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CY7C2670KV18-550BZI
Cypress Semiconductor
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Check for Price | No | Transferred | 150.9949 Mbit | 36 | 4MX36 | 1.8 V | 450 ps | 550 MHz | DDR SRAM | PIPELINED ARCHITECTURE | COMMON | 1 | 4000000 | 4.1943 M | SYNCHRONOUS | 3-STATE | PARALLEL | 1.7 V | 1.9 V | 1.7 V | CMOS | INDUSTRIAL | R-PBGA-B165 | Not Qualified | e0 | 3 | 85 °C | -40 °C | NOT SPECIFIED | NOT SPECIFIED | 165 | PLASTIC/EPOXY | LBGA | BGA165,11X15,40 | RECTANGULAR | GRID ARRAY, LOW PROFILE | YES | Tin/Lead (Sn/Pb) | BALL | 1 mm | BOTTOM | 1.4 mm | 17 mm | 15 mm | CYPRESS SEMICONDUCTOR CORP | BGA | FBGA-165 | 165 | compliant | 3A991.B.2.A | 8542.32.00.41 | ||
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CY7C2670KV18-550BZI
Infineon Technologies AG
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Check for Price | No | Active | 150.9949 Mbit | 36 | 4MX36 | 1.8 V | 450 ps | 550 MHz | DDR SRAM | PIPELINED ARCHITECTURE | COMMON | 1 | 4000000 | 4.1943 M | SYNCHRONOUS | 3-STATE | PARALLEL | 1.7 V | 1.9 V | 1.7 V | CMOS | INDUSTRIAL | R-PBGA-B165 | Not Qualified | e0 | 3 | 85 °C | -40 °C | 165 | PLASTIC/EPOXY | LBGA | BGA165,11X15,40 | RECTANGULAR | GRID ARRAY, LOW PROFILE | YES | Tin/Lead (Sn/Pb) | BALL | 1 mm | BOTTOM | 1.4 mm | 17 mm | 15 mm | INFINEON TECHNOLOGIES AG | FBGA-165 | compliant |