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Parametric » Telecommunication Circuits » Other Telecom ICs

Parametric results for: BGM15LA12 under Other Telecom ICs

Select parts from the table below to compare.

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Select Parts		Part Number

		BGM15LA12 Infineon Technologies AG
		BGM15LA12E6327 Infineon Technologies AG
		BGM15LA12E6327XTSA1 Infineon Technologies AG

				Most Relevant		Technical		Compliance		Operating Conditions			Physical										Dimensions			Other
Composite Price	Pbfree Code	Rohs Code	Part Life Cycle Code	Supply Voltage-Nom	Telecom IC Type	Number of Functions	Temperature Grade	JESD-30 Code	JESD-609 Code	Moisture Sensitivity Level	Operating Temperature-Max	Operating Temperature-Min	Number of Terminals	Package Body Material	Package Code	Package Shape	Package Style	Surface Mount	Terminal Finish	Terminal Form	Terminal Pitch	Terminal Position	Width	Length	Seated Height-Max	Ihs Manufacturer	Package Description	Reach Compliance Code	HTS Code	Samacsys Manufacturer

Check for Price

Yes

Obsolete

2.8 V

TELECOM CIRCUIT

1

INDUSTRIAL

R-XBCC-B12

e4

1

85 °C

-40 °C

12

UNSPECIFIED

BCC

RECTANGULAR

CHIP CARRIER

YES

GOLD NICKEL

BUTT

400 µm

BOTTOM

1.1 mm

1.9 mm

650 µm

INFINEON TECHNOLOGIES AG

1.90 X 1.10 MM, ROHS COMPLIANT, ATSLP-13/12

compliant

8542.39.00.01

Check for Price

Obsolete

2.8 V

TELECOM CIRCUIT

1

INDUSTRIAL

R-XBCC-B12

85 °C

-40 °C

12

UNSPECIFIED

BCC

RECTANGULAR

CHIP CARRIER

YES

BUTT

400 µm

BOTTOM

1.1 mm

1.9 mm

650 µm

INFINEON TECHNOLOGIES AG

1.90 X 1.10 MM, ROHS COMPLIANT, ATSLP-13/12

compliant

8542.39.00.01

Check for Price

Yes

Yes

Obsolete

2.8 V

TELECOM CIRCUIT

1

INDUSTRIAL

R-XBCC-B12

e4

1

85 °C

-40 °C

12

UNSPECIFIED

BCC

RECTANGULAR

CHIP CARRIER

YES

GOLD NICKEL

BUTT

400 µm

BOTTOM

1.1 mm

1.9 mm

650 µm

INFINEON TECHNOLOGIES AG

1.90 X 1.10 MM, ROHS COMPLIANT, ATSLP-13/12

compliant

8542.39.00.01

Infineon

Compare

Infineon Technologies AG

Check for Price

Yes

Obsolete

2.8 V

TELECOM CIRCUIT

1

INDUSTRIAL

R-XBCC-B12

e4

1

85 °C

-40 °C

12

UNSPECIFIED

BCC

RECTANGULAR

CHIP CARRIER

YES

GOLD NICKEL

BUTT

400 µm

BOTTOM

1.1 mm

1.9 mm

650 µm

INFINEON TECHNOLOGIES AG

1.90 X 1.10 MM, ROHS COMPLIANT, ATSLP-13/12

compliant

8542.39.00.01

Infineon Technologies AG

Check for Price

Obsolete

2.8 V

TELECOM CIRCUIT

1

INDUSTRIAL

R-XBCC-B12

85 °C

-40 °C

12

UNSPECIFIED

BCC

RECTANGULAR

CHIP CARRIER

YES

BUTT

400 µm

BOTTOM

1.1 mm

1.9 mm

650 µm

INFINEON TECHNOLOGIES AG

1.90 X 1.10 MM, ROHS COMPLIANT, ATSLP-13/12

compliant

8542.39.00.01

Telecommunication Circuits

BGM15LA12E6327XTSA1

Infineon Technologies AG

Check for Price

Yes

Yes

Obsolete

2.8 V

TELECOM CIRCUIT

1

INDUSTRIAL

R-XBCC-B12

e4

1

85 °C

-40 °C

12

UNSPECIFIED

BCC

RECTANGULAR

CHIP CARRIER

YES

GOLD NICKEL

BUTT

400 µm

BOTTOM

1.1 mm

1.9 mm

650 µm

INFINEON TECHNOLOGIES AG

1.90 X 1.10 MM, ROHS COMPLIANT, ATSLP-13/12

compliant

8542.39.00.01

Infineon