Findchips: Parametric Search Results for CS5535


Select Parts		Part Number

		CS5535-UDC Rochester Electronics LLC
		CS5535-UDC National Semiconductor Corporation
		CS5535-UDCF AMD
		CS5535-UDC AMD
		CS5535-UDC Texas Instruments

				Most Relevant							Technical										Compliance			Operating Conditions				Physical										Dimensions			Other
Composite Price	Pbfree Code	Rohs Code	Part Life Cycle Code	Bus Compatibility	External Data Bus Width	Address Bus Width	Data Transfer Rate-Max	Clock Frequency-Max	Surface Mount	Supply Voltage-Nom	uPs/uCs/Peripheral ICs Type	Technology	Boundary Scan	Communication Protocol	Data Encoding/Decoding Method	Low Power Mode	Number of Serial I/Os	Supply Voltage-Max	Supply Voltage-Min	Temperature Grade	JESD-30 Code	Qualification Status	JESD-609 Code	Moisture Sensitivity Level	Operating Temperature-Max	Peak Reflow Temperature (Cel)	Time@Peak Reflow Temperature-Max (s)	Number of Terminals	Package Body Material	Package Code	Package Equivalence Code	Package Shape	Package Style	Terminal Finish	Terminal Form	Terminal Pitch	Terminal Position	Seated Height-Max	Width	Length	Ihs Manufacturer	Part Package Code	Package Description	Pin Count	Reach Compliance Code	HTS Code	ECCN Code

Check for Price

Active

PCI; CARDBUS; USB; ISA; ATA

0.1875 MBps

67.5 MHz

YES

1.5 V

SERIAL IO/COMMUNICATION CONTROLLER, SERIAL

CMOS

YES

ASYNC, BIT; SYNC, BYTE

NRZ

YES

1.58 V

1.14 V

OTHER

S-PBGA-B208

COMMERCIAL

85 °C

NOT SPECIFIED

208

PLASTIC/EPOXY

BGA

SQUARE

GRID ARRAY

TIN LEAD

BALL

1.27 mm

BOTTOM

2.34 mm

23 mm

ROCHESTER ELECTRONICS INC

BGA

BGA,

208

unknown

Check for Price

Obsolete

YES

S-PBGA-B208

Not Qualified

208

PLASTIC/EPOXY

BGA

BGA208,17X17,50

SQUARE

GRID ARRAY

Tin/Lead (Sn/Pb)

BALL

1.27 mm

BOTTOM

NATIONAL SEMICONDUCTOR CORP

BGA, BGA208,17X17,50

unknown

8542.31.00.01

Check for Price

Yes

Obsolete

PCI; CARDBUS; USB; ISA; ATA

0.1875 MBps

67.5 MHz

YES

1.5 V

SERIAL IO/COMMUNICATION CONTROLLER, SERIAL

CMOS

YES

ASYNC, BIT; SYNC, BYTE

NRZ

YES

1.58 V

1.14 V

OTHER

S-PBGA-B208

Not Qualified

85 °C

260

208

PLASTIC/EPOXY

BGA

BGA208,17X17,50

SQUARE

GRID ARRAY

TIN SILVER

BALL

1.27 mm

BOTTOM

2.34 mm

23 mm

ADVANCED MICRO DEVICES INC

BGA

23 X 23 MM, 2.13 MM HEIGHT, 1.27 MM PITC... more

208

unknown

8542.31.00.01

EAR99

Check for Price

Obsolete

PCI; CARDBUS; USB; ISA; ATA

0.1875 MBps

67.5 MHz

YES

1.5 V

SERIAL IO/COMMUNICATION CONTROLLER, SERIAL

CMOS

YES

ASYNC, BIT; SYNC, BYTE

NRZ

YES

1.58 V

1.14 V

OTHER

S-PBGA-B208

Not Qualified

85 °C

260

208

PLASTIC/EPOXY

BGA

BGA208,17X17,50

SQUARE

GRID ARRAY

TIN LEAD

BALL

1.27 mm

BOTTOM

2.34 mm

23 mm

ADVANCED MICRO DEVICES INC

BGA

23 X 23 MM, 2.13 MM HEIGHT, 1.27 MM PITCH, PLASTIC, MO-151BAJ-2, BGA-208

208

not_compliant

8542.31.00.01

EAR99

Check for Price

Obsolete

YES

S-PBGA-B208

Not Qualified

208

PLASTIC/EPOXY

BGA

BGA208,17X17,50

SQUARE

GRID ARRAY

Tin/Lead (Sn/Pb)

BALL

1.27 mm

BOTTOM

NATIONAL SEMICONDUCTOR CORP

BGA, BGA208,17X17,50

unknown

8542.31.00.01

Compare

CS5535-UDC

Rochester Electronics LLC

Check for Price

Active

PCI; CARDBUS; USB; ISA; ATA

0.1875 MBps

67.5 MHz

YES

1.5 V

SERIAL IO/COMMUNICATION CONTROLLER, SERIAL

CMOS

YES

ASYNC, BIT; SYNC, BYTE

NRZ

YES

1.58 V

1.14 V

OTHER

S-PBGA-B208

COMMERCIAL

85 °C

NOT SPECIFIED

208

PLASTIC/EPOXY

BGA

SQUARE

GRID ARRAY

TIN LEAD

BALL

1.27 mm

BOTTOM

2.34 mm

23 mm

ROCHESTER ELECTRONICS INC

BGA

BGA,

208

unknown

CS5535-UDC

National Semiconductor Corporation

Check for Price

Obsolete

YES

S-PBGA-B208

Not Qualified

208

PLASTIC/EPOXY

BGA

BGA208,17X17,50

SQUARE

GRID ARRAY

Tin/Lead (Sn/Pb)

BALL

1.27 mm

BOTTOM

NATIONAL SEMICONDUCTOR CORP

BGA, BGA208,17X17,50

unknown

8542.31.00.01

CS5535-UDCF

AMD

Check for Price

Yes

Obsolete

PCI; CARDBUS; USB; ISA; ATA

0.1875 MBps

67.5 MHz

YES

1.5 V

SERIAL IO/COMMUNICATION CONTROLLER, SERIAL

CMOS

YES

ASYNC, BIT; SYNC, BYTE

NRZ

YES

1.58 V

1.14 V

OTHER

S-PBGA-B208

Not Qualified

85 °C

260

208

PLASTIC/EPOXY

BGA

BGA208,17X17,50

SQUARE

GRID ARRAY

TIN SILVER

BALL

1.27 mm

BOTTOM

2.34 mm

23 mm

ADVANCED MICRO DEVICES INC

BGA

23 X 23 MM, 2.13 MM HEIGHT, 1.27 MM PITC... more

208

unknown

8542.31.00.01

EAR99

CS5535-UDC

AMD

Check for Price

Obsolete

PCI; CARDBUS; USB; ISA; ATA

0.1875 MBps

67.5 MHz

YES

1.5 V

SERIAL IO/COMMUNICATION CONTROLLER, SERIAL

CMOS

YES

ASYNC, BIT; SYNC, BYTE

NRZ

YES

1.58 V

1.14 V

OTHER

S-PBGA-B208

Not Qualified

85 °C

260

208

PLASTIC/EPOXY

BGA

BGA208,17X17,50

SQUARE

GRID ARRAY

TIN LEAD

BALL

1.27 mm

BOTTOM

2.34 mm

23 mm

ADVANCED MICRO DEVICES INC

BGA

23 X 23 MM, 2.13 MM HEIGHT, 1.27 MM PITCH, PLASTIC, MO-151BAJ-2, BGA-208

208

not_compliant

8542.31.00.01

EAR99

CS5535-UDC

Texas Instruments

Check for Price

Obsolete

YES

S-PBGA-B208

Not Qualified

208

PLASTIC/EPOXY

BGA

BGA208,17X17,50

SQUARE

GRID ARRAY

Tin/Lead (Sn/Pb)

BALL

1.27 mm

BOTTOM

NATIONAL SEMICONDUCTOR CORP

BGA, BGA208,17X17,50

unknown

8542.31.00.01

Parametric results for: CS5535 under Serial IO/Communication Controllers