Parametric results for: CS1.2-02 under Sockets and Chip Carriers

All Filters Additional Feature Body Breadth Body Depth Body Length Contact Configuration Contact Finish Mating Contact Finish Termination Contact Material Contact Style Current Rating Device Socket Type Device Type Used On Dielectric Withstanding Voltage Housing Material Insulation Resistance JESD-609 Code Manufacturer Mating Contact Pitch Mounting Style Number of Contacts Operating Temperature-Max Operating Temperature-Min PCB Contact Pattern PCB Contact Row Spacing Part Life Cycle Code Rohs Code Terminal Pitch Termination Type

2.5 OZ. AVG. INSERTION FORCE 21 STANDARD: UL 94V-0 28

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0.4 inch 1 0.6 inch 6 1.1 inch 8 1.3 inch 16 1.6 inch 6 1.7 inch 6 1.8 inch 6

Min (inch) - Max (inch)

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0.165 inch 48 0.205 inch 1

Min (inch) - Max (inch)

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1.0 inch 1 1.1 inch 8 1.3 inch 16 1.6 inch 6 1.7 inch 6 1.8 inch 6 2.0 inch 6

Min (inch) - Max (inch)

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11X11 8 13X13 16 16X16 6 17X17 6 18X18 6

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AU ON NI 14 GOLD OVER NICKEL 14 SN 1 SN-PB ON NI 10 TIN LEAD OVER NICKEL 14

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Gold (Au) - with Nickel (Ni) barrier 20 GOLD OVER NICKEL 4 Tin/Lead (Sn/Pb) - with Nickel (Ni) barrier 28

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Contact Material (4)

BE-CU 24 BERYLLIUM COPPER 1 BERYLLIUM COPPER ALLOY 27 P-CUSN 1

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BELLOWED TYPE 1 RND PIN-SKT 48

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Current Rating (1)

1 A 1

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IC SOCKET 53

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DIP20 1 PGA120 44 PGA180 4 PGA320 4

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1000VAC V 1

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GLASS FILLED POLYBUTYLENE TEREPHTHALATE 1 GLASS FILLED THERMOPLASTIC 24 THERMOPLASTIC POLYESTER 28

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1 GΩ 1

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e0 28 e4 24

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Manufacturer (2)

Advanced Interconnections Corp 52 Marktech Optoelectronics 1

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0.1 inch 49

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STRAIGHT 49

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Number of Contacts (2)

20 1 120 52

Min - Max

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85.0 °C 1 140.0 °C 24 150.0 °C 3 260.0 °C 21

Min (°C) - Max (°C)

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-60.0 °C 48 -40.0 °C 1

Min (°C) - Max (°C)

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RECTANGULAR 49

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100 µm 48 300 µm 1

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Active 1 Obsolete 52

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No 52

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Terminal Pitch (1)

2.54 mm 49

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SOLDER 49

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