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Parametric results for: DM355GCEM216EP under Other uPs/uCs/Peripheral ICs

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Manufacturer Part Number: dm355
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TMS320DM355DZCE216
 Texas Instruments 		$16.7125 Yes Yes Active 32 8192 32 YES 1.3 V Digital Media SoC CMOS IT ALSO OPERATES AT 1.8V AND 3.3V SUPPLY FOR I/O I2C; SPI; UART; USB FIXED POINT 1.365 V 1.235 V OTHER S-PBGA-B337 Not Qualified e1 3 85 °C 260 30 337 PLASTIC/EPOXY LFBGA BGA337,19X19,25 SQUARE GRID ARRAY, LOW PROFILE, FINE PITCH TIN SILVER COPPER BALL 650 µm BOTTOM 1.3 mm 13 mm 13 mm TEXAS INSTRUMENTS INC BGA LFBGA, BGA337,19X19,25 337 compliant 3A991.A.2 8542.31.00.01 Texas Instruments
TMS320DM355ZCE216
 Texas Instruments 		$22.3694 Yes Yes Not Recommended 32 32768 YES 1.3 V Digital Media SoC CMOS FIXED POINT 1.365 V 1.235 V OTHER S-PBGA-B337 Not Qualified e1 3 85 °C 260 30 337 PLASTIC/EPOXY LFBGA BGA337,19X19,25 SQUARE GRID ARRAY, LOW PROFILE, FINE PITCH TIN SILVER COPPER BALL 650 µm BOTTOM 1.3 mm 13 mm 13 mm TEXAS INSTRUMENTS INC BGA 13 X 13 MM, 0.65 MM PITCH, ROHS COMPLIANT, PLASTIC, BGA-337 337 unknown 3A991.A.2 8542.31.00.01 Texas Instruments
TMS320DM355DZCE270
 Texas Instruments 		$25.0186 Yes Yes Active 32 8192 32 YES 1.3 V Digital Media SoC CMOS IT ALSO OPERATES AT 1.8V AND 3.3V SUPPLY FOR I/O I2C; SPI; UART; USB FIXED POINT 1.365 V 1.235 V OTHER S-PBGA-B337 Not Qualified e1 3 85 °C 260 30 337 PLASTIC/EPOXY LFBGA BGA337,19X19,25 SQUARE GRID ARRAY, LOW PROFILE, FINE PITCH TIN SILVER COPPER BALL 650 µm BOTTOM 1.3 mm 13 mm 13 mm TEXAS INSTRUMENTS INC BGA 13 X 13 MM, 0.65 MM PITCH, ROHS COMPLIANT, PLASTIC, NFBGA-337 337 compliant 3A991.A.2 8542.31.00.01 Texas Instruments
TMS320DM355DZCE135
 Texas Instruments 		$25.1104 Yes Yes Obsolete 32 8192 32 YES 1.3 V Digital Media SoC CMOS IT ALSO OPERATES AT 1.8V AND 3.3V SUPPLY FOR I/O I2C; SPI; UART; USB FIXED POINT 1.365 V 1.235 V OTHER S-PBGA-B337 Not Qualified e1 3 85 °C 260 30 337 PLASTIC/EPOXY LFBGA BGA337,19X19,25 SQUARE GRID ARRAY, LOW PROFILE, FINE PITCH TIN SILVER COPPER BALL 650 µm BOTTOM 1.3 mm 13 mm 13 mm TEXAS INSTRUMENTS INC BGA NFBGA-337 337 compliant 3A991.A.2 8542.31.00.01 Texas Instruments
TMS320DM355ZCE135
 Texas Instruments 		$25.1104 Yes Yes Obsolete 32 32768 YES 1.3 V Digital Media SoC CMOS FIXED POINT 1.365 V 1.235 V OTHER S-PBGA-B337 Not Qualified e1 3 85 °C 260 30 337 PLASTIC/EPOXY LFBGA BGA337,19X19,25 SQUARE GRID ARRAY, LOW PROFILE, FINE PITCH TIN SILVER COPPER BALL 650 µm BOTTOM 1.3 mm 13 mm 13 mm TEXAS INSTRUMENTS INC BGA 13 X 13 MM, 0.65 MM PITCH, ROHS COMPLIANT, PLASTIC, BGA-337 337 unknown 3A991.A.2 8542.31.00.01
DM355SZCE216
 Texas Instruments 		$27.1928 Yes Yes Obsolete 32 32768 YES 1.3 V Digital Media SoC CMOS FIXED POINT 1.365 V 1.235 V OTHER S-PBGA-B337 Not Qualified e1 3 85 °C 260 30 337 PLASTIC/EPOXY LFBGA BGA337,19X19,25 SQUARE GRID ARRAY, LOW PROFILE, FINE PITCH TIN SILVER COPPER BALL 650 µm BOTTOM 1.3 mm 13 mm 13 mm TEXAS INSTRUMENTS INC BGA LFBGA, BGA337,19X19,25 337 unknown 8542.31.00.01
TMS320DM355CZCE216
 Texas Instruments 		$27.1928 No Active 32 8192 32 YES 1.3 V Digital Media SoC CMOS IT ALSO OPERATES AT 1.8V AND 3.3V SUPPLY FOR I/O I2C; SPI; UART; USB FIXED POINT 1.365 V 1.235 V OTHER S-PBGA-B337 Not Qualified e1 3 85 °C 260 30 337 PLASTIC/EPOXY LFBGA BGA337,19X19,25 SQUARE GRID ARRAY, LOW PROFILE, FINE PITCH TIN SILVER COPPER BALL 650 µm BOTTOM 1.3 mm 13 mm 13 mm TEXAS INSTRUMENTS INC BGA NFBGA-337 337 compliant 3A991.A.2 8542.31.00.01 Texas Instruments
TMS320DM355ZCEA216
 Texas Instruments 		$28.0568 Yes Yes Not Recommended 32 32768 YES 1.3 V Digital Media SoC CMOS FIXED POINT 1.365 V 1.235 V INDUSTRIAL S-PBGA-B337 Not Qualified e1 3 100 °C -40 °C 260 30 337 PLASTIC/EPOXY LFBGA BGA337,19X19,25 SQUARE GRID ARRAY, LOW PROFILE, FINE PITCH TIN SILVER COPPER BALL 650 µm BOTTOM 1.3 mm 13 mm 13 mm TEXAS INSTRUMENTS INC BGA 13 X 13 MM, 0.65 MM PITCH, ROHS COMPLIANT, PLASTIC, BGA-337 337 unknown 3A991.A.2 8542.31.00.01 Texas Instruments
TMS320DM355CZCEA21
 Texas Instruments 		$30.3924 Yes Yes Active 32 8192 32 YES 1.3 V Digital Media SoC CMOS IT ALSO OPERATES AT 1.8V AND 3.3V SUPPLY FOR I/O I2C; SPI; UART; USB FIXED POINT 1.365 V 1.235 V INDUSTRIAL S-PBGA-B337 Not Qualified e1 3 100 °C -40 °C 260 30 337 PLASTIC/EPOXY LFBGA BGA337,19X19,25 SQUARE GRID ARRAY, LOW PROFILE, FINE PITCH TIN SILVER COPPER BALL 650 µm BOTTOM 1.3 mm 13 mm 13 mm TEXAS INSTRUMENTS INC BGA LFBGA, BGA337,19X19,25 337 compliant 3A991.A.2 8542.31.00.01
TMS320DM355ZCE270
 Texas Instruments 		$31.5342 Yes Yes Not Recommended 32 32768 YES 1.3 V Digital Media SoC CMOS FIXED POINT 1.365 V 1.235 V OTHER S-PBGA-B337 Not Qualified e1 3 85 °C 260 30 337 PLASTIC/EPOXY LFBGA BGA337,19X19,25 SQUARE GRID ARRAY, LOW PROFILE, FINE PITCH TIN SILVER COPPER BALL 650 µm BOTTOM 1.3 mm 13 mm 13 mm TEXAS INSTRUMENTS INC BGA 13 X 13 MM, 0.65 MM PITCH, ROHS COMPLIANT, PLASTIC, BGA-337 337 unknown 3A991.A.2 8542.31.00.01
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