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AS7C331MNTD18A-133BCN
Alliance Semiconductor Corporation
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Check for Price | Yes | Obsolete | 18.8744 Mbit | 18 | 1MX18 | 3.3 V | 10 ns | 133 MHz | ZBT SRAM | FLOW-THROUGH OR PIPELINED ARCHITECTURE | COMMON | 1 | 1000000 | 1.0486 M | SYNCHRONOUS | 3-STATE | PARALLEL | 40 mA | 3.14 V | 270 µA | 3.465 V | 3.135 V | CMOS | COMMERCIAL | R-PBGA-B165 | Not Qualified | e3/e6 | 70 °C | 260 | 40 | 165 | PLASTIC/EPOXY | TBGA | BGA165,11X15,40 | RECTANGULAR | GRID ARRAY, THIN PROFILE | YES | PURE MATTE TIN/TIN BISMUTH | BALL | 1 mm | BOTTOM | 1.2 mm | 15 mm | 13 mm | ALLIANCE SEMICONDUCTOR CORP | BGA | TBGA, BGA165,11X15,40 | 165 | unknown | 3A991.B.2.A | 8542.32.00.41 | ||
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AS7C331MNTD18A-133BC
Alliance Semiconductor Corporation
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Check for Price | No | Obsolete | 18.8744 Mbit | 18 | 1MX18 | 3.3 V | 10 ns | 133 MHz | ZBT SRAM | FLOW-THROUGH OR PIPELINED ARCHITECTURE | COMMON | 1 | 1000000 | 1.0486 M | SYNCHRONOUS | 3-STATE | PARALLEL | 40 mA | 3.14 V | 270 µA | 3.465 V | 3.135 V | CMOS | COMMERCIAL | R-PBGA-B165 | Not Qualified | e0 | 70 °C | 165 | PLASTIC/EPOXY | TBGA | BGA165,11X15,40 | RECTANGULAR | GRID ARRAY, THIN PROFILE | YES | Tin/Lead (Sn/Pb) | BALL | 1 mm | BOTTOM | 1.2 mm | 15 mm | 13 mm | ALLIANCE SEMICONDUCTOR CORP | BGA | TBGA, BGA165,11X15,40 | 165 | unknown | 3A991.B.2.A | 8542.32.00.41 |