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Parametric » Microcontrollers and Processors » Multifunction Peripherals

Parametric results for: CY8C4128FNI-BL583T under Multifunction Peripherals

Select parts from the table below to compare.

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Select Parts		Part Number

		CY8C4128FNI-BL583T Cypress Semiconductor
		CY8C4128FNI-BL583T Infineon Technologies AG

			Most Relevant						Technical					Compliance		Operating Conditions					Physical									Dimensions			Other
Composite Price	Rohs Code	Part Life Cycle Code	RAM (words)	Bus Compatibility	Clock Frequency-Max	Number of I/O Lines	Surface Mount	Supply Voltage-Nom	Technology	Boundary Scan	Supply Voltage-Max	Supply Voltage-Min	Temperature Grade	JESD-30 Code	JESD-609 Code	Moisture Sensitivity Level	Operating Temperature-Max	Operating Temperature-Min	Peak Reflow Temperature (Cel)	Time@Peak Reflow Temperature-Max (s)	Number of Terminals	Package Body Material	Package Code	Package Shape	Package Style	Terminal Finish	Terminal Form	Terminal Pitch	Terminal Position	Seated Height-Max	Width	Length	Ihs Manufacturer	Package Description	Reach Compliance Code	ECCN Code	HTS Code	Samacsys Manufacturer

Check for Price

Yes

Transferred

16384

I2C; SPI; UART

48 MHz

36

YES

1.8 V

CMOS

NO

5.5 V

1.71 V

INDUSTRIAL

R-PBGA-B76

e4

1

85 °C

-40 °C

76

PLASTIC/EPOXY

VFBGA

RECTANGULAR

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

NICKEL PALLADIUM GOLD

BALL

400 µm

BOTTOM

550 µm

3.87 mm

4.04 mm

CYPRESS SEMICONDUCTOR CORP

WLCSP-76

compliant

3A991.A.2

8542.31.00.01

Check for Price

Yes

Active

16384

I2C; SPI; UART

48 MHz

36

YES

1.8 V

CMOS

NO

5.5 V

1.71 V

INDUSTRIAL

R-PBGA-B76

e4

1

85 °C

-40 °C

NOT SPECIFIED

NOT SPECIFIED

76

PLASTIC/EPOXY

VFBGA

RECTANGULAR

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

Nickel/Palladium/Gold (Ni/Pd/Au)

BALL

400 µm

BOTTOM

550 µm

3.87 mm

4.04 mm

INFINEON TECHNOLOGIES AG

WLCSP-76

compliant

Infineon

Compare

CY8C4128FNI-BL583T

Cypress Semiconductor

Check for Price

Yes

Transferred

16384

I2C; SPI; UART

48 MHz

36

YES

1.8 V

CMOS

NO

5.5 V

1.71 V

INDUSTRIAL

R-PBGA-B76

e4

1

85 °C

-40 °C

76

PLASTIC/EPOXY

VFBGA

RECTANGULAR

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

NICKEL PALLADIUM GOLD

BALL

400 µm

BOTTOM

550 µm

3.87 mm

4.04 mm

CYPRESS SEMICONDUCTOR CORP

WLCSP-76

compliant

3A991.A.2

8542.31.00.01

CY8C4128FNI-BL583T

Infineon Technologies AG

Check for Price

Yes

Active

16384

I2C; SPI; UART

48 MHz

36

YES

1.8 V

CMOS

NO

5.5 V

1.71 V

INDUSTRIAL

R-PBGA-B76

e4

1

85 °C

-40 °C

NOT SPECIFIED

NOT SPECIFIED

76

PLASTIC/EPOXY

VFBGA

RECTANGULAR

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

Nickel/Palladium/Gold (Ni/Pd/Au)

BALL

400 µm

BOTTOM

550 µm

3.87 mm

4.04 mm

INFINEON TECHNOLOGIES AG

WLCSP-76

compliant

Infineon