) - Max (°C)

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-60.0 °C 4

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RECTANGULAR 6

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400 µm 6

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Active 1 Obsolete 6

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No 1

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No 6

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Terminal Pitch (1)

2.54 mm 6

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SOLDER 6

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