Findchips: Parametric Search Results for CY7C1361C

Parametric results for: CY7C1361C under SRAMs

Select parts from the table below to compare.

Compare


Select Parts		Part Number

		CY7C1361C-133AXI Infineon Technologies AG
		CY7C1361C-133AXI Cypress Semiconductor
		CY7C1361C-100AXC Infineon Technologies AG
		CY7C1361C-100AXC Cypress Semiconductor
		CY7C1361C-100AXE Infineon Technologies AG
		CY7C1361C-100AXE Cypress Semiconductor
		CY7C1361C-100BGI Cypress Semiconductor
		CY7C1361C-100BZC Cypress Semiconductor
		CY7C1361C-133BGI Cypress Semiconductor
		CY7C1361C-117BZC Cypress Semiconductor

				Most Relevant						Technical																		Compliance			Operating Conditions					Physical											Dimensions			Other
Composite Price	Pbfree Code	Rohs Code	Part Life Cycle Code	Memory Density	Memory Width	Organization	Supply Voltage-Nom (Vsup)	Access Time-Max	Clock Frequency-Max (fCLK)	Memory IC Type	Additional Feature	I/O Type	Number of Functions	Number of Ports	Number of Words Code	Number of Words	Operating Mode	Output Characteristics	Output Enable	Parallel/Serial	Standby Current-Max	Standby Voltage-Min	Supply Current-Max	Supply Voltage-Max (Vsup)	Supply Voltage-Min (Vsup)	Technology	Temperature Grade	JESD-30 Code	Qualification Status	JESD-609 Code	Moisture Sensitivity Level	Operating Temperature-Max	Operating Temperature-Min	Peak Reflow Temperature (Cel)	Time@Peak Reflow Temperature-Max (s)	Number of Terminals	Package Body Material	Package Code	Package Equivalence Code	Package Shape	Package Style	Surface Mount	Terminal Finish	Terminal Form	Terminal Pitch	Terminal Position	Seated Height-Max	Length	Width	Ihs Manufacturer	Package Description	Reach Compliance Code	Samacsys Manufacturer	Part Package Code	Pin Count	ECCN Code	HTS Code

$15.5949

Yes

Active

9.4372 Mbit

256KX36

3.3 V

6.5 ns

133 MHz

STANDARD SRAM

FLOW-THROUGH ARCHITECTURE

COMMON

256000

262.144 k

SYNCHRONOUS

3-STATE

YES

PARALLEL

40 mA

3.135 V

250 µA

3.6 V

3.135 V

CMOS

INDUSTRIAL

R-PQFP-G100

Not Qualified

85 °C

-40 °C

260

100

PLASTIC/EPOXY

LQFP

QFP100,.63X.87

RECTANGULAR

FLATPACK, LOW PROFILE

YES

Matte Tin (Sn)

GULL WING

650 µm

QUAD

1.6 mm

20 mm

14 mm

INFINEON TECHNOLOGIES AG

TQFP-100

compliant

Infineon

$15.6866

Yes

Transferred

9.4372 Mbit

256KX36

3.3 V

6.5 ns

133 MHz

STANDARD SRAM

FLOW-THROUGH ARCHITECTURE

COMMON

256000

262.144 k

SYNCHRONOUS

3-STATE

YES

PARALLEL

40 mA

3.135 V

250 µA

3.6 V

3.135 V

CMOS

INDUSTRIAL

R-PQFP-G100

Not Qualified

85 °C

-40 °C

260

100

PLASTIC/EPOXY

LQFP

QFP100,.63X.87

RECTANGULAR

FLATPACK, LOW PROFILE

YES

Matte Tin (Sn)

GULL WING

650 µm

QUAD

1.6 mm

20 mm

14 mm

CYPRESS SEMICONDUCTOR CORP

TQFP-100

compliant

QFP

100

3A991.B.2.A

8542.32.00.41

$15.8631

Yes

Obsolete

9.4372 Mbit

256KX36

3.3 V

8.5 ns

100 MHz

STANDARD SRAM

FLOW-THROUGH ARCHITECTURE

COMMON

256000

262.144 k

SYNCHRONOUS

3-STATE

YES

PARALLEL

40 mA

3.135 V

180 µA

3.6 V

3.135 V

CMOS

COMMERCIAL

R-PQFP-G100

Not Qualified

70 °C

260

100

PLASTIC/EPOXY

LQFP

QFP100,.63X.87

RECTANGULAR

FLATPACK, LOW PROFILE

YES

Matte Tin (Sn)

GULL WING

650 µm

QUAD

1.6 mm

20 mm

14 mm

INFINEON TECHNOLOGIES AG

TQFP-100

compliant

Infineon

$17.5301

Yes

Transferred

9.4372 Mbit

256KX36

3.3 V

8.5 ns

100 MHz

STANDARD SRAM

FLOW-THROUGH ARCHITECTURE

COMMON

256000

262.144 k

SYNCHRONOUS

3-STATE

YES

PARALLEL

40 mA

3.135 V

180 µA

3.6 V

3.135 V

CMOS

COMMERCIAL

R-PQFP-G100

Not Qualified

70 °C

260

100

PLASTIC/EPOXY

LQFP

QFP100,.63X.87

RECTANGULAR

FLATPACK, LOW PROFILE

YES

Matte Tin (Sn)

GULL WING

650 µm

QUAD

1.6 mm

20 mm

14 mm

CYPRESS SEMICONDUCTOR CORP

TQFP-100

compliant

QFP

100

3A991.B.2.A

8542.32.00.41

$27.4757

Yes

Active

9.4372 Mbit

256KX36

3.3 V

8.5 ns

100 MHz

STANDARD SRAM

FLOW-THROUGH ARCHITECTURE

COMMON

256000

262.144 k

SYNCHRONOUS

3-STATE

YES

PARALLEL

60 mA

3.135 V

180 µA

3.6 V

3.135 V

CMOS

AUTOMOTIVE

R-PQFP-G100

Not Qualified

125 °C

-40 °C

260

100

PLASTIC/EPOXY

LQFP

QFP100,.63X.87

RECTANGULAR

FLATPACK, LOW PROFILE

YES

Matte Tin (Sn)

GULL WING

650 µm

QUAD

1.6 mm

20 mm

14 mm

INFINEON TECHNOLOGIES AG

TQFP-100

compliant

Infineon

$30.3496

Yes

Transferred

9.4372 Mbit

256KX36

3.3 V

8.5 ns

100 MHz

STANDARD SRAM

FLOW-THROUGH ARCHITECTURE

COMMON

256000

262.144 k

SYNCHRONOUS

3-STATE

YES

PARALLEL

60 mA

3.135 V

180 µA

3.6 V

3.135 V

CMOS

AUTOMOTIVE

R-PQFP-G100

Not Qualified

125 °C

-40 °C

260

100

PLASTIC/EPOXY

LQFP

QFP100,.63X.87

RECTANGULAR

FLATPACK, LOW PROFILE

YES

Matte Tin (Sn)

GULL WING

650 µm

QUAD

1.6 mm

20 mm

14 mm

CYPRESS SEMICONDUCTOR CORP

TQFP-100

compliant

QFP

100

3A991.B.2.B

8542.32.00.41

Check for Price

Transferred

9.4372 Mbit

256KX36

3.3 V

8.5 ns

100 MHz

CACHE SRAM

FLOW THROUGH ARCHITECTURE

COMMON

256000

262.144 k

SYNCHRONOUS

3-STATE

PARALLEL

40 mA

3.14 V

180 µA

3.6 V

3.135 V

CMOS

INDUSTRIAL

R-PBGA-B119

Not Qualified

85 °C

-40 °C

NOT SPECIFIED

119

PLASTIC/EPOXY

BGA

BGA119,7X17,50

RECTANGULAR

GRID ARRAY

YES

Tin/Lead (Sn/Pb)

BALL

1.27 mm

BOTTOM

2.4 mm

22 mm

14 mm

CYPRESS SEMICONDUCTOR CORP

BGA, BGA119,7X17,50

compliant

BGA

119

3A991.B.2.A

8542.32.00.41

Check for Price

Obsolete

9.4372 Mbit

256KX36

3.3 V

8.5 ns

100 MHz

CACHE SRAM

FLOW THROUGH ARCHITECTURE

COMMON

256000

262.144 k

SYNCHRONOUS

3-STATE

PARALLEL

40 mA

3.14 V

180 µA

3.6 V

3.135 V

CMOS

COMMERCIAL

R-PBGA-B165

Not Qualified

70 °C

220

165

PLASTIC/EPOXY

LBGA

BGA165,11X15,40

RECTANGULAR

GRID ARRAY, LOW PROFILE

YES

TIN LEAD

BALL

1 mm

BOTTOM

1.4 mm

15 mm

13 mm

CYPRESS SEMICONDUCTOR CORP

15 X 13 MM, 1.40 MM HEIGHT, MO-216, FBGA-165

compliant

BGA

165

3A991.B.2.A

8542.32.00.41

Check for Price

Transferred

9.4372 Mbit

256KX36

3.3 V

6.5 ns

133 MHz

CACHE SRAM

FLOW THROUGH ARCHITECTURE

COMMON

256000

262.144 k

SYNCHRONOUS

3-STATE

PARALLEL

40 mA

3.14 V

250 µA

3.6 V

3.135 V

CMOS

INDUSTRIAL

R-PBGA-B119

Not Qualified

85 °C

-40 °C

NOT SPECIFIED

119

PLASTIC/EPOXY

BGA

BGA119,7X17,50

RECTANGULAR

GRID ARRAY

YES

Tin/Lead (Sn/Pb)

BALL

1.27 mm

BOTTOM

2.4 mm

22 mm

14 mm

CYPRESS SEMICONDUCTOR CORP

BGA, BGA119,7X17,50

compliant

BGA

119

3A991.B.2.A

8542.32.00.41

Check for Price

Obsolete

9.4372 Mbit

256KX36

3.3 V

7.5 ns

117 MHz

CACHE DRAM MODULE

COMMON

256000

262.144 k

SYNCHRONOUS

3-STATE

PARALLEL

30 mA

3.14 V

220 µA

3.6 V

3.135 V

CMOS

COMMERCIAL

R-PBGA-B165

Not Qualified

70 °C

165

PLASTIC/EPOXY

LBGA

BGA165,11X15,40

RECTANGULAR

GRID ARRAY, LOW PROFILE

YES

TIN LEAD

BALL

1 mm

BOTTOM

1.4 mm

15 mm

13 mm

CYPRESS SEMICONDUCTOR CORP

FBGA-165

compliant

3A991.B.2.A

8542.32.00.41

1 2 3 4 5 Next

Compare

CY7C1361C-133AXI

Infineon Technologies AG

$15.5949

Yes

Active

9.4372 Mbit

256KX36

3.3 V

6.5 ns

133 MHz

STANDARD SRAM

FLOW-THROUGH ARCHITECTURE

COMMON

256000

262.144 k

SYNCHRONOUS

3-STATE

YES

PARALLEL

40 mA

3.135 V

250 µA

3.6 V

3.135 V

CMOS

INDUSTRIAL

R-PQFP-G100

Not Qualified

85 °C

-40 °C

260

100

PLASTIC/EPOXY

LQFP

QFP100,.63X.87

RECTANGULAR

FLATPACK, LOW PROFILE

YES

Matte Tin (Sn)

GULL WING

650 µm

QUAD

1.6 mm

20 mm

14 mm

INFINEON TECHNOLOGIES AG

TQFP-100

compliant

Infineon

CY7C1361C-133AXI

Cypress Semiconductor

$15.6866

Yes

Transferred

9.4372 Mbit

256KX36

3.3 V

6.5 ns

133 MHz

STANDARD SRAM

FLOW-THROUGH ARCHITECTURE

COMMON

256000

262.144 k

SYNCHRONOUS

3-STATE

YES

PARALLEL

40 mA

3.135 V

250 µA

3.6 V

3.135 V

CMOS

INDUSTRIAL

R-PQFP-G100

Not Qualified

85 °C

-40 °C

260

100

PLASTIC/EPOXY

LQFP

QFP100,.63X.87

RECTANGULAR

FLATPACK, LOW PROFILE

YES

Matte Tin (Sn)

GULL WING

650 µm

QUAD

1.6 mm

20 mm

14 mm

CYPRESS SEMICONDUCTOR CORP

TQFP-100

compliant

QFP

100

3A991.B.2.A

8542.32.00.41

CY7C1361C-100AXC

Infineon Technologies AG

$15.8631

Yes

Obsolete

9.4372 Mbit

256KX36

3.3 V

8.5 ns

100 MHz

STANDARD SRAM

FLOW-THROUGH ARCHITECTURE

COMMON

256000

262.144 k

SYNCHRONOUS

3-STATE

YES

PARALLEL

40 mA

3.135 V

180 µA

3.6 V

3.135 V

CMOS

COMMERCIAL

R-PQFP-G100

Not Qualified

70 °C

260

100

PLASTIC/EPOXY

LQFP

QFP100,.63X.87

RECTANGULAR

FLATPACK, LOW PROFILE

YES

Matte Tin (Sn)

GULL WING

650 µm

QUAD

1.6 mm

20 mm

14 mm

INFINEON TECHNOLOGIES AG

TQFP-100

compliant

Infineon

CY7C1361C-100AXC

Cypress Semiconductor

$17.5301

Yes

Transferred

9.4372 Mbit

256KX36

3.3 V

8.5 ns

100 MHz

STANDARD SRAM

FLOW-THROUGH ARCHITECTURE

COMMON

256000

262.144 k

SYNCHRONOUS

3-STATE

YES

PARALLEL

40 mA

3.135 V

180 µA

3.6 V

3.135 V

CMOS

COMMERCIAL

R-PQFP-G100

Not Qualified

70 °C

260

100

PLASTIC/EPOXY

LQFP

QFP100,.63X.87

RECTANGULAR

FLATPACK, LOW PROFILE

YES

Matte Tin (Sn)

GULL WING

650 µm

QUAD

1.6 mm

20 mm

14 mm

CYPRESS SEMICONDUCTOR CORP

TQFP-100

compliant

QFP

100

3A991.B.2.A

8542.32.00.41

CY7C1361C-100AXE

Infineon Technologies AG

$27.4757

Yes

Active

9.4372 Mbit

256KX36

3.3 V

8.5 ns

100 MHz

STANDARD SRAM

FLOW-THROUGH ARCHITECTURE

COMMON

256000

262.144 k

SYNCHRONOUS

3-STATE

YES

PARALLEL

60 mA

3.135 V

180 µA

3.6 V

3.135 V

CMOS

AUTOMOTIVE

R-PQFP-G100

Not Qualified

125 °C

-40 °C

260

100

PLASTIC/EPOXY

LQFP

QFP100,.63X.87

RECTANGULAR

FLATPACK, LOW PROFILE

YES

Matte Tin (Sn)

GULL WING

650 µm

QUAD

1.6 mm

20 mm

14 mm

INFINEON TECHNOLOGIES AG

TQFP-100

compliant

Infineon

CY7C1361C-100AXE

Cypress Semiconductor

$30.3496

Yes

Transferred

9.4372 Mbit

256KX36

3.3 V

8.5 ns

100 MHz

STANDARD SRAM

FLOW-THROUGH ARCHITECTURE

COMMON

256000

262.144 k

SYNCHRONOUS

3-STATE

YES

PARALLEL

60 mA

3.135 V

180 µA

3.6 V

3.135 V

CMOS

AUTOMOTIVE

R-PQFP-G100

Not Qualified

125 °C

-40 °C

260

100

PLASTIC/EPOXY

LQFP

QFP100,.63X.87

RECTANGULAR

FLATPACK, LOW PROFILE

YES

Matte Tin (Sn)

GULL WING

650 µm

QUAD

1.6 mm

20 mm

14 mm

CYPRESS SEMICONDUCTOR CORP

TQFP-100

compliant

QFP

100

3A991.B.2.B

8542.32.00.41

CY7C1361C-100BGI

Cypress Semiconductor

Check for Price

Transferred

9.4372 Mbit

256KX36

3.3 V

8.5 ns

100 MHz

CACHE SRAM

FLOW THROUGH ARCHITECTURE

COMMON

256000

262.144 k

SYNCHRONOUS

3-STATE

PARALLEL

40 mA

3.14 V

180 µA

3.6 V

3.135 V

CMOS

INDUSTRIAL

R-PBGA-B119

Not Qualified

85 °C

-40 °C

NOT SPECIFIED

119

PLASTIC/EPOXY

BGA

BGA119,7X17,50

RECTANGULAR

GRID ARRAY

YES

Tin/Lead (Sn/Pb)

BALL

1.27 mm

BOTTOM

2.4 mm

22 mm

14 mm

CYPRESS SEMICONDUCTOR CORP

BGA, BGA119,7X17,50

compliant

BGA

119

3A991.B.2.A

8542.32.00.41

CY7C1361C-100BZC

Cypress Semiconductor

Check for Price

Obsolete

9.4372 Mbit

256KX36

3.3 V

8.5 ns

100 MHz

CACHE SRAM

FLOW THROUGH ARCHITECTURE

COMMON

256000

262.144 k

SYNCHRONOUS

3-STATE

PARALLEL

40 mA

3.14 V

180 µA

3.6 V

3.135 V

CMOS

COMMERCIAL

R-PBGA-B165

Not Qualified

70 °C

220

165

PLASTIC/EPOXY

LBGA

BGA165,11X15,40

RECTANGULAR

GRID ARRAY, LOW PROFILE

YES

TIN LEAD

BALL

1 mm

BOTTOM

1.4 mm

15 mm

13 mm

CYPRESS SEMICONDUCTOR CORP

15 X 13 MM, 1.40 MM HEIGHT, MO-216, FBGA-165

compliant

BGA

165

3A991.B.2.A

8542.32.00.41

CY7C1361C-133BGI

Cypress Semiconductor

Check for Price

Transferred

9.4372 Mbit

256KX36

3.3 V

6.5 ns

133 MHz

CACHE SRAM

FLOW THROUGH ARCHITECTURE

COMMON

256000

262.144 k

SYNCHRONOUS

3-STATE

PARALLEL

40 mA

3.14 V

250 µA

3.6 V

3.135 V

CMOS

INDUSTRIAL

R-PBGA-B119

Not Qualified

85 °C

-40 °C

NOT SPECIFIED

119

PLASTIC/EPOXY

BGA

BGA119,7X17,50

RECTANGULAR

GRID ARRAY

YES

Tin/Lead (Sn/Pb)

BALL

1.27 mm

BOTTOM

2.4 mm

22 mm

14 mm

CYPRESS SEMICONDUCTOR CORP

BGA, BGA119,7X17,50

compliant

BGA

119

3A991.B.2.A

8542.32.00.41

CY7C1361C-117BZC

Cypress Semiconductor

Check for Price

Obsolete

9.4372 Mbit

256KX36

3.3 V

7.5 ns

117 MHz

CACHE DRAM MODULE

COMMON

256000

262.144 k

SYNCHRONOUS

3-STATE

PARALLEL

30 mA

3.14 V

220 µA

3.6 V

3.135 V

CMOS

COMMERCIAL

R-PBGA-B165

Not Qualified

70 °C

165

PLASTIC/EPOXY

LBGA

BGA165,11X15,40

RECTANGULAR

GRID ARRAY, LOW PROFILE

YES

TIN LEAD

BALL

1 mm

BOTTOM

1.4 mm

15 mm

13 mm

CYPRESS SEMICONDUCTOR CORP

FBGA-165

compliant

3A991.B.2.A

8542.32.00.41

1 2 3 4 5 Next