Filter Your Search
1 - 4 of 4 results
Select Parts | Part Number |
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CDLL968B
Microchip Technology Inc
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CDLL968BE3
Microsemi Corporation
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CDLL968B
Microsemi Corporation
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CDLL968B
Compensated Devices Inc
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Most Relevant | Technical | Compliance | Operating Conditions | Physical | Other | ||||||||||||||||||||||||||||||||||
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Composite Price
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Pbfree Code
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Rohs Code
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Part Life Cycle Code
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Working Test Current
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Reverse Current-Max
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Power Dissipation-Max
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Reference Voltage-Nom
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Diode Element Material
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Diode Type | Polarity | Configuration |
Surface Mount
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Number of Elements | Technology |
Additional Feature
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Knee Impedance-Max
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Voltage Tol-Max
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Qualification Status
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JESD-30 Code
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JESD-609 Code
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JEDEC-95 Code
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Operating Temperature-Max
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Operating Temperature-Min
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Case Connection
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Number of Terminals
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Package Body Material
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Package Shape
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Package Style
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Terminal Finish
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Terminal Form
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Terminal Position
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Ihs Manufacturer
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Package Description
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Reach Compliance Code
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ECCN Code
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HTS Code
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Part Package Code
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Pin Count
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No | Active | 6.2 mA | 500 mW | 20 V | SILICON | ZENER DIODE | UNIDIRECTIONAL | SINGLE | YES | 1 | ZENER | METALLURGICALLY BONDED | 5 % | Not Qualified | O-LELF-R2 | e0 | DO-213AA | 175 °C | -65 °C | ISOLATED | 2 | GLASS | ROUND | LONG FORM | TIN LEAD | WRAP AROUND | END | MICROCHIP TECHNOLOGY INC | HERMETIC SEALED, GLASS, LL34, MELF-2 | compliant | ||||||||
Transferred | 6.2 mA | 500 mW | 20 V | SILICON | ZENER DIODE | UNIDIRECTIONAL | SINGLE | YES | 1 | ZENER | METALLURGICALLY BONDED | 5 % | O-LELF-R2 | DO-213AA | ISOLATED | 2 | GLASS | ROUND | LONG FORM | WRAP AROUND | END | MICROSEMI CORP | O-LELF-R2 | compliant | EAR99 | 8541.10.00.50 | ||||||||||||
No | No | Transferred | 6.2 mA | 500 mW | 20 V | SILICON | ZENER DIODE | UNIDIRECTIONAL | SINGLE | YES | 1 | ZENER | METALLURGICALLY BONDED | 5 % | Not Qualified | O-LELF-R2 | e0 | DO-213AA | 175 °C | -65 °C | ISOLATED | 2 | GLASS | ROUND | LONG FORM | TIN LEAD | WRAP AROUND | END | MICROSEMI CORP | HERMETIC SEALED, GLASS, LL34, MELF-2 | unknown | EAR99 | 8541.10.00.50 | DO-213AA | 2 | |||
Transferred | 6.2 mA | 500 nA | 500 mW | 20 V | SILICON | ZENER DIODE | UNIDIRECTIONAL | SINGLE | YES | 1 | ZENER | METALLURGICALLY BONDED | 750 Ω | 5 % | Not Qualified | O-LELF-R2 | e0 | DO-213AA | 175 °C | -65 °C | ISOLATED | 2 | GLASS | ROUND | LONG FORM | TIN LEAD | WRAP AROUND | END | COMPENSATED DEVICES INC | HERMETIC SEALED, GLASS, LL34, MELF-2 | unknown |
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CDLL968B
Microchip Technology Inc
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$2.9623 Buy | No | Active | 6.2 mA | 500 mW | 20 V | SILICON | ZENER DIODE | UNIDIRECTIONAL | SINGLE | YES | 1 | ZENER | METALLURGICALLY BONDED | 5 % | Not Qualified | O-LELF-R2 | e0 | DO-213AA | 175 °C | -65 °C | ISOLATED | 2 | GLASS | ROUND | LONG FORM | TIN LEAD | WRAP AROUND | END | MICROCHIP TECHNOLOGY INC | HERMETIC SEALED, GLASS, LL34, MELF-2 | compliant | |||||||||
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CDLL968BE3
Microsemi Corporation
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Check for Price Buy | Transferred | 6.2 mA | 500 mW | 20 V | SILICON | ZENER DIODE | UNIDIRECTIONAL | SINGLE | YES | 1 | ZENER | METALLURGICALLY BONDED | 5 % | O-LELF-R2 | DO-213AA | ISOLATED | 2 | GLASS | ROUND | LONG FORM | WRAP AROUND | END | MICROSEMI CORP | O-LELF-R2 | compliant | EAR99 | 8541.10.00.50 | |||||||||||||
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CDLL968B
Microsemi Corporation
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Check for Price Buy | No | No | Transferred | 6.2 mA | 500 mW | 20 V | SILICON | ZENER DIODE | UNIDIRECTIONAL | SINGLE | YES | 1 | ZENER | METALLURGICALLY BONDED | 5 % | Not Qualified | O-LELF-R2 | e0 | DO-213AA | 175 °C | -65 °C | ISOLATED | 2 | GLASS | ROUND | LONG FORM | TIN LEAD | WRAP AROUND | END | MICROSEMI CORP | HERMETIC SEALED, GLASS, LL34, MELF-2 | unknown | EAR99 | 8541.10.00.50 | DO-213AA | 2 | ||||
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CDLL968B
Compensated Devices Inc
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Check for Price Buy | Transferred | 6.2 mA | 500 nA | 500 mW | 20 V | SILICON | ZENER DIODE | UNIDIRECTIONAL | SINGLE | YES | 1 | ZENER | METALLURGICALLY BONDED | 750 Ω | 5 % | Not Qualified | O-LELF-R2 | e0 | DO-213AA | 175 °C | -65 °C | ISOLATED | 2 | GLASS | ROUND | LONG FORM | TIN LEAD | WRAP AROUND | END | COMPENSATED DEVICES INC | HERMETIC SEALED, GLASS, LL34, MELF-2 | unknown |