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Select Parts | Part Number |
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CY7C1311CV18-167BZC
Cypress Semiconductor
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CY7C1311CV18-300BZI
Cypress Semiconductor
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CY7C1311CV18-167BZI
Cypress Semiconductor
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CY7C1311CV18-200BZXC
Cypress Semiconductor
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CY7C1311CV18-278BZXC
Cypress Semiconductor
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CY7C1311CV18-200BZI
Cypress Semiconductor
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CY7C1311CV18-167BZXI
Cypress Semiconductor
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CY7C1311CV18-278BZI
Cypress Semiconductor
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CY7C1311CV18-167BZXC
Cypress Semiconductor
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CY7C1311CV18-300BZC
Cypress Semiconductor
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Most Relevant | Technical | Compliance | Operating Conditions | Physical | Dimensions | Other | |||||||||||||||||||||||||||||||||||||||||||||||
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Composite Price
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Rohs Code
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Part Life Cycle Code
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Memory Density
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Memory Width | Organization |
Supply Voltage-Nom (Vsup)
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Access Time-Max
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Clock Frequency-Max (fCLK) |
Memory IC Type
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Additional Feature
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I/O Type
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Number of Functions | Number of Words Code | Number of Words |
Operating Mode
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Output Characteristics
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Parallel/Serial
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Standby Current-Max
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Standby Voltage-Min
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Supply Current-Max
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Supply Voltage-Max (Vsup)
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Supply Voltage-Min (Vsup)
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Technology |
Temperature Grade
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JESD-30 Code
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Qualification Status
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JESD-609 Code
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Moisture Sensitivity Level
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Operating Temperature-Max
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Operating Temperature-Min
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Peak Reflow Temperature (Cel)
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Time@Peak Reflow Temperature-Max (s)
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Number of Terminals
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Package Body Material
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Package Code
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Package Equivalence Code
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Package Shape
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Package Style
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Surface Mount
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Terminal Finish
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Terminal Form
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Terminal Pitch
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Terminal Position
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Seated Height-Max
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Length
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Width
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Ihs Manufacturer
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Part Package Code
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Package Description
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Pin Count
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Reach Compliance Code
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ECCN Code
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HTS Code
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No | Obsolete | 16.7772 Mbit | 8 | 2MX8 | 1.8 V | 500 ps | 167 MHz | QDR SRAM | PIPELINED ARCHITECTURE | SEPARATE | 1 | 2000000 | 2.0972 M | SYNCHRONOUS | 3-STATE | PARALLEL | 220 mA | 1.7 V | 495 µA | 1.9 V | 1.7 V | CMOS | COMMERCIAL | R-PBGA-B165 | Not Qualified | e0 | 70 °C | NOT SPECIFIED | NOT SPECIFIED | 165 | PLASTIC/EPOXY | LBGA | BGA165,11X15,40 | RECTANGULAR | GRID ARRAY, LOW PROFILE | YES | Tin/Lead (Sn/Pb) | BALL | 1 mm | BOTTOM | 1.4 mm | 15 mm | 13 mm | CYPRESS SEMICONDUCTOR CORP | BGA | 13 X 15 MM, 1.40 MM HEIGHT, MO-216, FBGA-165 | 165 | compliant | 3A991.B.2.A | 8542.32.00.41 | |||
No | Obsolete | 16.7772 Mbit | 8 | 2MX8 | 1.8 V | 450 ps | 300 MHz | QDR SRAM | PIPELINED ARCHITECTURE | SEPARATE | 1 | 2000000 | 2.0972 M | SYNCHRONOUS | 3-STATE | PARALLEL | 290 mA | 1.7 V | 765 µA | 1.9 V | 1.7 V | CMOS | INDUSTRIAL | R-PBGA-B165 | Not Qualified | e0 | 85 °C | -40 °C | NOT SPECIFIED | NOT SPECIFIED | 165 | PLASTIC/EPOXY | LBGA | BGA165,11X15,40 | RECTANGULAR | GRID ARRAY, LOW PROFILE | YES | Tin/Lead (Sn/Pb) | BALL | 1 mm | BOTTOM | 1.4 mm | 15 mm | 13 mm | CYPRESS SEMICONDUCTOR CORP | BGA | 13 X 15 MM, 1.40 MM HEIGHT, MO-216, FBGA-165 | 165 | compliant | 3A991.B.2.A | 8542.32.00.41 | ||
No | Obsolete | 16.7772 Mbit | 8 | 2MX8 | 1.8 V | 500 ps | 167 MHz | QDR SRAM | PIPELINED ARCHITECTURE | SEPARATE | 1 | 2000000 | 2.0972 M | SYNCHRONOUS | 3-STATE | PARALLEL | 220 mA | 1.7 V | 495 µA | 1.9 V | 1.7 V | CMOS | INDUSTRIAL | R-PBGA-B165 | Not Qualified | e0 | 85 °C | -40 °C | NOT SPECIFIED | NOT SPECIFIED | 165 | PLASTIC/EPOXY | LBGA | BGA165,11X15,40 | RECTANGULAR | GRID ARRAY, LOW PROFILE | YES | Tin/Lead (Sn/Pb) | BALL | 1 mm | BOTTOM | 1.4 mm | 15 mm | 13 mm | CYPRESS SEMICONDUCTOR CORP | BGA | 13 X 15 MM, 1.40 MM HEIGHT, MO-216, FBGA-165 | 165 | compliant | 3A991.B.2.A | 8542.32.00.41 | ||
Yes | Obsolete | 16.7772 Mbit | 8 | 2MX8 | 1.8 V | 450 ps | 200 MHz | QDR SRAM | PIPELINED ARCHITECTURE | SEPARATE | 1 | 2000000 | 2.0972 M | SYNCHRONOUS | 3-STATE | PARALLEL | 230 mA | 1.7 V | 560 µA | 1.9 V | 1.7 V | CMOS | COMMERCIAL | R-PBGA-B165 | Not Qualified | e1 | 3 | 70 °C | 260 | 20 | 165 | PLASTIC/EPOXY | LBGA | BGA165,11X15,40 | RECTANGULAR | GRID ARRAY, LOW PROFILE | YES | TIN SILVER COPPER | BALL | 1 mm | BOTTOM | 1.4 mm | 15 mm | 13 mm | CYPRESS SEMICONDUCTOR CORP | BGA | 13 X 15 MM, 1.40 MM HEIGHT, LEAD FREE, MO-216, FBGA-165 | 165 | compliant | 3A991.B.2.A | 8542.32.00.41 | ||
Yes | Obsolete | 16.7772 Mbit | 8 | 2MX8 | 1.8 V | 450 ps | 278 MHz | QDR SRAM | PIPELINED ARCHITECTURE | SEPARATE | 1 | 2000000 | 2.0972 M | SYNCHRONOUS | 3-STATE | PARALLEL | 260 mA | 1.7 V | 720 µA | 1.9 V | 1.7 V | CMOS | COMMERCIAL | R-PBGA-B165 | Not Qualified | e1 | 3 | 70 °C | 260 | 20 | 165 | PLASTIC/EPOXY | LBGA | BGA165,11X15,40 | RECTANGULAR | GRID ARRAY, LOW PROFILE | YES | TIN SILVER COPPER | BALL | 1 mm | BOTTOM | 1.4 mm | 15 mm | 13 mm | CYPRESS SEMICONDUCTOR CORP | BGA | 13 X 15 MM, 1.40 MM HEIGHT, LEAD FREE, MO-216, FBGA-165 | 165 | compliant | 3A991.B.2.A | 8542.32.00.41 | ||
No | Obsolete | 16.7772 Mbit | 8 | 2MX8 | 1.8 V | 450 ps | 200 MHz | QDR SRAM | PIPELINED ARCHITECTURE | SEPARATE | 1 | 2000000 | 2.0972 M | SYNCHRONOUS | 3-STATE | PARALLEL | 230 mA | 1.7 V | 560 µA | 1.9 V | 1.7 V | CMOS | INDUSTRIAL | R-PBGA-B165 | Not Qualified | e0 | 85 °C | -40 °C | NOT SPECIFIED | NOT SPECIFIED | 165 | PLASTIC/EPOXY | LBGA | BGA165,11X15,40 | RECTANGULAR | GRID ARRAY, LOW PROFILE | YES | Tin/Lead (Sn/Pb) | BALL | 1 mm | BOTTOM | 1.4 mm | 15 mm | 13 mm | CYPRESS SEMICONDUCTOR CORP | BGA | 13 X 15 MM, 1.40 MM HEIGHT, MO-216, FBGA-165 | 165 | compliant | 3A991.B.2.A | 8542.32.00.41 | ||
Yes | Obsolete | 16.7772 Mbit | 8 | 2MX8 | 1.8 V | 500 ps | 167 MHz | QDR SRAM | PIPELINED ARCHITECTURE | SEPARATE | 1 | 2000000 | 2.0972 M | SYNCHRONOUS | 3-STATE | PARALLEL | 220 mA | 1.7 V | 495 µA | 1.9 V | 1.7 V | CMOS | INDUSTRIAL | R-PBGA-B165 | Not Qualified | e1 | 3 | 85 °C | -40 °C | 260 | 20 | 165 | PLASTIC/EPOXY | LBGA | BGA165,11X15,40 | RECTANGULAR | GRID ARRAY, LOW PROFILE | YES | TIN SILVER COPPER | BALL | 1 mm | BOTTOM | 1.4 mm | 15 mm | 13 mm | CYPRESS SEMICONDUCTOR CORP | BGA | 13 X 15 MM, 1.40 MM HEIGHT, LEAD FREE, MO-216, FBGA-165 | 165 | compliant | 3A991.B.2.A | 8542.32.00.41 | |
No | Obsolete | 16.7772 Mbit | 8 | 2MX8 | 1.8 V | 450 ps | 278 MHz | QDR SRAM | PIPELINED ARCHITECTURE | SEPARATE | 1 | 2000000 | 2.0972 M | SYNCHRONOUS | 3-STATE | PARALLEL | 260 mA | 1.7 V | 720 µA | 1.9 V | 1.7 V | CMOS | INDUSTRIAL | R-PBGA-B165 | Not Qualified | e0 | 85 °C | -40 °C | NOT SPECIFIED | NOT SPECIFIED | 165 | PLASTIC/EPOXY | LBGA | BGA165,11X15,40 | RECTANGULAR | GRID ARRAY, LOW PROFILE | YES | Tin/Lead (Sn/Pb) | BALL | 1 mm | BOTTOM | 1.4 mm | 15 mm | 13 mm | CYPRESS SEMICONDUCTOR CORP | BGA | 13 X 15 MM, 1.40 MM HEIGHT, MO-216, FBGA-165 | 165 | compliant | 3A991.B.2.A | 8542.32.00.41 | ||
Yes | Obsolete | 16.7772 Mbit | 8 | 2MX8 | 1.8 V | 500 ps | 167 MHz | QDR SRAM | PIPELINED ARCHITECTURE | SEPARATE | 1 | 2000000 | 2.0972 M | SYNCHRONOUS | 3-STATE | PARALLEL | 220 mA | 1.7 V | 495 µA | 1.9 V | 1.7 V | CMOS | COMMERCIAL | R-PBGA-B165 | Not Qualified | e1 | 3 | 70 °C | 260 | 20 | 165 | PLASTIC/EPOXY | LBGA | BGA165,11X15,40 | RECTANGULAR | GRID ARRAY, LOW PROFILE | YES | TIN SILVER COPPER | BALL | 1 mm | BOTTOM | 1.4 mm | 15 mm | 13 mm | CYPRESS SEMICONDUCTOR CORP | BGA | 13 X 15 MM, 1.40 MM HEIGHT, LEAD FREE, MO-216, FBGA-165 | 165 | compliant | 3A991.B.2.A | 8542.32.00.41 | ||
No | Obsolete | 16.7772 Mbit | 8 | 2MX8 | 1.8 V | 450 ps | 300 MHz | QDR SRAM | PIPELINED ARCHITECTURE | SEPARATE | 1 | 2000000 | 2.0972 M | SYNCHRONOUS | 3-STATE | PARALLEL | 290 mA | 1.7 V | 765 µA | 1.9 V | 1.7 V | CMOS | COMMERCIAL | R-PBGA-B165 | Not Qualified | e0 | 70 °C | NOT SPECIFIED | NOT SPECIFIED | 165 | PLASTIC/EPOXY | LBGA | BGA165,11X15,40 | RECTANGULAR | GRID ARRAY, LOW PROFILE | YES | Tin/Lead (Sn/Pb) | BALL | 1 mm | BOTTOM | 1.4 mm | 15 mm | 13 mm | CYPRESS SEMICONDUCTOR CORP | BGA | 13 X 15 MM, 1.40 MM HEIGHT, MO-216, FBGA-165 | 165 | compliant | 3A991.B.2.A | 8542.32.00.41 |
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CY7C1311CV18-167BZC
Cypress Semiconductor
|
Check for Price Buy | No | Obsolete | 16.7772 Mbit | 8 | 2MX8 | 1.8 V | 500 ps | 167 MHz | QDR SRAM | PIPELINED ARCHITECTURE | SEPARATE | 1 | 2000000 | 2.0972 M | SYNCHRONOUS | 3-STATE | PARALLEL | 220 mA | 1.7 V | 495 µA | 1.9 V | 1.7 V | CMOS | COMMERCIAL | R-PBGA-B165 | Not Qualified | e0 | 70 °C | NOT SPECIFIED | NOT SPECIFIED | 165 | PLASTIC/EPOXY | LBGA | BGA165,11X15,40 | RECTANGULAR | GRID ARRAY, LOW PROFILE | YES | Tin/Lead (Sn/Pb) | BALL | 1 mm | BOTTOM | 1.4 mm | 15 mm | 13 mm | CYPRESS SEMICONDUCTOR CORP | BGA | 13 X 15 MM, 1.40 MM HEIGHT, MO-216, FBGA-165 | 165 | compliant | 3A991.B.2.A | 8542.32.00.41 | ||||
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CY7C1311CV18-300BZI
Cypress Semiconductor
|
Check for Price Buy | No | Obsolete | 16.7772 Mbit | 8 | 2MX8 | 1.8 V | 450 ps | 300 MHz | QDR SRAM | PIPELINED ARCHITECTURE | SEPARATE | 1 | 2000000 | 2.0972 M | SYNCHRONOUS | 3-STATE | PARALLEL | 290 mA | 1.7 V | 765 µA | 1.9 V | 1.7 V | CMOS | INDUSTRIAL | R-PBGA-B165 | Not Qualified | e0 | 85 °C | -40 °C | NOT SPECIFIED | NOT SPECIFIED | 165 | PLASTIC/EPOXY | LBGA | BGA165,11X15,40 | RECTANGULAR | GRID ARRAY, LOW PROFILE | YES | Tin/Lead (Sn/Pb) | BALL | 1 mm | BOTTOM | 1.4 mm | 15 mm | 13 mm | CYPRESS SEMICONDUCTOR CORP | BGA | 13 X 15 MM, 1.40 MM HEIGHT, MO-216, FBGA-165 | 165 | compliant | 3A991.B.2.A | 8542.32.00.41 | |||
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CY7C1311CV18-167BZI
Cypress Semiconductor
|
Check for Price Buy | No | Obsolete | 16.7772 Mbit | 8 | 2MX8 | 1.8 V | 500 ps | 167 MHz | QDR SRAM | PIPELINED ARCHITECTURE | SEPARATE | 1 | 2000000 | 2.0972 M | SYNCHRONOUS | 3-STATE | PARALLEL | 220 mA | 1.7 V | 495 µA | 1.9 V | 1.7 V | CMOS | INDUSTRIAL | R-PBGA-B165 | Not Qualified | e0 | 85 °C | -40 °C | NOT SPECIFIED | NOT SPECIFIED | 165 | PLASTIC/EPOXY | LBGA | BGA165,11X15,40 | RECTANGULAR | GRID ARRAY, LOW PROFILE | YES | Tin/Lead (Sn/Pb) | BALL | 1 mm | BOTTOM | 1.4 mm | 15 mm | 13 mm | CYPRESS SEMICONDUCTOR CORP | BGA | 13 X 15 MM, 1.40 MM HEIGHT, MO-216, FBGA-165 | 165 | compliant | 3A991.B.2.A | 8542.32.00.41 | |||
|
CY7C1311CV18-200BZXC
Cypress Semiconductor
|
Check for Price Buy | Yes | Obsolete | 16.7772 Mbit | 8 | 2MX8 | 1.8 V | 450 ps | 200 MHz | QDR SRAM | PIPELINED ARCHITECTURE | SEPARATE | 1 | 2000000 | 2.0972 M | SYNCHRONOUS | 3-STATE | PARALLEL | 230 mA | 1.7 V | 560 µA | 1.9 V | 1.7 V | CMOS | COMMERCIAL | R-PBGA-B165 | Not Qualified | e1 | 3 | 70 °C | 260 | 20 | 165 | PLASTIC/EPOXY | LBGA | BGA165,11X15,40 | RECTANGULAR | GRID ARRAY, LOW PROFILE | YES | TIN SILVER COPPER | BALL | 1 mm | BOTTOM | 1.4 mm | 15 mm | 13 mm | CYPRESS SEMICONDUCTOR CORP | BGA | 13 X 15 MM, 1.40 MM HEIGHT, LEAD FREE, MO-216, FBGA-165 | 165 | compliant | 3A991.B.2.A | 8542.32.00.41 | |||
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CY7C1311CV18-278BZXC
Cypress Semiconductor
|
Check for Price Buy | Yes | Obsolete | 16.7772 Mbit | 8 | 2MX8 | 1.8 V | 450 ps | 278 MHz | QDR SRAM | PIPELINED ARCHITECTURE | SEPARATE | 1 | 2000000 | 2.0972 M | SYNCHRONOUS | 3-STATE | PARALLEL | 260 mA | 1.7 V | 720 µA | 1.9 V | 1.7 V | CMOS | COMMERCIAL | R-PBGA-B165 | Not Qualified | e1 | 3 | 70 °C | 260 | 20 | 165 | PLASTIC/EPOXY | LBGA | BGA165,11X15,40 | RECTANGULAR | GRID ARRAY, LOW PROFILE | YES | TIN SILVER COPPER | BALL | 1 mm | BOTTOM | 1.4 mm | 15 mm | 13 mm | CYPRESS SEMICONDUCTOR CORP | BGA | 13 X 15 MM, 1.40 MM HEIGHT, LEAD FREE, MO-216, FBGA-165 | 165 | compliant | 3A991.B.2.A | 8542.32.00.41 | |||
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CY7C1311CV18-200BZI
Cypress Semiconductor
|
Check for Price Buy | No | Obsolete | 16.7772 Mbit | 8 | 2MX8 | 1.8 V | 450 ps | 200 MHz | QDR SRAM | PIPELINED ARCHITECTURE | SEPARATE | 1 | 2000000 | 2.0972 M | SYNCHRONOUS | 3-STATE | PARALLEL | 230 mA | 1.7 V | 560 µA | 1.9 V | 1.7 V | CMOS | INDUSTRIAL | R-PBGA-B165 | Not Qualified | e0 | 85 °C | -40 °C | NOT SPECIFIED | NOT SPECIFIED | 165 | PLASTIC/EPOXY | LBGA | BGA165,11X15,40 | RECTANGULAR | GRID ARRAY, LOW PROFILE | YES | Tin/Lead (Sn/Pb) | BALL | 1 mm | BOTTOM | 1.4 mm | 15 mm | 13 mm | CYPRESS SEMICONDUCTOR CORP | BGA | 13 X 15 MM, 1.40 MM HEIGHT, MO-216, FBGA-165 | 165 | compliant | 3A991.B.2.A | 8542.32.00.41 | |||
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CY7C1311CV18-167BZXI
Cypress Semiconductor
|
Check for Price Buy | Yes | Obsolete | 16.7772 Mbit | 8 | 2MX8 | 1.8 V | 500 ps | 167 MHz | QDR SRAM | PIPELINED ARCHITECTURE | SEPARATE | 1 | 2000000 | 2.0972 M | SYNCHRONOUS | 3-STATE | PARALLEL | 220 mA | 1.7 V | 495 µA | 1.9 V | 1.7 V | CMOS | INDUSTRIAL | R-PBGA-B165 | Not Qualified | e1 | 3 | 85 °C | -40 °C | 260 | 20 | 165 | PLASTIC/EPOXY | LBGA | BGA165,11X15,40 | RECTANGULAR | GRID ARRAY, LOW PROFILE | YES | TIN SILVER COPPER | BALL | 1 mm | BOTTOM | 1.4 mm | 15 mm | 13 mm | CYPRESS SEMICONDUCTOR CORP | BGA | 13 X 15 MM, 1.40 MM HEIGHT, LEAD FREE, MO-216, FBGA-165 | 165 | compliant | 3A991.B.2.A | 8542.32.00.41 | ||
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CY7C1311CV18-278BZI
Cypress Semiconductor
|
Check for Price Buy | No | Obsolete | 16.7772 Mbit | 8 | 2MX8 | 1.8 V | 450 ps | 278 MHz | QDR SRAM | PIPELINED ARCHITECTURE | SEPARATE | 1 | 2000000 | 2.0972 M | SYNCHRONOUS | 3-STATE | PARALLEL | 260 mA | 1.7 V | 720 µA | 1.9 V | 1.7 V | CMOS | INDUSTRIAL | R-PBGA-B165 | Not Qualified | e0 | 85 °C | -40 °C | NOT SPECIFIED | NOT SPECIFIED | 165 | PLASTIC/EPOXY | LBGA | BGA165,11X15,40 | RECTANGULAR | GRID ARRAY, LOW PROFILE | YES | Tin/Lead (Sn/Pb) | BALL | 1 mm | BOTTOM | 1.4 mm | 15 mm | 13 mm | CYPRESS SEMICONDUCTOR CORP | BGA | 13 X 15 MM, 1.40 MM HEIGHT, MO-216, FBGA-165 | 165 | compliant | 3A991.B.2.A | 8542.32.00.41 | |||
|
CY7C1311CV18-167BZXC
Cypress Semiconductor
|
Check for Price Buy | Yes | Obsolete | 16.7772 Mbit | 8 | 2MX8 | 1.8 V | 500 ps | 167 MHz | QDR SRAM | PIPELINED ARCHITECTURE | SEPARATE | 1 | 2000000 | 2.0972 M | SYNCHRONOUS | 3-STATE | PARALLEL | 220 mA | 1.7 V | 495 µA | 1.9 V | 1.7 V | CMOS | COMMERCIAL | R-PBGA-B165 | Not Qualified | e1 | 3 | 70 °C | 260 | 20 | 165 | PLASTIC/EPOXY | LBGA | BGA165,11X15,40 | RECTANGULAR | GRID ARRAY, LOW PROFILE | YES | TIN SILVER COPPER | BALL | 1 mm | BOTTOM | 1.4 mm | 15 mm | 13 mm | CYPRESS SEMICONDUCTOR CORP | BGA | 13 X 15 MM, 1.40 MM HEIGHT, LEAD FREE, MO-216, FBGA-165 | 165 | compliant | 3A991.B.2.A | 8542.32.00.41 | |||
|
CY7C1311CV18-300BZC
Cypress Semiconductor
|
Check for Price Buy | No | Obsolete | 16.7772 Mbit | 8 | 2MX8 | 1.8 V | 450 ps | 300 MHz | QDR SRAM | PIPELINED ARCHITECTURE | SEPARATE | 1 | 2000000 | 2.0972 M | SYNCHRONOUS | 3-STATE | PARALLEL | 290 mA | 1.7 V | 765 µA | 1.9 V | 1.7 V | CMOS | COMMERCIAL | R-PBGA-B165 | Not Qualified | e0 | 70 °C | NOT SPECIFIED | NOT SPECIFIED | 165 | PLASTIC/EPOXY | LBGA | BGA165,11X15,40 | RECTANGULAR | GRID ARRAY, LOW PROFILE | YES | Tin/Lead (Sn/Pb) | BALL | 1 mm | BOTTOM | 1.4 mm | 15 mm | 13 mm | CYPRESS SEMICONDUCTOR CORP | BGA | 13 X 15 MM, 1.40 MM HEIGHT, MO-216, FBGA-165 | 165 | compliant | 3A991.B.2.A | 8542.32.00.41 |