Findchips: Parametric Search Results for AM99CL164-70%2FBUA

Parametric results for: AM99CL164-70%2FBUA under SRAMs

Select parts from the table below to compare.

Compare


Select Parts		Part Number

		AM99CL164-70/BXC AMD
		AM99CL164-70DE AMD
		AM99CL164-70LCB AMD
		AM99CL164-70PCB AMD
		AM99CL164-70LE AMD
		AM99CL164-70DCB AMD
		AM99CL164-70/BUA AMD
		AM99CL164-70PC AMD
		AM99CL164-70/BXA AMD
		AM99CL164-70DC AMD

			Most Relevant					Technical												Compliance			Operating Conditions			Physical											Other
Composite Price	Rohs Code	Part Life Cycle Code	Memory Density	Memory Width	Organization	Supply Voltage-Nom (Vsup)	Access Time-Max	Memory IC Type	I/O Type	Number of Words Code	Number of Words	Operating Mode	Output Characteristics	Parallel/Serial	Standby Current-Max	Standby Voltage-Min	Supply Current-Max	Technology	Temperature Grade	JESD-30 Code	Qualification Status	JESD-609 Code	Operating Temperature-Max	Operating Temperature-Min	Screening Level	Number of Terminals	Package Body Material	Package Code	Package Equivalence Code	Package Shape	Package Style	Surface Mount	Terminal Finish	Terminal Form	Terminal Pitch	Terminal Position	Ihs Manufacturer	Package Description	Reach Compliance Code	ECCN Code	HTS Code

Check for Price

Obsolete

65.536 kbit

16KX4

5 V

70 ns

STANDARD SRAM

COMMON

16000

16.384 k

ASYNCHRONOUS

3-STATE

PARALLEL

300 µA

2 V

105 µA

CMOS

MILITARY

R-XDIP-T22

Not Qualified

125 °C

-55 °C

38535Q/M;38534H;883B

CERAMIC

DIP

DIP22,.3

RECTANGULAR

IN-LINE

Tin/Lead (Sn/Pb)

THROUGH-HOLE

2.54 mm

DUAL

ADVANCED MICRO DEVICES INC

DIP, DIP22,.3

unknown

3A001.A.2.C

8542.32.00.41

Check for Price

Obsolete

65.536 kbit

16KX4

5 V

70 ns

STANDARD SRAM

COMMON

16000

16.384 k

ASYNCHRONOUS

3-STATE

PARALLEL

300 µA

2 V

105 µA

CMOS

MILITARY

R-XDIP-T22

Not Qualified

125 °C

-55 °C

CERAMIC

DIP

DIP22,.3

RECTANGULAR

IN-LINE

Tin/Lead (Sn/Pb)

THROUGH-HOLE

2.54 mm

DUAL

ADVANCED MICRO DEVICES INC

DIP, DIP22,.3

unknown

3A001.A.2.C

8542.32.00.41

Check for Price

Obsolete

65.536 kbit

16KX4

5 V

70 ns

STANDARD SRAM

COMMON

16000

16.384 k

ASYNCHRONOUS

3-STATE

PARALLEL

100 µA

2 V

90 µA

CMOS

COMMERCIAL

R-XQCC-N22

70 °C

CERAMIC

QCCN

LCC22,.3X.5

RECTANGULAR

CHIP CARRIER

YES

Tin/Lead (Sn/Pb)

NO LEAD

1.27 mm

QUAD

ADVANCED MICRO DEVICES INC

QCCN, LCC22,.3X.5

unknown

EAR99

8542.32.00.41

Check for Price

Obsolete

65.536 kbit

16KX4

5 V

70 ns

STANDARD SRAM

COMMON

16000

16.384 k

ASYNCHRONOUS

3-STATE

PARALLEL

100 µA

2 V

90 µA

CMOS

COMMERCIAL

R-PDIP-T22

70 °C

PLASTIC/EPOXY

DIP

DIP22,.3

RECTANGULAR

IN-LINE

Tin/Lead (Sn/Pb)

THROUGH-HOLE

2.54 mm

DUAL

ADVANCED MICRO DEVICES INC

DIP, DIP22,.3

unknown

EAR99

8542.32.00.41

Check for Price

Obsolete

65.536 kbit

16KX4

5 V

70 ns

STANDARD SRAM

COMMON

16000

16.384 k

ASYNCHRONOUS

3-STATE

PARALLEL

300 µA

2 V

105 µA

CMOS

MILITARY

R-XQCC-N22

Not Qualified

125 °C

-55 °C

CERAMIC

QCCN

LCC22,.3X.5

RECTANGULAR

CHIP CARRIER

YES

Tin/Lead (Sn/Pb)

NO LEAD

1.27 mm

QUAD

ADVANCED MICRO DEVICES INC

QCCN, LCC22,.3X.5

unknown

3A001.A.2.C

8542.32.00.41

Check for Price

Obsolete

65.536 kbit

16KX4

5 V

70 ns

STANDARD SRAM

COMMON

16000

16.384 k

ASYNCHRONOUS

3-STATE

PARALLEL

100 µA

2 V

90 µA

CMOS

COMMERCIAL

R-XDIP-T22

70 °C

CERAMIC

DIP

DIP22,.3

RECTANGULAR

IN-LINE

Tin/Lead (Sn/Pb)

THROUGH-HOLE

2.54 mm

DUAL

ADVANCED MICRO DEVICES INC

DIP, DIP22,.3

unknown

EAR99

8542.32.00.41

Check for Price

Obsolete

65.536 kbit

16KX4

5 V

70 ns

STANDARD SRAM

COMMON

16000

16.384 k

ASYNCHRONOUS

3-STATE

PARALLEL

300 µA

2 V

105 µA

CMOS

MILITARY

R-XQCC-N22

Not Qualified

125 °C

-55 °C

38535Q/M;38534H;883B

CERAMIC

QCCN

LCC22,.3X.5

RECTANGULAR

CHIP CARRIER

YES

Tin/Lead (Sn/Pb)

NO LEAD

1.27 mm

QUAD

ADVANCED MICRO DEVICES INC

QCCN, LCC22,.3X.5

unknown

3A001.A.2.C

8542.32.00.41

Check for Price

Obsolete

65.536 kbit

16KX4

5 V

70 ns

STANDARD SRAM

COMMON

16000

16.384 k

ASYNCHRONOUS

3-STATE

PARALLEL

100 µA

2 V

90 µA

CMOS

COMMERCIAL

R-PDIP-T22

Not Qualified

70 °C

PLASTIC/EPOXY

DIP

DIP22,.3

RECTANGULAR

IN-LINE

Tin/Lead (Sn/Pb)

THROUGH-HOLE

2.54 mm

DUAL

ADVANCED MICRO DEVICES INC

DIP, DIP22,.3

unknown

EAR99

8542.32.00.41

Check for Price

Obsolete

65.536 kbit

16KX4

5 V

70 ns

STANDARD SRAM

COMMON

16000

16.384 k

ASYNCHRONOUS

3-STATE

PARALLEL

300 µA

2 V

105 µA

CMOS

MILITARY

R-XDIP-T22

Not Qualified

125 °C

-55 °C

38535Q/M;38534H;883B

CERAMIC

DIP

DIP22,.3

RECTANGULAR

IN-LINE

Tin/Lead (Sn/Pb)

THROUGH-HOLE

2.54 mm

DUAL

ADVANCED MICRO DEVICES INC

DIP, DIP22,.3

unknown

3A001.A.2.C

8542.32.00.41

Check for Price

Obsolete

65.536 kbit

16KX4

5 V

70 ns

STANDARD SRAM

COMMON

16000

16.384 k

ASYNCHRONOUS

3-STATE

PARALLEL

100 µA

2 V

90 µA

CMOS

COMMERCIAL

R-XDIP-T22

Not Qualified

70 °C

CERAMIC

DIP

DIP22,.3

RECTANGULAR

IN-LINE

Tin/Lead (Sn/Pb)

THROUGH-HOLE

2.54 mm

DUAL

ADVANCED MICRO DEVICES INC

DIP, DIP22,.3

unknown

EAR99

8542.32.00.41

1 2 Next

Compare

AM99CL164-70/BXC

AMD

Check for Price

Obsolete

65.536 kbit

16KX4

5 V

70 ns

STANDARD SRAM

COMMON

16000

16.384 k

ASYNCHRONOUS

3-STATE

PARALLEL

300 µA

2 V

105 µA

CMOS

MILITARY

R-XDIP-T22

Not Qualified

125 °C

-55 °C

38535Q/M;38534H;883B

CERAMIC

DIP

DIP22,.3

RECTANGULAR

IN-LINE

Tin/Lead (Sn/Pb)

THROUGH-HOLE

2.54 mm

DUAL

ADVANCED MICRO DEVICES INC

DIP, DIP22,.3

unknown

3A001.A.2.C

8542.32.00.41

AM99CL164-70DE

AMD

Check for Price

Obsolete

65.536 kbit

16KX4

5 V

70 ns

STANDARD SRAM

COMMON

16000

16.384 k

ASYNCHRONOUS

3-STATE

PARALLEL

300 µA

2 V

105 µA

CMOS

MILITARY

R-XDIP-T22

Not Qualified

125 °C

-55 °C

CERAMIC

DIP

DIP22,.3

RECTANGULAR

IN-LINE

Tin/Lead (Sn/Pb)

THROUGH-HOLE

2.54 mm

DUAL

ADVANCED MICRO DEVICES INC

DIP, DIP22,.3

unknown

3A001.A.2.C

8542.32.00.41

AM99CL164-70LCB

AMD

Check for Price

Obsolete

65.536 kbit

16KX4

5 V

70 ns

STANDARD SRAM

COMMON

16000

16.384 k

ASYNCHRONOUS

3-STATE

PARALLEL

100 µA

2 V

90 µA

CMOS

COMMERCIAL

R-XQCC-N22

70 °C

CERAMIC

QCCN

LCC22,.3X.5

RECTANGULAR

CHIP CARRIER

YES

Tin/Lead (Sn/Pb)

NO LEAD

1.27 mm

QUAD

ADVANCED MICRO DEVICES INC

QCCN, LCC22,.3X.5

unknown

EAR99

8542.32.00.41

AM99CL164-70PCB

AMD

Check for Price

Obsolete

65.536 kbit

16KX4

5 V

70 ns

STANDARD SRAM

COMMON

16000

16.384 k

ASYNCHRONOUS

3-STATE

PARALLEL

100 µA

2 V

90 µA

CMOS

COMMERCIAL

R-PDIP-T22

70 °C

PLASTIC/EPOXY

DIP

DIP22,.3

RECTANGULAR

IN-LINE

Tin/Lead (Sn/Pb)

THROUGH-HOLE

2.54 mm

DUAL

ADVANCED MICRO DEVICES INC

DIP, DIP22,.3

unknown

EAR99

8542.32.00.41

AM99CL164-70LE

AMD

Check for Price

Obsolete

65.536 kbit

16KX4

5 V

70 ns

STANDARD SRAM

COMMON

16000

16.384 k

ASYNCHRONOUS

3-STATE

PARALLEL

300 µA

2 V

105 µA

CMOS

MILITARY

R-XQCC-N22

Not Qualified

125 °C

-55 °C

CERAMIC

QCCN

LCC22,.3X.5

RECTANGULAR

CHIP CARRIER

YES

Tin/Lead (Sn/Pb)

NO LEAD

1.27 mm

QUAD

ADVANCED MICRO DEVICES INC

QCCN, LCC22,.3X.5

unknown

3A001.A.2.C

8542.32.00.41

AM99CL164-70DCB

AMD

Check for Price

Obsolete

65.536 kbit

16KX4

5 V

70 ns

STANDARD SRAM

COMMON

16000

16.384 k

ASYNCHRONOUS

3-STATE

PARALLEL

100 µA

2 V

90 µA

CMOS

COMMERCIAL

R-XDIP-T22

70 °C

CERAMIC

DIP

DIP22,.3

RECTANGULAR

IN-LINE

Tin/Lead (Sn/Pb)

THROUGH-HOLE

2.54 mm

DUAL

ADVANCED MICRO DEVICES INC

DIP, DIP22,.3

unknown

EAR99

8542.32.00.41

AM99CL164-70/BUA

AMD

Check for Price

Obsolete

65.536 kbit

16KX4

5 V

70 ns

STANDARD SRAM

COMMON

16000

16.384 k

ASYNCHRONOUS

3-STATE

PARALLEL

300 µA

2 V

105 µA

CMOS

MILITARY

R-XQCC-N22

Not Qualified

125 °C

-55 °C

38535Q/M;38534H;883B

CERAMIC

QCCN

LCC22,.3X.5

RECTANGULAR

CHIP CARRIER

YES

Tin/Lead (Sn/Pb)

NO LEAD

1.27 mm

QUAD

ADVANCED MICRO DEVICES INC

QCCN, LCC22,.3X.5

unknown

3A001.A.2.C

8542.32.00.41

AM99CL164-70PC

AMD

Check for Price

Obsolete

65.536 kbit

16KX4

5 V

70 ns

STANDARD SRAM

COMMON

16000

16.384 k

ASYNCHRONOUS

3-STATE

PARALLEL

100 µA

2 V

90 µA

CMOS

COMMERCIAL

R-PDIP-T22

Not Qualified

70 °C

PLASTIC/EPOXY

DIP

DIP22,.3

RECTANGULAR

IN-LINE

Tin/Lead (Sn/Pb)

THROUGH-HOLE

2.54 mm

DUAL

ADVANCED MICRO DEVICES INC

DIP, DIP22,.3

unknown

EAR99

8542.32.00.41

AM99CL164-70/BXA

AMD

Check for Price

Obsolete

65.536 kbit

16KX4

5 V

70 ns

STANDARD SRAM

COMMON

16000

16.384 k

ASYNCHRONOUS

3-STATE

PARALLEL

300 µA

2 V

105 µA

CMOS

MILITARY

R-XDIP-T22

Not Qualified

125 °C

-55 °C

38535Q/M;38534H;883B

CERAMIC

DIP

DIP22,.3

RECTANGULAR

IN-LINE

Tin/Lead (Sn/Pb)

THROUGH-HOLE

2.54 mm

DUAL

ADVANCED MICRO DEVICES INC

DIP, DIP22,.3

unknown

3A001.A.2.C

8542.32.00.41

AM99CL164-70DC

AMD

Check for Price

Obsolete

65.536 kbit

16KX4

5 V

70 ns

STANDARD SRAM

COMMON

16000

16.384 k

ASYNCHRONOUS

3-STATE

PARALLEL

100 µA

2 V

90 µA

CMOS

COMMERCIAL

R-XDIP-T22

Not Qualified

70 °C

CERAMIC

DIP

DIP22,.3

RECTANGULAR

IN-LINE

Tin/Lead (Sn/Pb)

THROUGH-HOLE

2.54 mm

DUAL

ADVANCED MICRO DEVICES INC

DIP, DIP22,.3

unknown

EAR99

8542.32.00.41

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