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CY7C1360B-200BGC
Cypress Semiconductor
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Check for Price | No | Obsolete | 9.4372 Mbit | 36 | 256KX36 | 3.3 V | 3 ns | 200 MHz | CACHE SRAM | PIPELINED ARCHITECTURE | COMMON | 1 | 256000 | 262.144 k | SYNCHRONOUS | 3-STATE | PARALLEL | 30 mA | 3.14 V | 220 µA | 3.6 V | 3.135 V | CMOS | COMMERCIAL | R-PBGA-B119 | Not Qualified | e0 | 3 | 70 °C | NOT SPECIFIED | NOT SPECIFIED | 119 | PLASTIC/EPOXY | BGA | BGA119,7X17,50 | RECTANGULAR | GRID ARRAY | YES | Tin/Lead (Sn/Pb) | BALL | 1.27 mm | BOTTOM | 2.4 mm | 22 mm | 14 mm | CYPRESS SEMICONDUCTOR CORP | BGA | 14 X 22 MM, 2.40 MM HEIGHT, PLASTIC, BGA-119 | 119 | not_compliant | 3A991.B.2.A | 8542.32.00.41 | |||
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CY7C1360B-225BZC
Cypress Semiconductor
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Check for Price | No | Obsolete | 9.4372 Mbit | 36 | 256KX36 | 3.3 V | 2.8 ns | 225 MHz | CACHE SRAM | PIPELINED ARCHITECTURE | COMMON | 1 | 256000 | 262.144 k | SYNCHRONOUS | 3-STATE | PARALLEL | 30 mA | 3.14 V | 250 µA | 3.6 V | 3.135 V | CMOS | COMMERCIAL | R-PBGA-B165 | Not Qualified | e0 | 3 | 70 °C | 220 | 165 | PLASTIC/EPOXY | TBGA | BGA165,11X15,40 | RECTANGULAR | GRID ARRAY | YES | TIN LEAD | BALL | 1 mm | BOTTOM | 1.2 mm | 15 mm | 13 mm | CYPRESS SEMICONDUCTOR CORP | BGA | 13 X 15 MM, 1.20 MM HEIGHT, FBGA-165 | 165 | compliant | 3A991.B.2.A | 8542.32.00.41 | ||||
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CY7C1360B-166AC
Rochester Electronics LLC
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Check for Price | Contact Manufacturer | 9.4372 Mbit | 36 | 256KX36 | 3.3 V | 3.5 ns | CACHE SRAM | PIPELINED ARCHITECTURE | 1 | 256000 | 262.144 k | SYNCHRONOUS | PARALLEL | 3.6 V | 3.135 V | CMOS | COMMERCIAL | R-PQFP-G100 | 70 °C | NOT SPECIFIED | NOT SPECIFIED | 100 | PLASTIC/EPOXY | LQFP | RECTANGULAR | FLATPACK, LOW PROFILE | YES | GULL WING | 650 µm | QUAD | 1.6 mm | 20 mm | 14 mm | ROCHESTER ELECTRONICS LLC | LQFP, | unknown | 3A991.B.2.A | 8542.32.00.41 | |||||||||||||||||
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CY7C1360B-200BGC
Rochester Electronics LLC
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Check for Price | Contact Manufacturer | 9.4372 Mbit | 36 | 256KX36 | 3.3 V | 3 ns | CACHE SRAM | PIPELINED ARCHITECTURE | 1 | 256000 | 262.144 k | SYNCHRONOUS | PARALLEL | 3.6 V | 3.135 V | CMOS | COMMERCIAL | R-PBGA-B119 | 70 °C | NOT SPECIFIED | NOT SPECIFIED | 119 | PLASTIC/EPOXY | BGA | RECTANGULAR | GRID ARRAY | YES | BALL | 1.27 mm | BOTTOM | 2.4 mm | 22 mm | 14 mm | ROCHESTER ELECTRONICS LLC | BGA, | unknown | 3A991.B.2.A | 8542.32.00.41 | |||||||||||||||||
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CY7C1360B-250BZC
Cypress Semiconductor
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Check for Price | No | Obsolete | 9.4372 Mbit | 36 | 256KX36 | 3.3 V | 3.4 ns | CACHE SRAM | PIPELINE ARCHITECTURE | 1 | 256000 | 262.144 k | SYNCHRONOUS | PARALLEL | 3.6 V | 3.135 V | CMOS | COMMERCIAL | R-PBGA-B165 | Not Qualified | e0 | 3 | 70 °C | 220 | 165 | PLASTIC/EPOXY | TBGA | RECTANGULAR | GRID ARRAY, THIN PROFILE | YES | TIN LEAD | BALL | 1 mm | BOTTOM | 1.2 mm | 15 mm | 13 mm | CYPRESS SEMICONDUCTOR CORP | BGA | 13 X 15 MM, 1.20 MM HEIGHT, FBGA-165 | 165 | compliant | 3A991.B.2.A | 8542.32.00.41 | |||||||||||
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CY7C1360B-225BGC
Cypress Semiconductor
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Check for Price | No | Obsolete | 9.4372 Mbit | 36 | 256KX36 | 3.3 V | 2.8 ns | 225 MHz | CACHE SRAM | PIPELINED ARCHITECTURE | COMMON | 1 | 256000 | 262.144 k | SYNCHRONOUS | 3-STATE | PARALLEL | 30 mA | 3.14 V | 250 µA | 3.6 V | 3.135 V | CMOS | COMMERCIAL | R-PBGA-B119 | Not Qualified | e0 | 70 °C | 119 | PLASTIC/EPOXY | BGA | BGA119,7X17,50 | RECTANGULAR | GRID ARRAY | YES | TIN LEAD | BALL | 1.27 mm | BOTTOM | 2.4 mm | 22 mm | 14 mm | CYPRESS SEMICONDUCTOR CORP | BGA | 14 X 22 MM, 2.40 MM HEIGHT, PLASTIC, BGA-119 | 119 | compliant | 3A991.B.2.A | 8542.32.00.41 | ||||||
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CY7C1360B-200AJC
Cypress Semiconductor
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Check for Price | No | Obsolete | 9.4372 Mbit | 36 | 256KX36 | 3.3 V | 3 ns | 200 MHz | CACHE SRAM | PIPELINED ARCHITECTURE | COMMON | 1 | 256000 | 262.144 k | SYNCHRONOUS | 3-STATE | PARALLEL | 30 mA | 3.14 V | 220 µA | 3.6 V | 3.135 V | CMOS | COMMERCIAL | R-PQFP-G100 | Not Qualified | e0 | 3 | 70 °C | 100 | PLASTIC/EPOXY | LQFP | QFP100,.63X.87 | RECTANGULAR | FLATPACK | YES | TIN LEAD | GULL WING | 650 µm | QUAD | 1.6 mm | 20 mm | 14 mm | CYPRESS SEMICONDUCTOR CORP | QFP | 14 X 20 MM, 1.40 MM HEIGHT, PLASTIC, TQFP-100 | 100 | compliant | 3A991.B.2.A | 8542.32.00.41 | |||||
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CY7C1360B-200AJI
Cypress Semiconductor
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Check for Price | No | Obsolete | 9.4372 Mbit | 36 | 256KX36 | 3.3 V | 3 ns | 200 MHz | CACHE SRAM | PIPELINED ARCHITECTURE | COMMON | 1 | 256000 | 262.144 k | SYNCHRONOUS | 3-STATE | PARALLEL | 30 mA | 3.14 V | 220 µA | 3.6 V | 3.135 V | CMOS | INDUSTRIAL | R-PQFP-G100 | Not Qualified | e0 | 3 | 85 °C | -40 °C | 100 | PLASTIC/EPOXY | LQFP | QFP100,.63X.87 | RECTANGULAR | FLATPACK | YES | TIN LEAD | GULL WING | 650 µm | QUAD | 1.6 mm | 20 mm | 14 mm | CYPRESS SEMICONDUCTOR CORP | QFP | 14 X 20 MM, 1.40 MM HEIGHT, PLASTIC, TQFP-100 | 100 | compliant | 3A991.B.2.A | 8542.32.00.41 | ||||
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CY7C1360B-225AJI
Cypress Semiconductor
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Check for Price | No | Obsolete | 9.4372 Mbit | 36 | 256KX36 | 3.3 V | 2.8 ns | 225 MHz | CACHE SRAM | PIPELINED ARCHITECTURE | COMMON | 1 | 256000 | 262.144 k | SYNCHRONOUS | 3-STATE | PARALLEL | 30 mA | 3.14 V | 250 µA | 3.6 V | 3.135 V | CMOS | INDUSTRIAL | R-PQFP-G100 | Not Qualified | e0 | 3 | 85 °C | -40 °C | 100 | PLASTIC/EPOXY | LQFP | QFP100,.63X.87 | RECTANGULAR | FLATPACK | YES | TIN LEAD | GULL WING | 650 µm | QUAD | 1.6 mm | 20 mm | 14 mm | CYPRESS SEMICONDUCTOR CORP | QFP | 14 X 20 MM, 1.40 MM HEIGHT, PLASTIC, TQFP-100 | 100 | compliant | 3A991.B.2.A | 8542.32.00.41 | ||||
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CY7C1360B-225BGI
Cypress Semiconductor
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Check for Price | No | Obsolete | 9.4372 Mbit | 36 | 256KX36 | 3.3 V | 2.8 ns | 225 MHz | CACHE SRAM | PIPELINED ARCHITECTURE | COMMON | 1 | 256000 | 262.144 k | SYNCHRONOUS | 3-STATE | PARALLEL | 30 mA | 3.14 V | 250 µA | 3.6 V | 3.135 V | CMOS | INDUSTRIAL | R-PBGA-B119 | Not Qualified | e0 | 85 °C | -40 °C | 119 | PLASTIC/EPOXY | BGA | BGA119,7X17,50 | RECTANGULAR | GRID ARRAY | YES | TIN LEAD | BALL | 1.27 mm | BOTTOM | 2.4 mm | 22 mm | 14 mm | CYPRESS SEMICONDUCTOR CORP | BGA | 14 X 22 MM, 2.40 MM HEIGHT, PLASTIC, BGA-119 | 119 | compliant | 3A991.B.2.A | 8542.32.00.41 |