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CY7C1527V18-200BZC
Cypress Semiconductor
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Check for Price | No | No | Obsolete | 75.4975 Mbit | 9 | 8MX9 | 1.8 V | 450 ps | 200 MHz | DDR SRAM | PIPELINED ARCHITECTURE | COMMON | 1 | 8000000 | 8.3886 M | SYNCHRONOUS | 3-STATE | PARALLEL | 360 mA | 1.7 V | 700 µA | 1.9 V | 1.7 V | CMOS | COMMERCIAL | R-PBGA-B165 | Not Qualified | e0 | 3 | 70 °C | 220 | 165 | PLASTIC/EPOXY | LBGA | BGA165,11X15,40 | RECTANGULAR | GRID ARRAY, LOW PROFILE | YES | TIN LEAD | BALL | 1 mm | BOTTOM | 1.4 mm | 17 mm | 15 mm | CYPRESS SEMICONDUCTOR CORP | BGA | 15 X 17 MM, 1.40 MM HEIGHT, MO-216, FBGA-165 | 165 | compliant | 3A991.B.2.A | 8542.32.00.41 | ||||
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CY7C1527V18-278BZI
Cypress Semiconductor
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Check for Price | No | No | Obsolete | 75.4975 Mbit | 9 | 8MX9 | 1.8 V | 450 ps | 278 MHz | DDR SRAM | PIPELINED ARCHITECTURE | COMMON | 1 | 8000000 | 8.3886 M | SYNCHRONOUS | 3-STATE | PARALLEL | 390 mA | 1.7 V | 860 µA | 1.9 V | 1.7 V | CMOS | INDUSTRIAL | R-PBGA-B165 | Not Qualified | e0 | 3 | 85 °C | -40 °C | 220 | 165 | PLASTIC/EPOXY | LBGA | BGA165,11X15,40 | RECTANGULAR | GRID ARRAY, LOW PROFILE | YES | TIN LEAD | BALL | 1 mm | BOTTOM | 1.4 mm | 17 mm | 15 mm | CYPRESS SEMICONDUCTOR CORP | BGA | 15 X 17 MM, 1.40 MM HEIGHT, MO-216, FBGA-165 | 165 | compliant | 3A991.B.2.A | 8542.32.00.41 | |||
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CY7C1527V18-250BZI
Cypress Semiconductor
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Check for Price | No | No | Obsolete | 75.4975 Mbit | 9 | 8MX9 | 1.8 V | 450 ps | 250 MHz | DDR SRAM | PIPELINED ARCHITECTURE | COMMON | 1 | 8000000 | 8.3886 M | SYNCHRONOUS | 3-STATE | PARALLEL | 380 mA | 1.7 V | 800 µA | 1.9 V | 1.7 V | CMOS | INDUSTRIAL | R-PBGA-B165 | Not Qualified | e0 | 3 | 85 °C | -40 °C | 220 | 165 | PLASTIC/EPOXY | LBGA | BGA165,11X15,40 | RECTANGULAR | GRID ARRAY, LOW PROFILE | YES | TIN LEAD | BALL | 1 mm | BOTTOM | 1.4 mm | 17 mm | 15 mm | CYPRESS SEMICONDUCTOR CORP | BGA | 15 X 17 MM, 1.40 MM HEIGHT, MO-216, FBGA-165 | 165 | compliant | 3A991.B.2.A | 8542.32.00.41 | |||
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CY7C1527V18-278BZXI
Cypress Semiconductor
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Check for Price | Yes | Yes | Obsolete | 75.4975 Mbit | 9 | 8MX9 | 1.8 V | 450 ps | 278 MHz | DDR SRAM | PIPELINED ARCHITECTURE | COMMON | 1 | 8000000 | 8.3886 M | SYNCHRONOUS | 3-STATE | PARALLEL | 390 mA | 1.7 V | 860 µA | 1.9 V | 1.7 V | CMOS | INDUSTRIAL | R-PBGA-B165 | Not Qualified | e1 | 3 | 85 °C | -40 °C | 260 | 20 | 165 | PLASTIC/EPOXY | LBGA | BGA165,11X15,40 | RECTANGULAR | GRID ARRAY, LOW PROFILE | YES | Tin/Silver/Copper (Sn/Ag/Cu) | BALL | 1 mm | BOTTOM | 1.4 mm | 17 mm | 15 mm | CYPRESS SEMICONDUCTOR CORP | BGA | LBGA, BGA165,11X15,40 | 165 | compliant | 3A991.B.2.A | 8542.32.00.41 | ||
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CY7C1527V18-250BZXI
Cypress Semiconductor
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Check for Price | Yes | Yes | Obsolete | 75.4975 Mbit | 9 | 8MX9 | 1.8 V | 450 ps | 250 MHz | DDR SRAM | PIPELINED ARCHITECTURE | COMMON | 1 | 8000000 | 8.3886 M | SYNCHRONOUS | 3-STATE | PARALLEL | 380 mA | 1.7 V | 800 µA | 1.9 V | 1.7 V | CMOS | INDUSTRIAL | R-PBGA-B165 | Not Qualified | e1 | 3 | 85 °C | -40 °C | 260 | 20 | 165 | PLASTIC/EPOXY | LBGA | BGA165,11X15,40 | RECTANGULAR | GRID ARRAY, LOW PROFILE | YES | Tin/Silver/Copper (Sn/Ag/Cu) | BALL | 1 mm | BOTTOM | 1.4 mm | 17 mm | 15 mm | CYPRESS SEMICONDUCTOR CORP | BGA | LBGA, BGA165,11X15,40 | 165 | compliant | 3A991.B.2.A | 8542.32.00.41 | ||
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CY7C1527V18-167BZI
Cypress Semiconductor
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Check for Price | No | No | Obsolete | 75.4975 Mbit | 9 | 8MX9 | 1.8 V | 500 ps | 167 MHz | DDR SRAM | PIPELINED ARCHITECTURE | COMMON | 1 | 8000000 | 8.3886 M | SYNCHRONOUS | 3-STATE | PARALLEL | 340 mA | 1.7 V | 650 µA | 1.9 V | 1.7 V | CMOS | INDUSTRIAL | R-PBGA-B165 | Not Qualified | e0 | 3 | 85 °C | -40 °C | 220 | 165 | PLASTIC/EPOXY | LBGA | BGA165,11X15,40 | RECTANGULAR | GRID ARRAY, LOW PROFILE | YES | TIN LEAD | BALL | 1 mm | BOTTOM | 1.4 mm | 17 mm | 15 mm | CYPRESS SEMICONDUCTOR CORP | BGA | 15 X 17 MM, 1.40 MM HEIGHT, MO-216, FBGA-165 | 165 | compliant | 3A991.B.2.A | 8542.32.00.41 | |||
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CY7C1527V18-300BZXI
Cypress Semiconductor
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Check for Price | Yes | Yes | Obsolete | 75.4975 Mbit | 9 | 8MX9 | 1.8 V | 450 ps | 300 MHz | DDR SRAM | PIPELINED ARCHITECTURE | COMMON | 1 | 8000000 | 8.3886 M | SYNCHRONOUS | 3-STATE | PARALLEL | 400 mA | 1.7 V | 900 µA | 1.9 V | 1.7 V | CMOS | INDUSTRIAL | R-PBGA-B165 | Not Qualified | e1 | 3 | 85 °C | -40 °C | 260 | 20 | 165 | PLASTIC/EPOXY | LBGA | BGA165,11X15,40 | RECTANGULAR | GRID ARRAY, LOW PROFILE | YES | Tin/Silver/Copper (Sn/Ag/Cu) | BALL | 1 mm | BOTTOM | 1.4 mm | 17 mm | 15 mm | CYPRESS SEMICONDUCTOR CORP | BGA | LBGA, BGA165,11X15,40 | 165 | compliant | 3A991.B.2.A | 8542.32.00.41 | ||
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CY7C1527V18-167BZXI
Cypress Semiconductor
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Check for Price | Yes | Yes | Obsolete | 75.4975 Mbit | 9 | 8MX9 | 1.8 V | 500 ps | 167 MHz | DDR SRAM | PIPELINED ARCHITECTURE | COMMON | 1 | 8000000 | 8.3886 M | SYNCHRONOUS | 3-STATE | PARALLEL | 340 mA | 1.7 V | 650 µA | 1.9 V | 1.7 V | CMOS | INDUSTRIAL | R-PBGA-B165 | Not Qualified | e1 | 3 | 85 °C | -40 °C | 260 | 20 | 165 | PLASTIC/EPOXY | LBGA | BGA165,11X15,40 | RECTANGULAR | GRID ARRAY, LOW PROFILE | YES | Tin/Silver/Copper (Sn/Ag/Cu) | BALL | 1 mm | BOTTOM | 1.4 mm | 17 mm | 15 mm | CYPRESS SEMICONDUCTOR CORP | BGA | LBGA, BGA165,11X15,40 | 165 | compliant | 3A991.B.2.A | 8542.32.00.41 | ||
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CY7C1527V18-300BZC
Cypress Semiconductor
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Check for Price | No | No | Obsolete | 75.4975 Mbit | 9 | 8MX9 | 1.8 V | 450 ps | 300 MHz | DDR SRAM | PIPELINED ARCHITECTURE | COMMON | 1 | 8000000 | 8.3886 M | SYNCHRONOUS | 3-STATE | PARALLEL | 400 mA | 1.7 V | 900 µA | 1.9 V | 1.7 V | CMOS | COMMERCIAL | R-PBGA-B165 | Not Qualified | e0 | 3 | 70 °C | 220 | 165 | PLASTIC/EPOXY | LBGA | BGA165,11X15,40 | RECTANGULAR | GRID ARRAY, LOW PROFILE | YES | TIN LEAD | BALL | 1 mm | BOTTOM | 1.4 mm | 17 mm | 15 mm | CYPRESS SEMICONDUCTOR CORP | BGA | 15 X 17 MM, 1.40 MM HEIGHT, MO-216, FBGA-165 | 165 | compliant | 3A991.B.2.A | 8542.32.00.41 | ||||
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CY7C1527V18-300BZI
Cypress Semiconductor
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Check for Price | No | No | Obsolete | 75.4975 Mbit | 9 | 8MX9 | 1.8 V | 450 ps | 300 MHz | DDR SRAM | PIPELINED ARCHITECTURE | COMMON | 1 | 8000000 | 8.3886 M | SYNCHRONOUS | 3-STATE | PARALLEL | 400 mA | 1.7 V | 900 µA | 1.9 V | 1.7 V | CMOS | INDUSTRIAL | R-PBGA-B165 | Not Qualified | e0 | 3 | 85 °C | -40 °C | 220 | 165 | PLASTIC/EPOXY | LBGA | BGA165,11X15,40 | RECTANGULAR | GRID ARRAY, LOW PROFILE | YES | TIN LEAD | BALL | 1 mm | BOTTOM | 1.4 mm | 17 mm | 15 mm | CYPRESS SEMICONDUCTOR CORP | BGA | 15 X 17 MM, 1.40 MM HEIGHT, MO-216, FBGA-165 | 165 | compliant | 3A991.B.2.A | 8542.32.00.41 |