Parametric results for: BZV55-C27 under Zener Diodes
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BZV55C27
Luguang Electronic Technology Co Ltd
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$0.0132 | Active | MINIMELF | MINIMELF | ||||||||||||||||||||||||||||||||||||||||||||||
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BZV55-C27,135
Nexperia
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$0.0271 | Yes | Active | 2 mA | 400 mW | 27 V | SILICON | ZENER DIODE | UNIDIRECTIONAL | SINGLE | YES | 1 | ZENER | 5 % | O-LELF-R2 | e3 | IEC-60134 | 1 | 200 °C | -65 °C | 260 | 30 | ISOLATED | 2 | GLASS | ROUND | LONG FORM | TIN | WRAP AROUND | END | MELF | SOD80C | NEXPERIA | 2 | compliant | EAR99 | 8541.10.00.50 | Nexperia | ||||||||||||
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BZV55C27
DC Components Co Ltd
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$0.0337 | Contact Manufacturer | DC COMPONENTS CO LTD | unknown | MELF-2 | |||||||||||||||||||||||||||||||||||||||||||||
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BZV55-C27,115
Nexperia
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$0.0603 | Yes | Active | 2 mA | 400 mW | 27 V | SILICON | ZENER DIODE | UNIDIRECTIONAL | SINGLE | YES | 1 | ZENER | 5 % | O-LELF-R2 | e3 | IEC-60134 | 1 | 200 °C | -65 °C | 260 | 30 | ISOLATED | 2 | GLASS | ROUND | LONG FORM | TIN | WRAP AROUND | END | MELF | SOD80C | NEXPERIA | 2 | compliant | EAR99 | 8541.10.00.50 | Nexperia | ||||||||||||
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BZV55-C27,115
NXP Semiconductors
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$0.0644 | Yes | Transferred | 2 mA | 50 nA | 400 mW | 27 V | SILICON | ZENER DIODE | UNIDIRECTIONAL | SINGLE | YES | 1 | ZENER | 80 Ω | 25.3 mV/°C | 5 % | Not Qualified | O-LELF-R2 | e3 | 1 | 200 °C | -65 °C | 260 | 30 | ISOLATED | 2 | GLASS | ROUND | LONG FORM | Tin (Sn) | WRAP AROUND | END | MELF | SOD80C | NXP SEMICONDUCTORS | 2 | compliant | EAR99 | 8541.10.00.50 | HERMETIC SEALED, GLASS PACKAGE-2 | |||||||||
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BZV55C27-TP
Micro Commercial Components
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$0.1008 | Yes | Yes | Obsolete | 5 mA | 100 pA | 500 mW | 27 V | SILICON | ZENER DIODE | UNIDIRECTIONAL | SINGLE | YES | 1 | ZENER | HIGH RELIABILITY | 80 Ω | 220 Ω | Not Qualified | O-LELF-R2 | e3 | 1 | 150 °C | -55 °C | 260 | 10 | ISOLATED | 2 | GLASS | ROUND | LONG FORM | Matte Tin (Sn) | WRAP AROUND | END | MELF | MICRO COMMERCIAL COMPONENTS | 2 | compliant | EAR99 | 8541.10.00.50 | O-LELF-R2 | |||||||||
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BZV55C27
Microsemi Corporation
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$3.0109 | No | Transferred | 2 mA | 500 mW | 27 V | SILICON | ZENER DIODE | UNIDIRECTIONAL | SINGLE | YES | 1 | ZENER | METALLURGICALLY BONDED | 7.04 % | Not Qualified | O-LELF-R2 | e0 | DO-213AA | ISOLATED | 2 | GLASS | ROUND | LONG FORM | TIN LEAD | WRAP AROUND | END | MICROSEMI CORP | unknown | Microsemi Corporation | HERMETIC SEALED, GLASS, SOD-80, LL34, MELF-2 | |||||||||||||||||||
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BZV55C27
Microchip Technology Inc
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$3.0123 | No | Active | 2 mA | 500 mW | 27 V | SILICON | ZENER DIODE | UNIDIRECTIONAL | SINGLE | YES | 1 | ZENER | METALLURGICALLY BONDED | 7.04 % | Not Qualified | O-LELF-R2 | e0 | DO-213AA | ISOLATED | 2 | GLASS | ROUND | LONG FORM | TIN LEAD | WRAP AROUND | END | MICROCHIP TECHNOLOGY INC | compliant | HERMETIC SEALED, GLASS, SOD-80, LL34, MELF-2 | ||||||||||||||||||||
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BZV55C27/TR
Microchip Technology Inc
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$3.2173 | No | Active | 2 mA | 50 nA | 27 V | SILICON | ZENER DIODE | UNIDIRECTIONAL | SINGLE | YES | 1 | ZENER | METALLURGICALLY BONDED | 80 Ω | 18.9 V | 7.04 % | O-LELF-R2 | DO-213AA | 175 °C | -65 °C | NOT SPECIFIED | NOT SPECIFIED | ISOLATED | 2 | GLASS | ROUND | LONG FORM | WRAP AROUND | END | MICROCHIP TECHNOLOGY INC | compliant | SOD-80, MELF-2 | |||||||||||||||||
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BZV55C27
SPC Multicomp
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Check for Price | Contact Manufacturer | 2 mA | 400 mW | 27 V | SILICON | ZENER DIODE | UNIDIRECTIONAL | SINGLE | YES | 1 | ZENER | 5 % | O-LELF-R2 | 200 °C | ISOLATED | 2 | GLASS | ROUND | LONG FORM | WRAP AROUND | END | MULTICOMP PRO | 2 | unknown | EAR99 | 8541.10.00.50 | HERMETIC SEALED, GLASS PACKAGE-2 |