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DAC101C081CISD/NOPB
Texas Instruments
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$1.1703 | Yes | Yes | Active | 3 V | 5.5 V | 0.1953 % | 10 | 180 kHz | YES | D/A CONVERTER | BINARY | SERIAL | 1 | 6 µs | 6 µs | 214 µA | CMOS | AUTOMOTIVE | R-PDSO-N6 | Not Qualified | e3 | 1 | 125 °C | -40 °C | 260 | 30 | 6 | PLASTIC/EPOXY | HVSON | SOLCC6,.1,25 | RECTANGULAR | SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE | MATTE TIN | NO LEAD | 650 µm | DUAL | 2.2 mm | 800 µm | 2.5 mm | TEXAS INSTRUMENTS INC | SON | WSON-6 | 6 | compliant | 8542.39.00.01 | Texas Instruments | |||
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DAC101C081CISDX
National Semiconductor Corporation
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Check for Price | No | Transferred | 3 V | 5.5 V | 0.1953 % | 10 | YES | D/A CONVERTER | BINARY | SERIAL | 1 | 4.5 µs | CMOS | AUTOMOTIVE | R-XDSO-G6 | Not Qualified | e0 | 1 | 125 °C | -40 °C | 260 | 40 | 6 | UNSPECIFIED | HVSSOP | SOLCC6,.1,25 | RECTANGULAR | SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE, SHRINK PITCH | Tin/Lead (Sn85Pb15) | GULL WING | 650 µm | DUAL | 2.2 mm | 800 µm | 2.5 mm | NATIONAL SEMICONDUCTOR CORP | LLP-6 | not_compliant | 8542.39.00.01 | EAR99 | |||||||||
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DAC101C081CISDX/NOPB
Texas Instruments
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Check for Price | Yes | Yes | Active | 3 V | 5.5 V | 0.1953 % | 10 | 180 kHz | YES | D/A CONVERTER | BINARY | SERIAL | 1 | 6 µs | 6 µs | 214 µA | CMOS | AUTOMOTIVE | R-PDSO-N6 | Not Qualified | e3 | 1 | 125 °C | -40 °C | 260 | 30 | 6 | PLASTIC/EPOXY | HVSON | SOLCC6,.1,25 | RECTANGULAR | SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE | MATTE TIN | NO LEAD | 650 µm | DUAL | 2.2 mm | 800 µm | 2.5 mm | TEXAS INSTRUMENTS INC | SON | HVSON, SOLCC6,.1,25 | 6 | compliant | 8542.39.00.01 | Texas Instruments | |||
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DAC101C081CISD
National Semiconductor Corporation
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Check for Price | No | Transferred | 3 V | 5.5 V | 0.1953 % | 10 | YES | D/A CONVERTER | BINARY | SERIAL | 1 | 4.5 µs | CMOS | AUTOMOTIVE | R-XDSO-G6 | Not Qualified | e0 | 1 | 125 °C | -40 °C | 260 | 40 | 6 | UNSPECIFIED | HVSSOP | SOLCC6,.1,25 | RECTANGULAR | SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE, SHRINK PITCH | Tin/Lead (Sn85Pb15) | GULL WING | 650 µm | DUAL | 2.2 mm | 800 µm | 2.5 mm | NATIONAL SEMICONDUCTOR CORP | LLP-6 | not_compliant | 8542.39.00.01 | EAR99 | |||||||||
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DAC101C081CISD
Texas Instruments
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Check for Price | No | No | Obsolete | 3 V | 5.5 V | 0.1953 % | 10 | YES | D/A CONVERTER | BINARY | SERIAL | 1 | 6 µs | 4.5 µs | CMOS | AUTOMOTIVE | R-XDSO-G6 | Not Qualified | e0 | 1 | 125 °C | -40 °C | 260 | 6 | UNSPECIFIED | HVSSOP | SOLCC6,.1,25 | RECTANGULAR | SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE, SHRINK PITCH | TIN LEAD | GULL WING | 650 µm | DUAL | 2.2 mm | 800 µm | 2.5 mm | TEXAS INSTRUMENTS INC | SOIC | HVSSOP, SOLCC6,.1,25 | 6 | not_compliant | 8542.39.00.01 | |||||||
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DAC101C081CISDX
Texas Instruments
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Check for Price | No | No | Obsolete | 3 V | 5.5 V | 0.1953 % | 10 | YES | D/A CONVERTER | BINARY | SERIAL | 1 | 6 µs | 4.5 µs | CMOS | AUTOMOTIVE | R-XDSO-G6 | Not Qualified | e0 | 1 | 125 °C | -40 °C | 260 | 6 | UNSPECIFIED | HVSSOP | SOLCC6,.1,25 | RECTANGULAR | SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE, SHRINK PITCH | TIN LEAD | GULL WING | 650 µm | DUAL | 2.2 mm | 800 µm | 2.5 mm | TEXAS INSTRUMENTS INC | SOIC | HVSSOP, SOLCC6,.1,25 | 6 | not_compliant | 8542.39.00.01 |