Findchips.com

Register or Sign In

Parametric » Telecommunication Circuits » Network Interfaces

Parametric results for: CYP15G0401DXB-BGXC under Network Interfaces

Select parts from the table below to compare.

Compare


Select Parts		Part Number

		CYP15G0401DXB-BGXC Cypress Semiconductor
		CYP15G0401DXB-BGXC Infineon Technologies AG

				Most Relevant				Technical				Compliance			Operating Conditions				Physical											Dimensions			Other
Composite Price	Pbfree Code	Rohs Code	Part Life Cycle Code	Supply Voltage-Nom	Technology	Number of Transceivers	Data Rate	Telecom IC Type	Number of Functions	Supply Current-Max	Temperature Grade	JESD-30 Code	JESD-609 Code	Qualification Status	Moisture Sensitivity Level	Operating Temperature-Max	Peak Reflow Temperature (Cel)	Time@Peak Reflow Temperature-Max (s)	Number of Terminals	Package Body Material	Package Code	Package Equivalence Code	Package Shape	Package Style	Surface Mount	Terminal Finish	Terminal Form	Terminal Pitch	Terminal Position	Width	Length	Seated Height-Max	Ihs Manufacturer	Part Package Code	Pin Count	Reach Compliance Code	ECCN Code	HTS Code	Samacsys Manufacturer

Yes

Yes

Transferred

3.3 V

BICMOS

4

1.5 Tbps

ETHERNET TRANSCEIVER

1

1.1 mA

COMMERCIAL

S-PBGA-B256

e1

Not Qualified

3

70 °C

260

20

256

PLASTIC/EPOXY

HBGA

BGA256,20X20,50

SQUARE

GRID ARRAY, HEAT SINK/SLUG

YES

Tin/Silver/Copper (Sn/Ag/Cu)

BALL

1.27 mm

BOTTOM

27 mm

27 mm

1.745 mm

CYPRESS SEMICONDUCTOR CORP

BGA

256

compliant

5A991.B.1

8542.39.00.01

Check for Price

Yes

Obsolete

3.3 V

BICMOS

4

1.5 Tbps

ETHERNET TRANSCEIVER

1

1.1 mA

COMMERCIAL

S-PBGA-B256

e1

Not Qualified

3

70 °C

260

20

256

PLASTIC/EPOXY

HBGA

BGA256,20X20,50

SQUARE

GRID ARRAY, HEAT SINK/SLUG

YES

TIN SILVER COPPER

BALL

1.27 mm

BOTTOM

27 mm

27 mm

1.745 mm

INFINEON TECHNOLOGIES AG

compliant

Infineon

Compare

Telecommunication Circuits

CYP15G0401DXB-BGXC

Cypress Semiconductor

Yes

Yes

Transferred

3.3 V

BICMOS

4

1.5 Tbps

ETHERNET TRANSCEIVER

1

1.1 mA

COMMERCIAL

S-PBGA-B256

e1

Not Qualified

3

70 °C

260

20

256

PLASTIC/EPOXY

HBGA

BGA256,20X20,50

SQUARE

GRID ARRAY, HEAT SINK/SLUG

YES

Tin/Silver/Copper (Sn/Ag/Cu)

BALL

1.27 mm

BOTTOM

27 mm

27 mm

1.745 mm

CYPRESS SEMICONDUCTOR CORP

BGA

256

compliant

5A991.B.1

8542.39.00.01

CYP15G0401DXB-BGXC

Infineon Technologies AG

Check for Price

Yes

Obsolete

3.3 V

BICMOS

4

1.5 Tbps

ETHERNET TRANSCEIVER

1

1.1 mA

COMMERCIAL

S-PBGA-B256

e1

Not Qualified

3

70 °C

260

20

256

PLASTIC/EPOXY

HBGA

BGA256,20X20,50

SQUARE

GRID ARRAY, HEAT SINK/SLUG

YES

TIN SILVER COPPER

BALL

1.27 mm

BOTTOM

27 mm

27 mm

1.745 mm

INFINEON TECHNOLOGIES AG

compliant

Infineon