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DPS832V-55B
B&B Electronics Manufacturing Company
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Check for Price | No | Transferred | 262.144 kbit | 32 | 8KX32 | 5 V | 55 ns | SRAM MODULE | USER CONFIGURABLE AS 32K X 8 | 16 | COMMON | 1 | 1 | 8000 | 8.192 k | ASYNCHRONOUS | 3-STATE | YES | PARALLEL | 1.2 mA | 2 V | 640 µA | 5.5 V | 4.5 V | CMOS | MILITARY | S-CPGA-P66 | Not Qualified | e0 | 125 °C | -55 °C | MIL-STD-883 Class B (Modified) | 66 | CERAMIC, METAL-SEALED COFIRED | PGA | PGA66,11X11 | SQUARE | GRID ARRAY | NO | Tin/Lead (Sn/Pb) | PIN/PEG | 2.54 mm | PERPENDICULAR | 7.62 mm | DPAC TECHNOLOGIES CORP | PGA | PGA, PGA66,11X11 | 66 | unknown | 3A001.A.2.C | 8542.32.00.41 | |||||
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DPS832V-55B
Twilight Technology Inc
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Check for Price | No | No | Contact Manufacturer | 262.144 kbit | 32 | 8KX32 | 5 V | 55 ns | SRAM MODULE | USER CONFIGURABLE AS 32K X 8 | 16 | COMMON | 1 | 8000 | 8.192 k | ASYNCHRONOUS | 3-STATE | PARALLEL | 1.2 mA | 2 V | 640 µA | 5.5 V | 4.5 V | CMOS | MILITARY | S-CPGA-P66 | Not Qualified | 125 °C | -55 °C | NOT SPECIFIED | MIL-STD-883 Class B (Modified) | NOT SPECIFIED | 66 | CERAMIC, METAL-SEALED COFIRED | PGA | PGA66,11X11 | SQUARE | GRID ARRAY | NO | PIN/PEG | 2.54 mm | PERPENDICULAR | 7.62 mm | TWILIGHT TECHNOLOGY INC | PGA | PGA, PGA66,11X11 | 66 | unknown | 3A001.A.2.C | 8542.32.00.41 |