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COM20019I3V-HT
Microchip Technology Inc
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$9.4869 | Yes | Active | 2048 | 8051; 6801 | 8 | 3 | 0.0390625 MBps | 20 MHz | YES | 3.3 V | SERIAL IO/COMMUNICATION CONTROLLER, LAN | CMOS | NO | ASYNC, BIT | NO | 1 | 8 | 3.465 V | 3.135 V | INDUSTRIAL | S-PQFP-G48 | Not Qualified | e3 | 85 °C | -40 °C | 260 | 48 | PLASTIC/EPOXY | LFQFP | QFP48,.35SQ,20 | SQUARE | FLATPACK, LOW PROFILE, FINE PITCH | MATTE TIN | GULL WING | 500 µm | QUAD | 1.6 mm | 7 mm | 7 mm | MICROCHIP TECHNOLOGY INC | QFP | ROHS COMPLIANT, TQFP-48 | 48 | compliant | EAR99 | 8542.31.00.01 | Microchip | ||||||||
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COM20019I-DZD-TR
Microchip Technology Inc
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$9.6045 | Yes | Yes | Active | 2048 | 8051; 6801 | 8 | 3 | 0.0390625 MBps | 20 MHz | YES | 3.3 V | SERIAL IO/COMMUNICATION CONTROLLER, LAN | CMOS | NO | ASYNC, BIT; ETHERNET | NO | 1 | 8 | 3.465 V | 3.135 V | INDUSTRIAL | S-PQCC-J28 | e3 | 85 °C | -40 °C | TS 16949 | 28 | PLASTIC/EPOXY | QCCJ | LDCC28,.5SQ | SQUARE | CHIP CARRIER | MATTE TIN | J BEND | 1.27 mm | QUAD | 4.572 mm | 11.51 mm | 11.51 mm | MICROCHIP TECHNOLOGY INC | QLCC | LCC-28 | 28 | compliant | EAR99 | 8542.31.00.01 | Microchip | ||||||||
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COM20019I-DZD
Microchip Technology Inc
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$10.8054 | Yes | Active | 2048 | 8051; 6801 | 8 | 3 | 0.0390625 MBps | 20 MHz | YES | 3.3 V | SERIAL IO/COMMUNICATION CONTROLLER, LAN | CMOS | NO | ETHERNET | NO | 1 | 8 | 3.465 V | 3.135 V | INDUSTRIAL | S-PQCC-J28 | Not Qualified | e3 | 85 °C | -40 °C | TS 16949 | 28 | PLASTIC/EPOXY | QCCJ | LDCC28,.5SQ | SQUARE | CHIP CARRIER | MATTE TIN | J BEND | 1.27 mm | QUAD | 4.572 mm | 11.51 mm | 11.51 mm | MICROCHIP TECHNOLOGY INC | QLCC | LCC-28 | 28 | compliant | EAR99 | 8542.31.00.01 | Microchip | ||||||||
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COM20019I3VLJP
SMSC
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Check for Price | Transferred | 8051; 6801 | 8 | 8 | 0.03814697265625 MBps | 20 MHz | YES | 3.3 V | SERIAL IO/COMMUNICATION CONTROLLER, LAN | CMOS | NO | NO | 1 | 3.465 V | 3.135 V | INDUSTRIAL | S-PQCC-N28 | Not Qualified | 85 °C | -40 °C | 28 | PLASTIC/EPOXY | QCCN | SQUARE | CHIP CARRIER | NO LEAD | 1.27 mm | QUAD | 4.572 mm | 11.5062 mm | 11.5062 mm | STANDARD MICROSYSTEMS CORP | QLCC | QCCN, | 28 | unknown | 8542.31.00.01 | ||||||||||||||||||
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COM20019I-HT
Microchip Technology Inc
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Check for Price | Yes | Active | 1024 | 8051; 6801 | 8 | 3 | 0.3125 MBps | 20 MHz | YES | 3.3 V | SERIAL IO/COMMUNICATION CONTROLLER, LAN | CMOS | NO | MIL STD 1553A; MIL STD 1553B; MIL STD 1760; STANAG 3838 | NO | 1 | 8 | 3.465 V | 3.135 V | INDUSTRIAL | S-PQFP-G48 | 85 °C | -40 °C | TS 16949 | 48 | PLASTIC/EPOXY | LQFP | QFP48,.35SQ,20 | SQUARE | FLATPACK, LOW PROFILE | GULL WING | 500 µm | QUAD | 1.6 mm | 7 mm | 7 mm | MICROCHIP TECHNOLOGY INC | TQFP-48 | compliant | 8542.31.00.01 | |||||||||||||||
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COM20019I3V-HD
SMSC
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Check for Price | Obsolete | 8051; 6801 | 8 | 8 | 0.03814697265625 MBps | 20 MHz | YES | 3.3 V | SERIAL IO/COMMUNICATION CONTROLLER, LAN | CMOS | NO | NO | 1 | 3.465 V | 3.135 V | INDUSTRIAL | S-PQFP-G48 | Not Qualified | 85 °C | -40 °C | 48 | PLASTIC/EPOXY | LFQFP | SQUARE | FLATPACK, LOW PROFILE, FINE PITCH | GULL WING | 500 µm | QUAD | 1.6 mm | 7 mm | 7 mm | STANDARD MICROSYSTEMS CORP | QFP | LFQFP, | 48 | unknown | 8542.31.00.01 | ||||||||||||||||||
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COM20019I-HD
SMSC
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Check for Price | No | Obsolete | 8051; 6801 | 8 | 3 | 0.03814697265625 MBps | 20 MHz | YES | 5 V | SERIAL IO/COMMUNICATION CONTROLLER, LAN | CMOS | NO | NO | 1 | 5.5 V | 4.5 V | INDUSTRIAL | S-PQFP-G48 | Not Qualified | e0 | 3 | 85 °C | -40 °C | 235 | 48 | PLASTIC/EPOXY | LFQFP | QFP48,.35SQ,20 | SQUARE | FLATPACK, LOW PROFILE, FINE PITCH | TIN LEAD | GULL WING | 500 µm | QUAD | 1.6 mm | 7 mm | 7 mm | STANDARD MICROSYSTEMS CORP | QFP | LFQFP, QFP48,.35SQ,20 | 48 | compliant | 8542.31.00.01 | ||||||||||||
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COM20019I-DZD-TR
SMSC
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Check for Price | Yes | Yes | Transferred | 8051; 6801 | 8 | 3 | 0.03814697265625 MBps | 20 MHz | YES | 5 V | SERIAL IO/COMMUNICATION CONTROLLER, LAN | CMOS | NO | NO | 1 | 5.5 V | 4.5 V | INDUSTRIAL | S-PQCC-J28 | 85 °C | -40 °C | NOT SPECIFIED | NOT SPECIFIED | 28 | PLASTIC/EPOXY | QCCJ | SQUARE | CHIP CARRIER | J BEND | 1.27 mm | QUAD | 4.572 mm | 11.5062 mm | 11.5062 mm | STANDARD MICROSYSTEMS CORP | QLCC | QCCJ, | 28 | unknown | 8542.31.00.01 | |||||||||||||||
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COM20019I-DZD
SMSC
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Check for Price | Yes | Transferred | 8051; 6801 | 8 | 3 | 0.03814697265625 MBps | 20 MHz | YES | 5 V | SERIAL IO/COMMUNICATION CONTROLLER, LAN | CMOS | NO | NO | 1 | 5.5 V | 4.5 V | INDUSTRIAL | S-PQCC-J28 | Not Qualified | 85 °C | -40 °C | NOT SPECIFIED | NOT SPECIFIED | 28 | PLASTIC/EPOXY | QCCJ | SQUARE | CHIP CARRIER | J BEND | 1.27 mm | QUAD | 4.572 mm | 11.5062 mm | 11.5062 mm | STANDARD MICROSYSTEMS CORP | QLCC | QCCJ, | 28 | compliant | 8542.31.00.01 | |||||||||||||||
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COM20019ILJP
SMSC
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Check for Price | No | Obsolete | 8051; 6801 | 8 | 3 | 0.03814697265625 MBps | 20 MHz | YES | 5 V | SERIAL IO/COMMUNICATION CONTROLLER, LAN | CMOS | NO | NO | 1 | 5 V | 50 mA | 5.5 V | 4.5 V | INDUSTRIAL | S-PQCC-J28 | Not Qualified | e0 | 85 °C | -40 °C | NOT SPECIFIED | NOT SPECIFIED | 28 | PLASTIC/EPOXY | QCCJ | LDCC28,.5SQ | SQUARE | CHIP CARRIER | Tin/Lead (Sn/Pb) | J BEND | 1.27 mm | QUAD | 4.572 mm | 11.5062 mm | 11.5062 mm | STANDARD MICROSYSTEMS CORP | QLCC | QCCJ, LDCC28,.5SQ | 28 | compliant |