Parametric results for: CD4532 under Arithmetic Circuits

All Filters Additional Feature Family JESD-30 Code JESD-609 Code Length Load Capacitance (CL) Logic IC Type Manufacturer Max I(ol) Moisture Sensitivity Level Number of Bits Number of Functions Number of Terminals Operating Temperature-Max Operating Temperature-Min Output Polarity Package Body Material Package Code Package Equivalence Code Package Shape Package Style Prop. Delay@Nom-Sup Propagation Delay (tpd) Supply Voltage-Nom (Vsup) Surface Mount

8 TO 3 LINE PRIORITY ENCODER 9 8 TO 3 LINE PRIORITY ENCODER; CASCADABLE 1 8 TO 3 LINE PRIORITY ENCODER; CASCADABLE; WITH GROUP SELECT 1 8 TO 3 LINE PRIORITY ENCODER; CASCADABLE; WITH GROUP SELECT OUTPUT; RADIATION HARDENED 8

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Family (1)

4000/14000/40000 39

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R-CDFP-F16 3 R-CDIP-T16 9 R-GDIP-T16 5 R-PDIP-T16 16 R-PDSO-G16 18 R-XDFP-F16 8 R-XDIP-T16 17 R-XUUC-N16 2 S-XQCC-N20 2

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e0 53 e4 17

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5 mm 6 9.9 mm 9 10.2 mm 3 19.05 mm 1 19.17 mm 1 19.305 mm 2 19.56 mm 1

Min (mm) - Max (mm)

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Load Capacitance (CL) (1)

50 pF 15

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ENCODER 80

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Manufacturer (6)

General Electric Solid State 5 Harris Semiconductor 17 Intersil Corporation 19 RCA 19 Texas Instruments 24 Thomson Consumer Electronics 3

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1.5 mA 9

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1 15

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Number of Bits (1)

8 39

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Number of Functions (1)

1.0 39

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16 78 20 2

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85.0 °C 13 125.0 °C 67

Min (°C) - Max (°C)

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-55.0 °C 67 -40.0 °C 13

Min (°C) - Max (°C)

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INVERTED 23 TRUE 2

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CERAMIC 27 CERAMIC, GLASS-SEALED 5 CERAMIC, METAL-SEALED COFIRED 12 PLASTIC/EPOXY 34 UNSPECIFIED 2

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Package Code (6)

DFP 11 DIE 2 DIP 47 QCCN 2 SOP 12 TSSOP 6

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DIE OR CHIP 2 DIP16,.3 47 FL16,.3 11 LCC20,.35SQ 2 SOP16,.25 9 SOP16,.3 3 TSSOP16,.25 6

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RECTANGULAR 78 SQUARE 2

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CHIP CARRIER 2 FLATPACK 11 IN-LINE 47 SMALL OUTLINE 12 SMALL OUTLINE, THIN PROFILE, SHRINK PITCH 6 UNCASED CHIP 2

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Prop. Delay@Nom-Sup (1)

110 ns 9

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Propagation Delay (tpd) (2)

440 ns 30 594 ns 9

Min (ns) - Max (ns)

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Supply Voltage-Nom (Vsup) (1)

5 V 38

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Surface Mount (2)

NO 47 YES 33

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