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AT24C04D-XHM-B
Microchip Technology Inc
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$0.0868 | Yes | Yes | Active | 4.096 kbit | 8 | 512X8 | 3 V | 1 MHz | EEPROM | 1.7V TO 3.6V @ 0.1MHz AND 1.7V TO 3.6V @ 0.4MHz | YES | 100 | 1000000 Write/Erase Cycles | 1010DDXR | 1 | 1 | 512 | 512 words | SYNCHRONOUS | OPEN-DRAIN | 16 words | SERIAL | 3 V | I2C | 800 nA | 1 µA | 3.6 V | 2.5 V | CMOS | INDUSTRIAL | 5 ms | HARDWARE | R-PDSO-G8 | Not Qualified | e4 | 1 | 85 °C | -40 °C | 8 | PLASTIC/EPOXY | TSSOP | TSSOP8,.25 | RECTANGULAR | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | YES | NICKEL PALLADIUM GOLD | GULL WING | 650 µm | DUAL | 1.2 mm | 4.4 mm | 3 mm | MICROCHIP TECHNOLOGY INC | TSSOP-8 | compliant | Microchip | |||||||||
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AT24C04C-XHM-B
Atmel Corporation
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$0.1200 | Yes | Yes | Transferred | 4.096 kbit | 8 | 512X8 | 5 V | 1 MHz | EEPROM | 100 | 1000000 Write/Erase Cycles | 1010DDXR | 1 | 512 | 512 words | SYNCHRONOUS | SERIAL | I2C | 1 µA | 3 µA | 5.5 V | 1.7 V | CMOS | INDUSTRIAL | 5 ms | HARDWARE | R-PDSO-G8 | Not Qualified | e4 | 1 | 85 °C | -40 °C | 260 | 40 | 8 | PLASTIC/EPOXY | TSSOP | TSSOP8,.25 | RECTANGULAR | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | YES | Nickel/Palladium/Gold (Ni/Pd/Au) | GULL WING | 650 µm | DUAL | 1.2 mm | 4.4 mm | 3 mm | ATMEL CORP | TSSOP, TSSOP8,.25 | compliant | Microchip | TSSOP | 8 | EAR99 | 8542.32.00.51 | |||||||||
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AT24C04C-PUM
Atmel Corporation
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$0.1212 | Yes | Yes | Transferred | 4.096 kbit | 8 | 512X8 | 5 V | 1 MHz | EEPROM | 100 | 1000000 Write/Erase Cycles | 1010DDXR | 1 | 512 | 512 words | SYNCHRONOUS | SERIAL | I2C | 1 µA | 3 µA | 5.5 V | 1.7 V | CMOS | INDUSTRIAL | 5 ms | HARDWARE | R-PDIP-T8 | Not Qualified | e3 | 85 °C | -40 °C | NOT SPECIFIED | NOT SPECIFIED | 8 | PLASTIC/EPOXY | DIP | DIP8,.3 | RECTANGULAR | IN-LINE | NO | Matte Tin (Sn) | THROUGH-HOLE | 2.54 mm | DUAL | 5.334 mm | 9.271 mm | 7.62 mm | ATMEL CORP | DIP, DIP8,.3 | unknown | Microchip | DIP | 8 | EAR99 | 8542.32.00.51 | ||||||||||
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AT24C04C-SSHM-B
Atmel Corporation
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$0.1223 | Yes | Yes | Transferred | 4.096 kbit | 8 | 512X8 | 5 V | 1 MHz | EEPROM | 100 | 1000000 Write/Erase Cycles | 1010DDXR | 1 | 512 | 512 words | SYNCHRONOUS | SERIAL | I2C | 1 µA | 3 µA | 5.5 V | 1.7 V | CMOS | INDUSTRIAL | 5 ms | HARDWARE | R-PDSO-G8 | Not Qualified | e4 | 1 | 85 °C | -40 °C | 260 | 40 | 8 | PLASTIC/EPOXY | SOP | SOP8,.25 | RECTANGULAR | SMALL OUTLINE | YES | Nickel/Palladium/Gold (Ni/Pd/Au) | GULL WING | 1.27 mm | DUAL | 1.75 mm | 4.92 mm | 3.9 mm | ATMEL CORP | SOP, SOP8,.25 | compliant | Microchip | SOIC | 8 | EAR99 | 8542.32.00.51 | |||||||||
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AT24C04D-XHM-T
Microchip Technology Inc
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$0.1315 | Yes | Yes | Active | 4.096 kbit | 8 | 512X8 | 3 V | 1 MHz | EEPROM | 1.7V TO 3.6V @ 0.1MHz AND 1.7V TO 3.6V @ 0.4MHz | YES | 100 | 1000000 Write/Erase Cycles | 1010DDXR | 1 | 1 | 512 | 512 words | SYNCHRONOUS | OPEN-DRAIN | 16 words | SERIAL | 3 V | I2C | 800 nA | 1 µA | 3.6 V | 2.5 V | CMOS | INDUSTRIAL | 5 ms | HARDWARE | R-PDSO-G8 | Not Qualified | e4 | 1 | 85 °C | -40 °C | 8 | PLASTIC/EPOXY | TSSOP | TSSOP8,.25 | RECTANGULAR | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | YES | NICKEL PALLADIUM GOLD | GULL WING | 650 µm | DUAL | 1.2 mm | 4.4 mm | 3 mm | MICROCHIP TECHNOLOGY INC | TSSOP-8 | compliant | Microchip | |||||||||
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AT24C04D-SSHM-T
Microchip Technology Inc
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$0.1504 | Yes | Yes | Active | 4.096 kbit | 8 | 512X8 | 3 V | 1 MHz | EEPROM | 1.7V TO 3.6V @ 0.1MHz AND 1.7V TO 3.6V @ 0.4MHz | YES | 100 | 1000000 Write/Erase Cycles | 1010DDXR | 1 | 1 | 512 | 512 words | SYNCHRONOUS | OPEN-DRAIN | 16 words | SERIAL | 3 V | I2C | 800 nA | 1 µA | 3.6 V | 2.5 V | CMOS | INDUSTRIAL | 5 ms | HARDWARE | R-PDSO-G8 | Not Qualified | e4 | 3 | 85 °C | -40 °C | 8 | PLASTIC/EPOXY | SOP | SOP8,.23 | RECTANGULAR | SMALL OUTLINE | YES | NICKEL PALLADIUM GOLD | GULL WING | 1.27 mm | DUAL | 1.75 mm | 4.925 mm | 3.9 mm | MICROCHIP TECHNOLOGY INC | compliant | Microchip | ||||||||||
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CAT24C04YI-G
onsemi
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$0.1673 | Yes | Yes | Active | 4.096 kbit | 8 | 512X8 | 3.3 V | 400 kHz | EEPROM | 100 | 1000000 Write/Erase Cycles | 1010DDMR | 1 | 512 | 512 words | SYNCHRONOUS | SERIAL | I2C | 1 µA | 2 µA | 5.5 V | 1.7 V | CMOS | INDUSTRIAL | 5 ms | HARDWARE | R-PDSO-G8 | Not Qualified | e4 | 1 | 85 °C | -40 °C | 260 | 30 | 8 | PLASTIC/EPOXY | TSSOP | TSSOP8,.25 | RECTANGULAR | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | YES | NICKEL PALLADIUM GOLD | GULL WING | 650 µm | DUAL | 1.2 mm | 4.4 mm | 3 mm | ONSEMI | TSSOP-8 | compliant | onsemi | TSSOP | 8 | EAR99 | 8542.32.00.51 | 948AL | ||||||||
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AT24C04D-MAHM-T
Microchip Technology Inc
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$0.1759 | Yes | Yes | Active | 4.096 kbit | 8 | 512X8 | 3 V | 1 MHz | EEPROM | 1.7V TO 3.6V @ 0.1MHz AND 1.7V TO 3.6V @ 0.4MHz | YES | 100 | 1000000 Write/Erase Cycles | 1010DDXR | 1 | 1 | 512 | 512 words | SYNCHRONOUS | OPEN-DRAIN | 16 words | SERIAL | 3 V | I2C | 800 nA | 1 µA | 3.6 V | 2.5 V | CMOS | INDUSTRIAL | 5 ms | HARDWARE | R-PDSO-N8 | Not Qualified | e4 | 1 | 85 °C | -40 °C | 260 | 40 | 8 | PLASTIC/EPOXY | HVSON | SOLCC8,.12,20 | RECTANGULAR | SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE | YES | NICKEL PALLADIUM GOLD | NO LEAD | 500 µm | DUAL | 600 µm | 3 mm | 2 mm | MICROCHIP TECHNOLOGY INC | UDFN-8 | compliant | Microchip | |||||||
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AT24C04D-SSHM-B
Microchip Technology Inc
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$0.2038 | Yes | Yes | Active | 4.096 kbit | 8 | 512X8 | 3 V | 1 MHz | EEPROM | 1.7V TO 3.6V @ 0.1MHz AND 1.7V TO 3.6V @ 0.4MHz | YES | 100 | 1000000 Write/Erase Cycles | 1010DDXR | 1 | 1 | 512 | 512 words | SYNCHRONOUS | OPEN-DRAIN | 16 words | SERIAL | 3 V | I2C | 800 nA | 1 µA | 3.6 V | 2.5 V | CMOS | INDUSTRIAL | 5 ms | HARDWARE | R-PDSO-G8 | Not Qualified | e4 | 3 | 85 °C | -40 °C | 260 | 40 | 8 | PLASTIC/EPOXY | SOP | SOP8,.23 | RECTANGULAR | SMALL OUTLINE | YES | NICKEL PALLADIUM GOLD | GULL WING | 1.27 mm | DUAL | 1.75 mm | 4.925 mm | 3.9 mm | MICROCHIP TECHNOLOGY INC | compliant | Microchip | ||||||||
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CAT24C04YI-GT3
onsemi
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$0.2118 | Yes | Active | 4.096 kbit | 1 | 4KX1 | 3.3 V | 400 kHz | EEPROM | 100 | 1000000 Write/Erase Cycles | 1010DDMR | 1 | 4000 | 4.096 k | SYNCHRONOUS | SERIAL | I2C | 1 µA | 2 µA | 5.5 V | 1.7 V | CMOS | INDUSTRIAL | 5 ms | HARDWARE | R-PDSO-G8 | Not Qualified | e4 | 1 | 85 °C | -40 °C | 260 | 30 | 8 | PLASTIC/EPOXY | TSSOP | TSSOP8,.25 | RECTANGULAR | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | YES | Nickel/Palladium/Gold (Ni/Pd/Au) | GULL WING | 650 µm | DUAL | 1.2 mm | 4.4 mm | 3 mm | ONSEMI | TSSOP-8 | compliant | onsemi | TSSOP8, 4.4x3 | 8 | EAR99 | 8542.32.00.51 | 948AL |