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DG417AK
Vishay Intertechnologies
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Check for Price | No | Obsolete | 15 V | NO | -15 V | 35 Ω | 175 ns | 145 ns | SPST | CMOS | NC | 1 | 1 | BREAK-BEFORE-MAKE | MILITARY | R-GDIP-T8 | Not Qualified | 1 | 125 °C | -55 °C | 8 | CERAMIC, GLASS-SEALED | DIP | DIP8,.3 | RECTANGULAR | IN-LINE | THROUGH-HOLE | 2.54 mm | DUAL | 9.78 mm | 5.08 mm | 7.62 mm | VISHAY INTERTECHNOLOGY INC | CERDIP-8 | unknown | ||||||||||||||||||||||
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DG417AK
Maxim Integrated Products
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Check for Price | No | No | Obsolete | 15 V | NO | -15 V | 30 Ω | 3 Ω | 175 ns | 145 ns | SPST | CMOS | -20 V | -4.5 V | NC | 1 | 1 | 68 dB | 20 V | 4.5 V | BREAK-BEFORE-MAKE | MILITARY | R-GDIP-T8 | Not Qualified | e0 | 1 | 125 °C | -55 °C | 8 | CERAMIC, GLASS-SEALED | DIP | DIP8,.3 | RECTANGULAR | IN-LINE | TIN LEAD | THROUGH-HOLE | 2.54 mm | DUAL | 5.08 mm | 7.62 mm | MAXIM INTEGRATED PRODUCTS INC | 0.300 INCH, CERDIP-8 | compliant | DIP | 8 | EAR99 | 8542.39.00.01 | ||||||||||
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DG417AK/883
Temic Semiconductors
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Check for Price | Transferred | 15 V | NO | -15 V | 35 Ω | 175 ns | 145 ns | SPST | CMOS | 1 | 1 | 5 µA | MILITARY | R-GDIP-T8 | Not Qualified | 125 °C | -55 °C | 8 | CERAMIC, GLASS-SEALED | RECTANGULAR | IN-LINE | THROUGH-HOLE | DUAL | TEMIC SEMICONDUCTORS | unknown | ||||||||||||||||||||||||||||||||
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DG417AK/883B
Analog Devices Inc
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Check for Price | Active | 15 V | NO | -15 V | 30 Ω | 3 Ω | 250 ns | 210 ns | SPST | CMOS | -20 V | -4.5 V | NC | 1 | 1 | 68 dB | SEPARATE OUTPUT | 20 V | 4.5 V | BREAK-BEFORE-MAKE | MILITARY | R-GDIP-T8 | Not Qualified | e0 | 1 | 125 °C | -55 °C | NOT SPECIFIED | MIL-STD-883 Class B | NOT SPECIFIED | 8 | CERAMIC, GLASS-SEALED | DIP | DIP8,.3 | RECTANGULAR | IN-LINE | Tin/Lead (Sn/Pb) | THROUGH-HOLE | 2.54 mm | DUAL | 5.08 mm | 7.62 mm | 8-CERDIP-300_MIL | 8 | 8-CERDIP-300_MIL | 1999-05-28 | |||||||||||
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DG417AK
Vishay Siliconix
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Check for Price | No | No | Transferred | NO | 100 Ω | 175 ns | SPST | CMOS | NC | 1 | BREAK-BEFORE-MAKE | MILITARY | R-XDIP-T8 | Not Qualified | e0 | 125 °C | -55 °C | 8 | CERAMIC | DIP | DIP8,.3 | RECTANGULAR | IN-LINE | Tin/Lead (Sn/Pb) | THROUGH-HOLE | 2.54 mm | DUAL | SILICONIX INC | DIP-8 | unknown | DIP | 8 | 8542.39.00.01 | ||||||||||||||||||||||||
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MXDG417AK
Maxim Integrated Products
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Check for Price | No | No | Transferred | NO | 35 Ω | SPST | -20 V | -5 V | 1 | 1 | 20 V | 5 V | MILITARY | R-GDIP-T8 | Not Qualified | e0 | 125 °C | -55 °C | 8 | CERAMIC, GLASS-SEALED | DIP | RECTANGULAR | IN-LINE | TIN LEAD | THROUGH-HOLE | 2.54 mm | DUAL | 5.08 mm | 7.62 mm | MAXIM INTEGRATED PRODUCTS INC | DIP, | compliant | DIP | 8 | 8542.39.00.01 | ||||||||||||||||||||||
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DG417AK/883B
Maxim Integrated Products
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Check for Price | No | No | Transferred | 15 V | NO | -15 V | 30 Ω | 3 Ω | 250 ns | 210 ns | SPST | CMOS | -20 V | -4.5 V | NC | 1 | 1 | 68 dB | SEPARATE OUTPUT | 20 V | 4.5 V | BREAK-BEFORE-MAKE | MILITARY | R-GDIP-T8 | Not Qualified | e0 | 1 | 125 °C | -55 °C | MIL-STD-883 Class B | 8 | CERAMIC, GLASS-SEALED | DIP | DIP8,.3 | RECTANGULAR | IN-LINE | TIN LEAD | THROUGH-HOLE | 2.54 mm | DUAL | 5.08 mm | 7.62 mm | MAXIM INTEGRATED PRODUCTS INC | DIP, DIP8,.3 | not_compliant | DIP | 8 | EAR99 | 8542.39.00.01 | ||||||||
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DG417AK
Temic Semiconductors
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Check for Price | Transferred | 15 V | NO | -15 V | 35 Ω | 175 ns | 145 ns | SPST | CMOS | 1 | 1 | 5 µA | MILITARY | R-GDIP-T8 | Not Qualified | 125 °C | -55 °C | 8 | CERAMIC, GLASS-SEALED | RECTANGULAR | IN-LINE | THROUGH-HOLE | DUAL | TEMIC SEMICONDUCTORS | DIP-8 | unknown |