Findchips: Parametric Search Results for CY7C1470BV25-167BZXI


Select Parts		Part Number

		CY7C1470BV25-167BZXI Cypress Semiconductor
		CY7C1470BV25-167BZXI Infineon Technologies AG

			Most Relevant						Technical															Compliance			Operating Conditions					Physical											Dimensions			Other
Composite Price	Rohs Code	Part Life Cycle Code	Memory Density	Memory Width	Organization	Supply Voltage-Nom (Vsup)	Access Time-Max	Clock Frequency-Max (fCLK)	Memory IC Type	Additional Feature	I/O Type	Number of Functions	Number of Words Code	Number of Words	Operating Mode	Output Characteristics	Parallel/Serial	Standby Voltage-Min	Supply Current-Max	Supply Voltage-Max (Vsup)	Supply Voltage-Min (Vsup)	Technology	Temperature Grade	JESD-30 Code	Qualification Status	JESD-609 Code	Moisture Sensitivity Level	Operating Temperature-Max	Operating Temperature-Min	Peak Reflow Temperature (Cel)	Time@Peak Reflow Temperature-Max (s)	Number of Terminals	Package Body Material	Package Code	Package Equivalence Code	Package Shape	Package Style	Surface Mount	Terminal Finish	Terminal Form	Terminal Pitch	Terminal Position	Seated Height-Max	Length	Width	Ihs Manufacturer	Part Package Code	Package Description	Pin Count	Reach Compliance Code	ECCN Code	HTS Code	Samacsys Manufacturer

$168.4317

Yes

Transferred

75.4975 Mbit

2MX36

2.5 V

3.4 ns

167 MHz

ZBT SRAM

PIPELINED ARCHITECTURE

COMMON

2000000

2.0972 M

SYNCHRONOUS

3-STATE

PARALLEL

2.38 V

400 µA

2.625 V

2.375 V

CMOS

INDUSTRIAL

R-PBGA-B165

Not Qualified

85 °C

-40 °C

260

165

PLASTIC/EPOXY

LBGA

BGA165,11X15,40

RECTANGULAR

GRID ARRAY, LOW PROFILE

YES

Tin/Silver/Copper (Sn/Ag/Cu)

BALL

1 mm

BOTTOM

1.4 mm

17 mm

15 mm

CYPRESS SEMICONDUCTOR CORP

BGA

15 X 17 MM, 1.40 MM HEIGHT, LEAD FREE, MO-216, FBGA-165

165

compliant

3A991.B.2.A

8542.32.00.41

Check for Price

Yes

Active

75.4975 Mbit

2MX36

2.5 V

3.4 ns

167 MHz

ZBT SRAM

PIPELINED ARCHITECTURE

COMMON

2000000

2.0972 M

SYNCHRONOUS

3-STATE

PARALLEL

2.38 V

400 µA

2.625 V

2.375 V

CMOS

INDUSTRIAL

R-PBGA-B165

Not Qualified

85 °C

-40 °C

260

165

PLASTIC/EPOXY

LBGA

BGA165,11X15,40

RECTANGULAR

GRID ARRAY, LOW PROFILE

YES

Tin/Silver/Copper (Sn/Ag/Cu)

BALL

1 mm

BOTTOM

1.4 mm

17 mm

15 mm

INFINEON TECHNOLOGIES AG

15 X 17 MM, 1.40 MM HEIGHT, LEAD FREE, MO-216, FBGA-165

compliant

Infineon

Compare

CY7C1470BV25-167BZXI

Cypress Semiconductor

$168.4317

Yes

Transferred

75.4975 Mbit

2MX36

2.5 V

3.4 ns

167 MHz

ZBT SRAM

PIPELINED ARCHITECTURE

COMMON

2000000

2.0972 M

SYNCHRONOUS

3-STATE

PARALLEL

2.38 V

400 µA

2.625 V

2.375 V

CMOS

INDUSTRIAL

R-PBGA-B165

Not Qualified

85 °C

-40 °C

260

165

PLASTIC/EPOXY

LBGA

BGA165,11X15,40

RECTANGULAR

GRID ARRAY, LOW PROFILE

YES

Tin/Silver/Copper (Sn/Ag/Cu)

BALL

1 mm

BOTTOM

1.4 mm

17 mm

15 mm

CYPRESS SEMICONDUCTOR CORP

BGA

15 X 17 MM, 1.40 MM HEIGHT, LEAD FREE, MO-216, FBGA-165

165

compliant

3A991.B.2.A

8542.32.00.41

CY7C1470BV25-167BZXI

Infineon Technologies AG

Check for Price

Yes

Active

75.4975 Mbit

2MX36

2.5 V

3.4 ns

167 MHz

ZBT SRAM

PIPELINED ARCHITECTURE

COMMON

2000000

2.0972 M

SYNCHRONOUS

3-STATE

PARALLEL

2.38 V

400 µA

2.625 V

2.375 V

CMOS

INDUSTRIAL

R-PBGA-B165

Not Qualified

85 °C

-40 °C

260

165

PLASTIC/EPOXY

LBGA

BGA165,11X15,40

RECTANGULAR

GRID ARRAY, LOW PROFILE

YES

Tin/Silver/Copper (Sn/Ag/Cu)

BALL

1 mm

BOTTOM

1.4 mm

17 mm

15 mm

INFINEON TECHNOLOGIES AG

15 X 17 MM, 1.40 MM HEIGHT, LEAD FREE, MO-216, FBGA-165

compliant

Infineon

Parametric results for: CY7C1470BV25-167BZXI under SRAMs