Parametric results for: DIP-308-001BLF under Sockets and Chip Carriers

All Filters Body Breadth Body Depth Body Length Contact Finish Mating Contact Finish Termination Contact Material Contact Style Device Socket Type Device Type Used On Housing Material JESD-609 Code Manufacturer Mating Contact Pitch Mounting Style Number of Contacts PCB Contact Pattern PCB Contact Row Spacing Part Life Cycle Code Rohs Code Terminal Pitch Termination Type

0.4 inch 1

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0.165 inch 1

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0.3 inch 1

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GOLD (30) OVER NICKEL 1

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GOLD OVER NICKEL 1

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Contact Material (1)

NOT SPECIFIED 1

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RND PIN-SKT 1

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IC SOCKET 1

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DIP8 1

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GLASS FILLED POLYCYCLOHEXYDIMETHYLENE TEREPHTHALATE-POLYESTER 1

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e4 1

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Manufacturer (1)

Amphenol FCi 1

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0.1 inch 1

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STRAIGHT 1

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Number of Contacts (1)

8 1

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RECTANGULAR 1

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300 µm 1

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Obsolete 1

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Yes 1

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Terminal Pitch (1)

2.54 mm 1

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SOLDER 1

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