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AS7C33512NTD18A-100BC
Alliance Semiconductor Corporation
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Check for Price | No | Transferred | 9.4372 Mbit | 18 | 512KX18 | 3.3 V | 12 ns | 100 MHz | ZBT SRAM | COMMON | 1 | 512000 | 524.288 k | SYNCHRONOUS | 3-STATE | PARALLEL | 30 mA | 3.14 V | 300 µA | 3.6 V | 3.135 V | CMOS | COMMERCIAL | R-PBGA-B119 | Not Qualified | e0 | 70 °C | 119 | PLASTIC/EPOXY | BGA | BGA119,7X17,50 | RECTANGULAR | GRID ARRAY | YES | TIN LEAD | BALL | 1.27 mm | BOTTOM | 2.4 mm | 22 mm | 14 mm | ALLIANCE SEMICONDUCTOR CORP | BGA | BGA, BGA119,7X17,50 | 119 | unknown | 3A991.B.2.A | 8542.32.00.41 | |||||||
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AS7C33512NTD18A-166HBC
Alliance Semiconductor Corporation
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Check for Price | No | Transferred | 9.4372 Mbit | 18 | 512KX18 | 3.3 V | 9 ns | 166 MHz | ZBT SRAM | COMMON | 1 | 512000 | 524.288 k | SYNCHRONOUS | 3-STATE | PARALLEL | 30 mA | 3.14 V | 475 µA | 3.6 V | 3.135 V | CMOS | COMMERCIAL | R-PBGA-B119 | Not Qualified | e0 | 70 °C | 119 | PLASTIC/EPOXY | BGA | BGA119,7X17,50 | RECTANGULAR | GRID ARRAY | YES | TIN LEAD | BALL | 1.27 mm | BOTTOM | 2.4 mm | 22 mm | 14 mm | ALLIANCE SEMICONDUCTOR CORP | BGA | BGA, BGA119,7X17,50 | 119 | unknown | 3A991.B.2.A | 8542.32.00.41 | |||||||
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AS7C33512NTD18A-166TQCN
Integrated Silicon Solution Inc
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Check for Price | Yes | Yes | Obsolete | 9.4372 Mbit | 18 | 512KX18 | 3.3 V | 4 ns | ZBT SRAM | PIPELINED ARCHITECTURE; LATE WRITE | 1 | 512000 | 524.288 k | SYNCHRONOUS | PARALLEL | 3.465 V | 3.135 V | CMOS | COMMERCIAL | R-PQFP-G100 | Not Qualified | e3 | 70 °C | 100 | PLASTIC/EPOXY | LQFP | RECTANGULAR | FLATPACK, LOW PROFILE | YES | MATTE TIN | GULL WING | 650 µm | QUAD | 1.6 mm | 20 mm | 14 mm | INTEGRATED SILICON SOLUTION INC | QFP | LQFP, | 100 | compliant | 3A991.B.2.A | 8542.32.00.41 | ||||||||||||
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AS7C33512NTD18A-133TQCN
Alliance Semiconductor Corporation
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Check for Price | Yes | Transferred | 9.4372 Mbit | 18 | 512KX18 | 3.3 V | 4.5 ns | 133 MHz | ZBT SRAM | PIPELINED ARCHITECTURE; LATE WRITE | COMMON | 1 | 512000 | 524.288 k | SYNCHRONOUS | 3-STATE | PARALLEL | 30 mA | 3.14 V | 400 µA | 3.465 V | 3.135 V | CMOS | COMMERCIAL | R-PQFP-G100 | Not Qualified | e3 | 70 °C | 100 | PLASTIC/EPOXY | LQFP | QFP100,.63X.87 | RECTANGULAR | FLATPACK, LOW PROFILE | YES | MATTE TIN | GULL WING | 650 µm | QUAD | 1.6 mm | 20 mm | 14 mm | ALLIANCE SEMICONDUCTOR CORP | QFP | LQFP, QFP100,.63X.87 | 100 | unknown | 3A991.B.2.A | 8542.32.00.41 | ||||||
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AS7C33512NTD18A-150BC
Alliance Semiconductor Corporation
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Check for Price | No | Transferred | 9.4372 Mbit | 18 | 512KX18 | 3.3 V | 10 ns | 150 MHz | ZBT SRAM | COMMON | 1 | 512000 | 524.288 k | SYNCHRONOUS | 3-STATE | PARALLEL | 30 mA | 3.14 V | 425 µA | 3.6 V | 3.135 V | CMOS | COMMERCIAL | R-PBGA-B119 | Not Qualified | e0 | 70 °C | 119 | PLASTIC/EPOXY | BGA | BGA119,7X17,50 | RECTANGULAR | GRID ARRAY | YES | TIN LEAD | BALL | 1.27 mm | BOTTOM | 2.4 mm | 22 mm | 14 mm | ALLIANCE SEMICONDUCTOR CORP | BGA | BGA, BGA119,7X17,50 | 119 | unknown | 3A991.B.2.A | 8542.32.00.41 | |||||||
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AS7C33512NTD18A-150BC
Integrated Silicon Solution Inc
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Check for Price | No | No | Obsolete | 9.4372 Mbit | 18 | 512KX18 | 3.3 V | 10 ns | ZBT SRAM | 1 | 512000 | 524.288 k | SYNCHRONOUS | PARALLEL | 3.6 V | 3.135 V | CMOS | COMMERCIAL | R-PBGA-B119 | Not Qualified | e0 | 70 °C | 119 | PLASTIC/EPOXY | BGA | RECTANGULAR | GRID ARRAY | YES | TIN LEAD | BALL | 1.27 mm | BOTTOM | 2.4 mm | 22 mm | 14 mm | INTEGRATED SILICON SOLUTION INC | BGA | BGA, | 119 | compliant | 3A991.B.2.A | 8542.32.00.41 | |||||||||||||
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AS7C33512NTD18A-150TQIN
Alliance Semiconductor Corporation
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Check for Price | Yes | Obsolete | 9.4372 Mbit | 18 | 512KX18 | 3.3 V | 10 ns | 150 MHz | ZBT SRAM | FLOW-THROUGH OR PIPELINED ARCHITECTURE | COMMON | 1 | 512000 | 524.288 k | SYNCHRONOUS | 3-STATE | PARALLEL | 30 mA | 3.14 V | 425 µA | 3.465 V | 3.135 V | CMOS | INDUSTRIAL | R-PQFP-G100 | Not Qualified | e3/e6 | 85 °C | -40 °C | 260 | 40 | 100 | PLASTIC/EPOXY | LQFP | QFP100,.63X.87 | RECTANGULAR | FLATPACK, LOW PROFILE | YES | PURE MATTE TIN/TIN BISMUTH | GULL WING | 650 µm | QUAD | 1.6 mm | 20 mm | 14 mm | ALLIANCE SEMICONDUCTOR CORP | QFP | LQFP, QFP100,.63X.87 | 100 | unknown | 3A991.B.2.A | 8542.32.00.41 | |||
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AS7C33512NTD18A-133TQI
Integrated Silicon Solution Inc
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Check for Price | No | No | Obsolete | 9.4372 Mbit | 18 | 512KX18 | 3.3 V | 4.5 ns | ZBT SRAM | PIPELINED ARCHITECTURE; LATE WRITE | 1 | 512000 | 524.288 k | SYNCHRONOUS | PARALLEL | 3.465 V | 3.135 V | CMOS | INDUSTRIAL | R-PQFP-G100 | Not Qualified | e0 | 85 °C | -40 °C | 100 | PLASTIC/EPOXY | LQFP | RECTANGULAR | FLATPACK, LOW PROFILE | YES | TIN LEAD | GULL WING | 650 µm | QUAD | 1.6 mm | 20 mm | 14 mm | INTEGRATED SILICON SOLUTION INC | QFP | LQFP, | 100 | compliant | 3A991.B.2.A | 8542.32.00.41 | |||||||||||
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AS7C33512NTD18A-150TQI
Alliance Semiconductor Corporation
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Check for Price | No | Obsolete | 9.4372 Mbit | 18 | 512KX18 | 3.3 V | 10 ns | 150 MHz | ZBT SRAM | FLOW-THROUGH OR PIPELINED ARCHITECTURE | COMMON | 1 | 512000 | 524.288 k | SYNCHRONOUS | 3-STATE | PARALLEL | 30 mA | 3.14 V | 425 µA | 3.465 V | 3.135 V | CMOS | INDUSTRIAL | R-PQFP-G100 | Not Qualified | e0 | 85 °C | -40 °C | 100 | PLASTIC/EPOXY | LQFP | QFP100,.63X.87 | RECTANGULAR | FLATPACK, LOW PROFILE | YES | Tin/Lead (Sn/Pb) | GULL WING | 650 µm | QUAD | 1.6 mm | 20 mm | 14 mm | ALLIANCE SEMICONDUCTOR CORP | QFP | LQFP, QFP100,.63X.87 | 100 | unknown | 3A991.B.2.A | 8542.32.00.41 | |||||
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AS7C33512NTD18A-166BC
Integrated Silicon Solution Inc
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Check for Price | No | No | Obsolete | 9.4372 Mbit | 18 | 512KX18 | 3.3 V | 9 ns | ZBT SRAM | 1 | 512000 | 524.288 k | SYNCHRONOUS | PARALLEL | 3.6 V | 3.135 V | CMOS | COMMERCIAL | R-PBGA-B119 | Not Qualified | e0 | 70 °C | 119 | PLASTIC/EPOXY | BGA | RECTANGULAR | GRID ARRAY | YES | TIN LEAD | BALL | 1.27 mm | BOTTOM | 2.4 mm | 22 mm | 14 mm | INTEGRATED SILICON SOLUTION INC | BGA | BGA, | 119 | compliant | 3A991.B.2.A | 8542.32.00.41 |