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CIS066-04TT
Advanced Interconnections Corp
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Check for Price | No | Obsolete | 66 | BERYLLIUM COPPER ALLOY | 2.54 mm | IC SOCKET | PGA66 | STANDARD: UL 94V-0 | e0 | 140 °C | -60 °C | 11X11 | TIN LEAD OVER NICKEL | Tin/Lead (Sn/Pb) - with Nickel (Ni) barrier | RND PIN-SKT | THERMOPLASTIC POLYESTER | 0.1 inch | STRAIGHT | RECTANGULAR | 100 µm | SOLDER | 0.12 inch | 1.1 inch | 1.1 inch | ADVANCED INTERCONNECTIONS CORP | not_compliant | EAR99 | 8536.69.40.40 | ||
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1CIS066-04TT
Advanced Interconnections Corp
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Check for Price | No | Obsolete | 66 | BERYLLIUM COPPER ALLOY | 2.54 mm | IC SOCKET | PGA66 | STANDARD: UL 94V-0 | e0 | 140 °C | -60 °C | 11X11 | TIN LEAD OVER NICKEL | Tin/Lead (Sn/Pb) - with Nickel (Ni) barrier | RND PIN-SKT | THERMOPLASTIC POLYESTER | 0.1 inch | STRAIGHT | RECTANGULAR | 100 µm | SOLDER | 0.12 inch | 1.1 inch | 1.1 inch | ADVANCED INTERCONNECTIONS CORP | not_compliant | EAR99 | 8536.69.40.40 | ||
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HCIS066-04TT
Advanced Interconnections Corp
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Check for Price | No | Obsolete | 66 | BE-CU | 2.54 mm | IC SOCKET | PGA66 | 1.0 OZ. AVG. INSERTION FORCE | e0 | 260 °C | -60 °C | 11X11 | SN-PB ON NI | Tin/Lead (Sn/Pb) - with Nickel (Ni) barrier | RND PIN-SKT | GLASS FILLED THERMOPLASTIC | 0.1 inch | STRAIGHT | RECTANGULAR | 100 µm | SOLDER | 0.12 inch | 1.1 inch | 1.1 inch | ADVANCED INTERCONNECTIONS CORP | compliant | EAR99 | 8536.69.40.40 | ||
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1-HCIS066-04TT
Advanced Interconnections Corp
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Check for Price | No | Obsolete | 66 | BE-CU | 2.54 mm | IC SOCKET | PGA66 | 1.0 OZ. AVG. INSERTION FORCE | e0 | 260 °C | -60 °C | 11X11 | SN-PB ON NI | Tin/Lead (Sn/Pb) - with Nickel (Ni) barrier | RND PIN-SKT | GLASS FILLED THERMOPLASTIC | 0.1 inch | STRAIGHT | RECTANGULAR | 100 µm | SOLDER | 0.12 inch | 1.1 inch | 1.1 inch | ADVANCED INTERCONNECTIONS CORP | compliant | EAR99 | 8536.69.40.40 |