Parametric results for: AM29LV6402MH100R under Flash Memories

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Manufacturer Part Number: am29lv6402mh100r
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AM29LV6402MH100RPHF
Spansion
Check for Price Yes Obsolete 134.2177 Mbit 32 4MX32 3.3 V 100 ns FLASH MODULE 16 BOTTOM/TOP 1 4000000 4.1943 M ASYNCHRONOUS PARALLEL 3.3 V 3.6 V 3 V CMOS INDUSTRIAL NOR TYPE R-PBGA-B80 Not Qualified e1 3 85 °C -40 °C 80 PLASTIC/EPOXY LBGA RECTANGULAR GRID ARRAY, LOW PROFILE YES TIN SILVER COPPER BALL 1 mm BOTTOM 1.6 mm 13 mm 11 mm SPANSION INC BGA 13 X 11 MM, 1 MM PITCH, FORTIFIED, BGA-80 80 compliant EAR99 8542.32.00.51
AM29LV6402MH100RPHI
AMD
Check for Price No Transferred 134.2177 Mbit 32 64K 4MX32 100 ns FLASH 16 BOTTOM/TOP YES YES YES 128 4000000 4.1943 M 4/8 words PARALLEL YES 10 µA 160 µA CMOS INDUSTRIAL YES NOR TYPE R-PBGA-B80 Not Qualified e0 85 °C -40 °C 80 PLASTIC/EPOXY BGA BGA80,8X10,40 RECTANGULAR GRID ARRAY YES Tin/Lead (Sn/Pb) BALL 1 mm BOTTOM ADVANCED MICRO DEVICES INC unknown EAR99 8542.32.00.51
AM29LV6402MH100RPHI
Spansion
Check for Price No Obsolete 134.2177 Mbit 32 64K 4MX32 3.3 V 100 ns FLASH MODULE 16 BOTTOM/TOP YES YES YES 1 128 4000000 4.1943 M ASYNCHRONOUS 4/8 words PARALLEL 3.3 V YES 10 µA 160 µA 3.6 V 3 V CMOS INDUSTRIAL YES NOR TYPE R-PBGA-B80 Not Qualified e0 3 85 °C -40 °C 260 80 PLASTIC/EPOXY LBGA BGA80,8X10,40 RECTANGULAR GRID ARRAY, LOW PROFILE YES TIN LEAD BALL 1 mm BOTTOM 1.6 mm 13 mm 11 mm SPANSION INC BGA 13 X 11 MM, 1 MM PITCH, FORTIFIED, BGA-80 80 not_compliant EAR99 8542.32.00.51