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APA300-FG256I
Microchip Technology Inc
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$383.6334 | No | Active | 2.5 V | 186 | 186 | 8192 | 300000 | FIELD PROGRAMMABLE GATE ARRAY | INDUSTRIAL | SQUARE | CMOS | 300000 GATES | 180 MHz | 2.7 V | 2.3 V | S-PBGA-B256 | Not Qualified | e0 | 3 | 85 °C | -40 °C | 225 | 20 | 256 | PLASTIC/EPOXY | BGA | BGA256,16X16,40 | SQUARE | GRID ARRAY | TRAY | YES | TIN LEAD | BALL | 1 mm | BOTTOM | 17 mm | 17 mm | 1.8 mm | MICROCHIP TECHNOLOGY INC | 1 MM PITCH, FBGA-256 | compliant | 8542.39.00.01 | Microchip | ||||||
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APA300-FG256IX79
Actel Corporation
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Check for Price | Yes | Transferred | 2.5 V | 186 | 186 | 8192 | 300000 | FIELD PROGRAMMABLE GATE ARRAY | INDUSTRIAL | SQUARE | CMOS | 300000 GATES | 180 MHz | 2.7 V | 2.3 V | S-PBGA-B256 | Not Qualified | 3 | 85 °C | -40 °C | 250 | 256 | PLASTIC/EPOXY | BGA | BGA256,16X16,40 | SQUARE | GRID ARRAY | YES | BALL | 1 mm | BOTTOM | 17 mm | 17 mm | 1.8 mm | ACTEL CORP | 1 MM PITCH, FBGA-256 | unknown | ||||||||||||
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APA300-FG256IX95
Microsemi Corporation
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Check for Price | No | Transferred | 2.5 V | 300000 | FIELD PROGRAMMABLE GATE ARRAY | INDUSTRIAL | SQUARE | CMOS | 300000 GATES | ALSO OPERATES AT 3 TO 3.6 V SUPPLY | 180 MHz | 2.7 V | 2.3 V | S-PBGA-B256 | e0 | 85 °C | -40 °C | 230 | NOT SPECIFIED | 256 | PLASTIC/EPOXY | LBGA | SQUARE | GRID ARRAY, LOW PROFILE | YES | TIN LEAD/TIN LEAD SILVER | BALL | 1 mm | BOTTOM | 17 mm | 17 mm | 1.7 mm | MICROSEMI CORP | LBGA, | compliant | 8542.39.00.01 | |||||||||||||
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APA300-FG256I
Microsemi Corporation
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Check for Price | No | Transferred | 2.5 V | 186 | 186 | 8192 | 300000 | FIELD PROGRAMMABLE GATE ARRAY | INDUSTRIAL | SQUARE | CMOS | 300000 GATES | 180 MHz | 2.7 V | 2.3 V | S-PBGA-B256 | Not Qualified | e0 | 3 | 85 °C | -40 °C | 225 | 20 | 256 | PLASTIC/EPOXY | BGA | BGA256,16X16,40 | SQUARE | GRID ARRAY | YES | TIN LEAD | BALL | 1 mm | BOTTOM | 17 mm | 17 mm | 1.8 mm | MICROSEMI CORP | BGA, BGA256,16X16,40 | unknown | 8542.39.00.01 | Microsemi Corporation | |||||||
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APA300-FG256IX79
Microchip Technology Inc
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Check for Price | No | Active | 2.5 V | 186 | 186 | 300000 | FIELD PROGRAMMABLE GATE ARRAY | INDUSTRIAL | SQUARE | CMOS | 300000 GATES | 180 MHz | 2.7 V | 2.3 V | S-PBGA-B256 | Not Qualified | e0 | 3 | 85 °C | -40 °C | 256 | PLASTIC/EPOXY | BGA | BGA256,16X16,40 | SQUARE | GRID ARRAY | YES | TIN LEAD | BALL | 1 mm | BOTTOM | 17 mm | 17 mm | 1.8 mm | MICROCHIP TECHNOLOGY INC | 1 MM PITCH, FBGA-256 | compliant | 8542.39.00.01 | |||||||||||
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APA300-FG256IX79
Microsemi Corporation
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Check for Price | No | Transferred | 2.5 V | 300000 | FIELD PROGRAMMABLE GATE ARRAY | INDUSTRIAL | SQUARE | CMOS | 300000 GATES | 180 MHz | 2.7 V | 2.3 V | S-PBGA-B256 | Not Qualified | e0 | 3 | 85 °C | -40 °C | 256 | PLASTIC/EPOXY | BGA | BGA256,16X16,40 | SQUARE | GRID ARRAY | YES | TIN LEAD | BALL | 1 mm | BOTTOM | 17 mm | 17 mm | 1.8 mm | MICROSEMI CORP | BGA, | compliant | 8542.39.00.01 | |||||||||||||
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APA300-FG256I
Actel Corporation
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Check for Price | No | Transferred | 2.5 V | 186 | 186 | 8192 | 300000 | FIELD PROGRAMMABLE GATE ARRAY | INDUSTRIAL | SQUARE | CMOS | 300000 GATES | 180 MHz | 2.7 V | 2.3 V | S-PBGA-B256 | Not Qualified | e0 | 3 | 85 °C | -40 °C | 256 | PLASTIC/EPOXY | BGA | BGA256,16X16,40 | SQUARE | GRID ARRAY | YES | TIN LEAD | BALL | 1 mm | BOTTOM | 17 mm | 17 mm | 1.8 mm | ACTEL CORP | 1 MM PITCH, FBGA-256 | compliant | |||||||||||
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APA300-FG256IX95
Microsemi FPGA & SoC
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Check for Price | No | No | Transferred | 2.5 V | 300000 | FIELD PROGRAMMABLE GATE ARRAY | INDUSTRIAL | SQUARE | CMOS | 300000 GATES | ALSO OPERATES AT 3 TO 3.6 V SUPPLY | 180 MHz | 2.7 V | 2.3 V | S-PBGA-B256 | e0 | 85 °C | -40 °C | 230 | NOT SPECIFIED | 256 | PLASTIC/EPOXY | LBGA | SQUARE | GRID ARRAY, LOW PROFILE | YES | TIN LEAD/TIN LEAD SILVER | BALL | 1 mm | BOTTOM | 17 mm | 17 mm | 1.7 mm | MICROSEMI SOC PRODUCTS GROUP | LBGA, | compliant | 8542.39.00.01 | BGA | 256 | ||||||||||
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APA300-FG256IX95
Microchip Technology Inc
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Check for Price | No | Active | 2.5 V | 300000 | FIELD PROGRAMMABLE GATE ARRAY | INDUSTRIAL | SQUARE | CMOS | 300000 GATES | ALSO OPERATES AT 3 TO 3.6 V SUPPLY | 180 MHz | 2.7 V | 2.3 V | S-PBGA-B256 | e0 | 85 °C | -40 °C | 230 | NOT SPECIFIED | 256 | PLASTIC/EPOXY | LBGA | SQUARE | GRID ARRAY, LOW PROFILE | YES | TIN LEAD/TIN LEAD SILVER | BALL | 1 mm | BOTTOM | 17 mm | 17 mm | 1.7 mm | MICROCHIP TECHNOLOGY INC | 1 MM PITCH, FPBGA-256 | compliant | 8542.39.00.01 |