Parametric results for: AS7C33512NTD18A under SRAMs

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Manufacturer Part Number: as7c33512ntd18a
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AS7C33512NTD18A-100BC
Alliance Semiconductor Corporation
Check for Price No Transferred 9.4372 Mbit 18 512KX18 3.3 V 12 ns 100 MHz ZBT SRAM COMMON 1 512000 524.288 k SYNCHRONOUS 3-STATE PARALLEL 30 mA 3.14 V 300 µA 3.6 V 3.135 V CMOS COMMERCIAL R-PBGA-B119 Not Qualified e0 70 °C 119 PLASTIC/EPOXY BGA BGA119,7X17,50 RECTANGULAR GRID ARRAY YES TIN LEAD BALL 1.27 mm BOTTOM 2.4 mm 22 mm 14 mm ALLIANCE SEMICONDUCTOR CORP BGA BGA, BGA119,7X17,50 119 unknown 3A991.B.2.A 8542.32.00.41
AS7C33512NTD18A-166HBC
Alliance Semiconductor Corporation
Check for Price No Transferred 9.4372 Mbit 18 512KX18 3.3 V 9 ns 166 MHz ZBT SRAM COMMON 1 512000 524.288 k SYNCHRONOUS 3-STATE PARALLEL 30 mA 3.14 V 475 µA 3.6 V 3.135 V CMOS COMMERCIAL R-PBGA-B119 Not Qualified e0 70 °C 119 PLASTIC/EPOXY BGA BGA119,7X17,50 RECTANGULAR GRID ARRAY YES TIN LEAD BALL 1.27 mm BOTTOM 2.4 mm 22 mm 14 mm ALLIANCE SEMICONDUCTOR CORP BGA BGA, BGA119,7X17,50 119 unknown 3A991.B.2.A 8542.32.00.41
AS7C33512NTD18A-166TQCN
Integrated Silicon Solution Inc
Check for Price Yes Yes Obsolete 9.4372 Mbit 18 512KX18 3.3 V 4 ns ZBT SRAM PIPELINED ARCHITECTURE; LATE WRITE 1 512000 524.288 k SYNCHRONOUS PARALLEL 3.465 V 3.135 V CMOS COMMERCIAL R-PQFP-G100 Not Qualified e3 70 °C 100 PLASTIC/EPOXY LQFP RECTANGULAR FLATPACK, LOW PROFILE YES MATTE TIN GULL WING 650 µm QUAD 1.6 mm 20 mm 14 mm INTEGRATED SILICON SOLUTION INC QFP LQFP, 100 compliant 3A991.B.2.A 8542.32.00.41
AS7C33512NTD18A-133TQCN
Alliance Semiconductor Corporation
Check for Price Yes Transferred 9.4372 Mbit 18 512KX18 3.3 V 4.5 ns 133 MHz ZBT SRAM PIPELINED ARCHITECTURE; LATE WRITE COMMON 1 512000 524.288 k SYNCHRONOUS 3-STATE PARALLEL 30 mA 3.14 V 400 µA 3.465 V 3.135 V CMOS COMMERCIAL R-PQFP-G100 Not Qualified e3 70 °C 100 PLASTIC/EPOXY LQFP QFP100,.63X.87 RECTANGULAR FLATPACK, LOW PROFILE YES MATTE TIN GULL WING 650 µm QUAD 1.6 mm 20 mm 14 mm ALLIANCE SEMICONDUCTOR CORP QFP LQFP, QFP100,.63X.87 100 unknown 3A991.B.2.A 8542.32.00.41
AS7C33512NTD18A-150BC
Alliance Semiconductor Corporation
Check for Price No Transferred 9.4372 Mbit 18 512KX18 3.3 V 10 ns 150 MHz ZBT SRAM COMMON 1 512000 524.288 k SYNCHRONOUS 3-STATE PARALLEL 30 mA 3.14 V 425 µA 3.6 V 3.135 V CMOS COMMERCIAL R-PBGA-B119 Not Qualified e0 70 °C 119 PLASTIC/EPOXY BGA BGA119,7X17,50 RECTANGULAR GRID ARRAY YES TIN LEAD BALL 1.27 mm BOTTOM 2.4 mm 22 mm 14 mm ALLIANCE SEMICONDUCTOR CORP BGA BGA, BGA119,7X17,50 119 unknown 3A991.B.2.A 8542.32.00.41
AS7C33512NTD18A-150BC
Integrated Silicon Solution Inc
Check for Price No No Obsolete 9.4372 Mbit 18 512KX18 3.3 V 10 ns ZBT SRAM 1 512000 524.288 k SYNCHRONOUS PARALLEL 3.6 V 3.135 V CMOS COMMERCIAL R-PBGA-B119 Not Qualified e0 70 °C 119 PLASTIC/EPOXY BGA RECTANGULAR GRID ARRAY YES TIN LEAD BALL 1.27 mm BOTTOM 2.4 mm 22 mm 14 mm INTEGRATED SILICON SOLUTION INC BGA BGA, 119 compliant 3A991.B.2.A 8542.32.00.41
AS7C33512NTD18A-150TQIN
Alliance Semiconductor Corporation
Check for Price Yes Obsolete 9.4372 Mbit 18 512KX18 3.3 V 10 ns 150 MHz ZBT SRAM FLOW-THROUGH OR PIPELINED ARCHITECTURE COMMON 1 512000 524.288 k SYNCHRONOUS 3-STATE PARALLEL 30 mA 3.14 V 425 µA 3.465 V 3.135 V CMOS INDUSTRIAL R-PQFP-G100 Not Qualified e3/e6 85 °C -40 °C 260 40 100 PLASTIC/EPOXY LQFP QFP100,.63X.87 RECTANGULAR FLATPACK, LOW PROFILE YES PURE MATTE TIN/TIN BISMUTH GULL WING 650 µm QUAD 1.6 mm 20 mm 14 mm ALLIANCE SEMICONDUCTOR CORP QFP LQFP, QFP100,.63X.87 100 unknown 3A991.B.2.A 8542.32.00.41
AS7C33512NTD18A-133TQI
Integrated Silicon Solution Inc
Check for Price No No Obsolete 9.4372 Mbit 18 512KX18 3.3 V 4.5 ns ZBT SRAM PIPELINED ARCHITECTURE; LATE WRITE 1 512000 524.288 k SYNCHRONOUS PARALLEL 3.465 V 3.135 V CMOS INDUSTRIAL R-PQFP-G100 Not Qualified e0 85 °C -40 °C 100 PLASTIC/EPOXY LQFP RECTANGULAR FLATPACK, LOW PROFILE YES TIN LEAD GULL WING 650 µm QUAD 1.6 mm 20 mm 14 mm INTEGRATED SILICON SOLUTION INC QFP LQFP, 100 compliant 3A991.B.2.A 8542.32.00.41
AS7C33512NTD18A-150TQI
Alliance Semiconductor Corporation
Check for Price No Obsolete 9.4372 Mbit 18 512KX18 3.3 V 10 ns 150 MHz ZBT SRAM FLOW-THROUGH OR PIPELINED ARCHITECTURE COMMON 1 512000 524.288 k SYNCHRONOUS 3-STATE PARALLEL 30 mA 3.14 V 425 µA 3.465 V 3.135 V CMOS INDUSTRIAL R-PQFP-G100 Not Qualified e0 85 °C -40 °C 100 PLASTIC/EPOXY LQFP QFP100,.63X.87 RECTANGULAR FLATPACK, LOW PROFILE YES Tin/Lead (Sn/Pb) GULL WING 650 µm QUAD 1.6 mm 20 mm 14 mm ALLIANCE SEMICONDUCTOR CORP QFP LQFP, QFP100,.63X.87 100 unknown 3A991.B.2.A 8542.32.00.41
AS7C33512NTD18A-166BC
Integrated Silicon Solution Inc
Check for Price No No Obsolete 9.4372 Mbit 18 512KX18 3.3 V 9 ns ZBT SRAM 1 512000 524.288 k SYNCHRONOUS PARALLEL 3.6 V 3.135 V CMOS COMMERCIAL R-PBGA-B119 Not Qualified e0 70 °C 119 PLASTIC/EPOXY BGA RECTANGULAR GRID ARRAY YES TIN LEAD BALL 1.27 mm BOTTOM 2.4 mm 22 mm 14 mm INTEGRATED SILICON SOLUTION INC BGA BGA, 119 compliant 3A991.B.2.A 8542.32.00.41