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DG186AP/883
Vishay Siliconix
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Check for Price | No | No | Transferred | NO | SPDT | 1 | BREAK-BEFORE-MAKE | MILITARY | R-XDIP-T14 | Not Qualified | e0 | 125 °C | -55 °C | 38535Q/M;38534H;883B | 14 | CERAMIC | DIP | DIP14,.3 | RECTANGULAR | IN-LINE | Tin/Lead (Sn/Pb) | THROUGH-HOLE | 2.54 mm | DUAL | SILICONIX INC | DIP | DIP, DIP14,.3 | 14 | unknown | 8542.39.00.01 | |||||||||||
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DG186AP/883
Rochester Electronics LLC
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Check for Price | Obsolete | 15 V | NO | -15 V | 10 Ω | 400 ns | 200 ns | SPDT | 1 | 1 | MILITARY | R-CDIP-T14 | 125 °C | -55 °C | MIL-STD-883 | 14 | CERAMIC, METAL-SEALED COFIRED | DIP | RECTANGULAR | IN-LINE | THROUGH-HOLE | DUAL | ROCHESTER ELECTRONICS LLC | DIP, | unknown | 8542.39.00.01 | |||||||||||||||
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DG186AP/883B
Intersil Corporation
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Check for Price | No | Obsolete | 15 V | NO | -15 V | 10 Ω | 300 ns | SPDT | 1 | BREAK-BEFORE-MAKE | MILITARY | R-XDIP-T14 | Not Qualified | e0 | 125 °C | -55 °C | 38535Q/M;38534H;883B | 14 | CERAMIC | DIP | DIP14,.3 | RECTANGULAR | IN-LINE | Tin/Lead (Sn/Pb) | THROUGH-HOLE | 2.54 mm | DUAL | INTERSIL CORP | DIP-14 | not_compliant | 8542.39.00.01 | ||||||||||
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DG186AP/883B
General Electric Solid State
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Check for Price | No | Transferred | NO | SPDT | 1 | BREAK-BEFORE-MAKE | MILITARY | R-XDIP-T14 | Not Qualified | e0 | 125 °C | -55 °C | 38535Q/M;38534H;883B | 14 | CERAMIC | DIP | DIP14,.3 | RECTANGULAR | IN-LINE | Tin/Lead (Sn/Pb) | THROUGH-HOLE | 2.54 mm | DUAL | GENERAL ELECTRIC SOLID STATE | DIP-14 | unknown | 8542.39.00.01 | ||||||||||||||
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DG186AP/883C
General Electric Solid State
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Check for Price | No | Obsolete | NO | SPDT | 1 | BREAK-BEFORE-MAKE | MILITARY | R-XDIP-T14 | Not Qualified | e0 | 125 °C | -55 °C | MIL-STD-883 Class C | 14 | CERAMIC | DIP | DIP14,.3 | RECTANGULAR | IN-LINE | Tin/Lead (Sn/Pb) | THROUGH-HOLE | 2.54 mm | DUAL | GENERAL ELECTRIC SOLID STATE | DIP, DIP14,.3 | unknown | 8542.39.00.01 | ||||||||||||||
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DG186AP/883
Temic Semiconductors
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Check for Price | Transferred | 15 V | NO | -15 V | 10 Ω | 400 ns | 200 ns | SPDT | JFET | 1 | 1 | 55 dB | 3.2 mA | MILITARY | R-CDIP-T14 | Not Qualified | 125 °C | -55 °C | 14 | CERAMIC, METAL-SEALED COFIRED | RECTANGULAR | IN-LINE | THROUGH-HOLE | DUAL | TEMIC SEMICONDUCTORS | unknown | |||||||||||||||
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DG186AP/883B
Harris Semiconductor
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Check for Price | No | Obsolete | 15 V | NO | -15 V | 10 Ω | 300 ns | SPDT | 1 | BREAK-BEFORE-MAKE | MILITARY | R-XDIP-T14 | Not Qualified | e0 | 125 °C | -55 °C | 38535Q/M;38534H;883B | 14 | CERAMIC | DIP | DIP14,.3 | RECTANGULAR | IN-LINE | Tin/Lead (Sn/Pb) | THROUGH-HOLE | 2.54 mm | DUAL | HARRIS SEMICONDUCTOR | DIP-14 | unknown | 8542.39.00.01 |