Findchips: Parametric Search Results for AM29SL800BB170WBI


Select Parts		Part Number

		AM29SL800BB-170WBI AMD
		AM29SL800BB170WBI AMD
		AM29SL800BB170WBI Spansion
		AM29SL800BB-170WBI Spansion

				Most Relevant							Technical																								Compliance			Operating Conditions				Physical											Dimensions			Other
Composite Price	Pbfree Code	Rohs Code	Part Life Cycle Code	Memory Density	Memory Width	Sector Size	Organization	Supply Voltage-Nom (Vsup)	Power Supplies	Access Time-Max	Memory IC Type	Additional Feature	Alternate Memory Width	Boot Block	Command User Interface	Data Polling	Endurance	Number of Functions	Number of Sectors/Size	Number of Words Code	Number of Words	Operating Mode	Output Characteristics	Parallel/Serial	Programming Voltage	Ready/Busy	Standby Current-Max	Supply Current-Max	Supply Voltage-Max (Vsup)	Supply Voltage-Min (Vsup)	Technology	Temperature Grade	Toggle Bit	Type	JESD-30 Code	Qualification Status	JESD-609 Code	Operating Temperature-Max	Operating Temperature-Min	Peak Reflow Temperature (Cel)	Time@Peak Reflow Temperature-Max (s)	Number of Terminals	Package Body Material	Package Code	Package Equivalence Code	Package Shape	Package Style	Surface Mount	Terminal Finish	Terminal Form	Terminal Pitch	Terminal Position	Seated Height-Max	Length	Width	Ihs Manufacturer	Part Package Code	Package Description	Pin Count	Reach Compliance Code	ECCN Code	HTS Code

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Transferred

8.3886 Mbit

16K,8K,32K,64K

1MX8

2 V

1.8/2.2 V

170 ns

FLASH

BOTTOM

YES

100000 Write/Erase Cycles

1,2,1,15

1000000

1.0486 M

ASYNCHRONOUS

3-STATE

PARALLEL

1.8 V

YES

5 µA

15 µA

2.2 V

1.8 V

CMOS

INDUSTRIAL

YES

NOR TYPE

R-PBGA-B48

Not Qualified

85 °C

-40 °C

PLASTIC/EPOXY

TFBGA

BGA48,6X8,32

RECTANGULAR

GRID ARRAY, THIN PROFILE, FINE PITCH

YES

Tin/Lead (Sn/Pb)

BALL

800 µm

BOTTOM

1.2 mm

9 mm

6 mm

ADVANCED MICRO DEVICES INC

BGA

6 X 9 MM, 0.80 MM PITCH, FBGA-48

unknown

Check for Price

Transferred

8.3886 Mbit

16K,8K,32K,64K

1MX8

2 V

170 ns

FLASH

USER CONFIGURABLE AS 512K X 16

BOTTOM

YES

100000 Write/Erase Cycles

1,2,1,15

1000000

1.0486 M

ASYNCHRONOUS

PARALLEL

1.8 V

YES

5 µA

15 µA

2.2 V

1.8 V

CMOS

INDUSTRIAL

YES

NOR TYPE

R-PBGA-B48

Not Qualified

85 °C

-40 °C

PLASTIC/EPOXY

BGA

BGA48,6X8,32

RECTANGULAR

GRID ARRAY

YES

Tin/Lead (Sn/Pb)

BALL

800 µm

BOTTOM

ADVANCED MICRO DEVICES INC

BGA

6 X 9 MM, 0.80 MM PITCH, FBGA-48

unknown

EAR99

8542.32.00.51

Check for Price

Obsolete

8.3886 Mbit

1MX8

2 V

170 ns

FLASH

USER CONFIGURABLE AS 512K X 16

BOTTOM

1000000

1.0486 M

ASYNCHRONOUS

PARALLEL

1.8 V

2.2 V

1.8 V

CMOS

INDUSTRIAL

NOR TYPE

R-PBGA-B48

Not Qualified

85 °C

-40 °C

PLASTIC/EPOXY

BGA

RECTANGULAR

GRID ARRAY

YES

TIN LEAD

BALL

BOTTOM

SPANSION INC

BGA

6 X 9 MM, 0.80 MM PITCH, FBGA-48

compliant

EAR99

8542.32.00.51

Check for Price

Obsolete

8.3886 Mbit

1MX8

2 V

170 ns

FLASH

1000000

1.0486 M

ASYNCHRONOUS

PARALLEL

1.8 V

2.2 V

1.8 V

CMOS

INDUSTRIAL

R-PBGA-B48

Not Qualified

85 °C

-40 °C

240

PLASTIC/EPOXY

TFBGA

RECTANGULAR

GRID ARRAY, THIN PROFILE, FINE PITCH

YES

TIN LEAD

BALL

800 µm

BOTTOM

1.2 mm

9 mm

6 mm

SPANSION INC

BGA

TFBGA,

compliant

Compare

AM29SL800BB-170WBI

AMD

Check for Price

Transferred

8.3886 Mbit

16K,8K,32K,64K

1MX8

2 V

1.8/2.2 V

170 ns

FLASH

BOTTOM

YES

100000 Write/Erase Cycles

1,2,1,15

1000000

1.0486 M

ASYNCHRONOUS

3-STATE

PARALLEL

1.8 V

YES

5 µA

15 µA

2.2 V

1.8 V

CMOS

INDUSTRIAL

YES

NOR TYPE

R-PBGA-B48

Not Qualified

85 °C

-40 °C

PLASTIC/EPOXY

TFBGA

BGA48,6X8,32

RECTANGULAR

GRID ARRAY, THIN PROFILE, FINE PITCH

YES

Tin/Lead (Sn/Pb)

BALL

800 µm

BOTTOM

1.2 mm

9 mm

6 mm

ADVANCED MICRO DEVICES INC

BGA

6 X 9 MM, 0.80 MM PITCH, FBGA-48

unknown

AM29SL800BB170WBI

AMD

Check for Price

Transferred

8.3886 Mbit

16K,8K,32K,64K

1MX8

2 V

170 ns

FLASH

USER CONFIGURABLE AS 512K X 16

BOTTOM

YES

100000 Write/Erase Cycles

1,2,1,15

1000000

1.0486 M

ASYNCHRONOUS

PARALLEL

1.8 V

YES

5 µA

15 µA

2.2 V

1.8 V

CMOS

INDUSTRIAL

YES

NOR TYPE

R-PBGA-B48

Not Qualified

85 °C

-40 °C

PLASTIC/EPOXY

BGA

BGA48,6X8,32

RECTANGULAR

GRID ARRAY

YES

Tin/Lead (Sn/Pb)

BALL

800 µm

BOTTOM

ADVANCED MICRO DEVICES INC

BGA

6 X 9 MM, 0.80 MM PITCH, FBGA-48

unknown

EAR99

8542.32.00.51

AM29SL800BB170WBI

Spansion

Check for Price

Obsolete

8.3886 Mbit

1MX8

2 V

170 ns

FLASH

USER CONFIGURABLE AS 512K X 16

BOTTOM

1000000

1.0486 M

ASYNCHRONOUS

PARALLEL

1.8 V

2.2 V

1.8 V

CMOS

INDUSTRIAL

NOR TYPE

R-PBGA-B48

Not Qualified

85 °C

-40 °C

PLASTIC/EPOXY

BGA

RECTANGULAR

GRID ARRAY

YES

TIN LEAD

BALL

BOTTOM

SPANSION INC

BGA

6 X 9 MM, 0.80 MM PITCH, FBGA-48

compliant

EAR99

8542.32.00.51

AM29SL800BB-170WBI

Spansion

Check for Price

Obsolete

8.3886 Mbit

1MX8

2 V

170 ns

FLASH

1000000

1.0486 M

ASYNCHRONOUS

PARALLEL

1.8 V

2.2 V

1.8 V

CMOS

INDUSTRIAL

R-PBGA-B48

Not Qualified

85 °C

-40 °C

240

PLASTIC/EPOXY

TFBGA

RECTANGULAR

GRID ARRAY, THIN PROFILE, FINE PITCH

YES

TIN LEAD

BALL

800 µm

BOTTOM

1.2 mm

9 mm

6 mm

SPANSION INC

BGA

TFBGA,

compliant

Parametric results for: AM29SL800BB170WBI under Flash Memories