Parametric results for: AM29PDL127H53VKI under Flash Memories

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Manufacturer Part Number: am29pdl127h53vki
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AM29PDL127H53VKI
Spansion
Check for Price No Obsolete 134.2177 Mbit 16 4K,32K 8MX16 3 V 55 ns FLASH BOTTOM/TOP YES YES YES 1 16,254 8000000 8.3886 M ASYNCHRONOUS 8 words PARALLEL 3 V YES 5 µA 55 µA 3.6 V 2.7 V CMOS INDUSTRIAL YES NOR TYPE R-PBGA-B80 Not Qualified e0 3 85 °C -40 °C 80 PLASTIC/EPOXY VFBGA BGA80,8X12,32 RECTANGULAR GRID ARRAY, VERY THIN PROFILE, FINE PITCH YES TIN LEAD BALL 800 µm BOTTOM 1 mm 11.5 mm 9 mm SPANSION INC BGA VFBGA, BGA80,8X12,32 80 compliant EAR99 8542.32.00.51
AM29PDL127H53VKIN
Cypress Semiconductor
Check for Price No Active 134.2177 Mbit 4K,32K 8MX16 3/3.3 V 55 ns FLASH BOTTOM/TOP YES YES YES 16,254 8000000 8.3886 M 8 words PARALLEL YES 5 µA 55 µA CMOS INDUSTRIAL YES NOR TYPE R-PBGA-B80 Not Qualified 85 °C -40 °C 80 PLASTIC/EPOXY FBGA BGA80,8X12,32 RECTANGULAR GRID ARRAY, FINE PITCH YES BALL 800 µm BOTTOM CYPRESS SEMICONDUCTOR CORP compliant
AM29PDL127H53VKI
AMD
Check for Price No Transferred 134.2177 Mbit 16 4K,32K 8MX16 3 V 55 ns FLASH BOTTOM/TOP YES YES YES 16,254 8000000 8.3886 M 8 words PARALLEL YES 5 µA 55 µA CMOS INDUSTRIAL YES NOR TYPE R-PBGA-B80 Not Qualified e0 85 °C -40 °C 80 PLASTIC/EPOXY FBGA BGA80,8X12,32 RECTANGULAR GRID ARRAY, FINE PITCH YES Tin/Lead (Sn/Pb) BALL 800 µm BOTTOM ADVANCED MICRO DEVICES INC FBGA, BGA80,8X12,32 unknown EAR99 8542.32.00.51