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Parametric » Memory » Other Memory ICs

Parametric results for: AM41PDS3228DB10IT under Other Memory ICs

Select parts from the table below to compare.

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Select Parts		Part Number

		AM41PDS3228DB10IT Cypress Semiconductor
		AM41PDS3228DB10IT Spansion
		AM41PDS3228DB10IT AMD

				Most Relevant						Technical												Compliance			Operating Conditions				Physical											Dimensions			Other
Composite Price	Pbfree Code	Rohs Code	Part Life Cycle Code	Memory Density	Memory Width	Organization	Supply Voltage-Nom (Vsup)	Power Supplies	Access Time-Max	Memory IC Type	Additional Feature	Mixed Memory Type	Number of Functions	Number of Words Code	Number of Words	Operating Mode	Supply Current-Max	Supply Voltage-Max (Vsup)	Supply Voltage-Min (Vsup)	Technology	Temperature Grade	JESD-30 Code	Qualification Status	JESD-609 Code	Moisture Sensitivity Level	Operating Temperature-Max	Operating Temperature-Min	Peak Reflow Temperature (Cel)	Number of Terminals	Package Body Material	Package Code	Package Equivalence Code	Package Shape	Package Style	Surface Mount	Terminal Finish	Terminal Form	Terminal Pitch	Terminal Position	Seated Height-Max	Length	Width	Ihs Manufacturer	Reach Compliance Code	Part Package Code	Package Description	Pin Count	ECCN Code	HTS Code

Check for Price

No

Active

2 V

2 V

100 ns

MEMORY CIRCUIT

FLASH+SRAM

30 µA

CMOS

INDUSTRIAL

R-PBGA-B73

Not Qualified

85 °C

-40 °C

73

PLASTIC/EPOXY

FBGA

BGA73,10X12,32

RECTANGULAR

GRID ARRAY, FINE PITCH

YES

BALL

800 µm

BOTTOM

CYPRESS SEMICONDUCTOR CORP

compliant

Check for Price

No

No

Obsolete

33.5544 Mbit

16

2MX16

2 V

100 ns

MEMORY CIRCUIT

SRAM IS ORGANISED AS 512K X 16/1M X 8

FLASH+SRAM

1

2000000

2.0972 M

ASYNCHRONOUS

30 µA

2.2 V

1.8 V

CMOS

INDUSTRIAL

R-PBGA-B73

Not Qualified

e0

3

85 °C

-40 °C

260

73

PLASTIC/EPOXY

LFBGA

BGA73,10X12,32

RECTANGULAR

GRID ARRAY, LOW PROFILE, FINE PITCH

YES

TIN LEAD

BALL

800 µm

BOTTOM

1.4 mm

11.6 mm

8 mm

SPANSION INC

not_compliant

BGA

8 X 11.60 MM, FBGA-73

73

EAR99

8542.32.00.71

Check for Price

No

Transferred

33.5544 Mbit

16

2MX16

2 V

100 ns

MEMORY CIRCUIT

SRAM CONFIGURATION IS 1M X 8/512K X 16

FLASH+SRAM

1

2000000

2.0972 M

ASYNCHRONOUS

30 µA

2.2 V

1.8 V

CMOS

INDUSTRIAL

R-PBGA-B73

Not Qualified

e0

85 °C

-40 °C

73

PLASTIC/EPOXY

LFBGA

BGA73,10X12,32

RECTANGULAR

GRID ARRAY, LOW PROFILE, FINE PITCH

YES

Tin/Lead (Sn/Pb)

BALL

800 µm

BOTTOM

1.4 mm

11.6 mm

8 mm

ADVANCED MICRO DEVICES INC

unknown

BGA

LFBGA, BGA73,10X12,32

73

EAR99

8542.32.00.71

Compare

AM41PDS3228DB10IT

Cypress Semiconductor

Check for Price

No

Active

2 V

2 V

100 ns

MEMORY CIRCUIT

FLASH+SRAM

30 µA

CMOS

INDUSTRIAL

R-PBGA-B73

Not Qualified

85 °C

-40 °C

73

PLASTIC/EPOXY

FBGA

BGA73,10X12,32

RECTANGULAR

GRID ARRAY, FINE PITCH

YES

BALL

800 µm

BOTTOM

CYPRESS SEMICONDUCTOR CORP

compliant

AM41PDS3228DB10IT

Spansion

Check for Price

No

No

Obsolete

33.5544 Mbit

16

2MX16

2 V

100 ns

MEMORY CIRCUIT

SRAM IS ORGANISED AS 512K X 16/1M X 8

FLASH+SRAM

1

2000000

2.0972 M

ASYNCHRONOUS

30 µA

2.2 V

1.8 V

CMOS

INDUSTRIAL

R-PBGA-B73

Not Qualified

e0

3

85 °C

-40 °C

260

73

PLASTIC/EPOXY

LFBGA

BGA73,10X12,32

RECTANGULAR

GRID ARRAY, LOW PROFILE, FINE PITCH

YES

TIN LEAD

BALL

800 µm

BOTTOM

1.4 mm

11.6 mm

8 mm

SPANSION INC

not_compliant

BGA

8 X 11.60 MM, FBGA-73

73

EAR99

8542.32.00.71

AM41PDS3228DB10IT

AMD

Check for Price

No

Transferred

33.5544 Mbit

16

2MX16

2 V

100 ns

MEMORY CIRCUIT

SRAM CONFIGURATION IS 1M X 8/512K X 16

FLASH+SRAM

1

2000000

2.0972 M

ASYNCHRONOUS

30 µA

2.2 V

1.8 V

CMOS

INDUSTRIAL

R-PBGA-B73

Not Qualified

e0

85 °C

-40 °C

73

PLASTIC/EPOXY

LFBGA

BGA73,10X12,32

RECTANGULAR

GRID ARRAY, LOW PROFILE, FINE PITCH

YES

Tin/Lead (Sn/Pb)

BALL

800 µm

BOTTOM

1.4 mm

11.6 mm

8 mm

ADVANCED MICRO DEVICES INC

unknown

BGA

LFBGA, BGA73,10X12,32

73

EAR99

8542.32.00.71