Findchips: Parametric Search Results for AM29LV400BB90WAE


Select Parts		Part Number

		AM29LV400BB-90WAE Spansion
		AM29LV400BB-90WAE AMD
		AM29LV400BB90WAE AMD
		AM29LV400BB90WAE Spansion

				Most Relevant						Technical																								Compliance			Operating Conditions					Physical											Dimensions			Other
Composite Price	Pbfree Code	Rohs Code	Part Life Cycle Code	Memory Density	Memory Width	Sector Size	Organization	Supply Voltage-Nom (Vsup)	Access Time-Max	Memory IC Type	Additional Feature	Alternate Memory Width	Boot Block	Command User Interface	Data Polling	Data Retention Time-Min	Endurance	Number of Functions	Number of Sectors/Size	Number of Words Code	Number of Words	Operating Mode	Parallel/Serial	Programming Voltage	Ready/Busy	Standby Current-Max	Supply Current-Max	Supply Voltage-Max (Vsup)	Supply Voltage-Min (Vsup)	Technology	Temperature Grade	Toggle Bit	Type	JESD-30 Code	Qualification Status	JESD-609 Code	Moisture Sensitivity Level	Operating Temperature-Max	Operating Temperature-Min	Peak Reflow Temperature (Cel)	Time@Peak Reflow Temperature-Max (s)	Number of Terminals	Package Body Material	Package Code	Package Equivalence Code	Package Shape	Package Style	Surface Mount	Terminal Finish	Terminal Form	Terminal Pitch	Terminal Position	Seated Height-Max	Length	Width	Ihs Manufacturer	Part Package Code	Package Description	Pin Count	Reach Compliance Code	ECCN Code	HTS Code

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Obsolete

4.1943 Mbit

512KX8

3 V

90 ns

FLASH

CONFG AS 256K X 16; EMBEDDED ALGORITHMS;... more

512000

524.288 k

ASYNCHRONOUS

PARALLEL

3 V

3.6 V

2.7 V

CMOS

MILITARY

R-PBGA-B48

Not Qualified

125 °C

-55 °C

240

PLASTIC/EPOXY

TFBGA

RECTANGULAR

GRID ARRAY, THIN PROFILE, FINE PITCH

YES

TIN LEAD

BALL

800 µm

BOTTOM

1.2 mm

8 mm

6 mm

SPANSION INC

BGA

TFBGA,

compliant

Check for Price

Transferred

4.1943 Mbit

512KX8

3 V

90 ns

FLASH

CONFG AS 256K X 16; EMBEDDED ALGORITHMS;... more

512000

524.288 k

ASYNCHRONOUS

PARALLEL

3 V

3.6 V

2.7 V

CMOS

MILITARY

R-PBGA-B48

Not Qualified

125 °C

-55 °C

PLASTIC/EPOXY

TFBGA

RECTANGULAR

GRID ARRAY, THIN PROFILE, FINE PITCH

YES

BALL

800 µm

BOTTOM

1.2 mm

8 mm

6 mm

ADVANCED MICRO DEVICES INC

BGA

6 X 8 MM, 0.80 MM PITCH, FBGA-48

unknown

Check for Price

Transferred

4.1943 Mbit

16K,8K,32K,64K

256KX16

3 V

90 ns

FLASH

MINIMUM 1000K WRITE CYCLES; 20 YEAR DATA... more

BOTTOM

YES

1000000 Write/Erase Cycles

1,2,1,7

256000

262.144 k

ASYNCHRONOUS

PARALLEL

3 V

YES

5 µA

30 µA

3.6 V

2.7 V

CMOS

MILITARY

YES

NOR TYPE

R-PBGA-B48

Not Qualified

125 °C

-55 °C

PLASTIC/EPOXY

TFBGA

BGA48,6X8,32

RECTANGULAR

GRID ARRAY, THIN PROFILE, FINE PITCH

YES

Tin/Lead (Sn/Pb)

BALL

800 µm

BOTTOM

1.2 mm

8.15 mm

6.15 mm

ADVANCED MICRO DEVICES INC

BGA

TFBGA, BGA48,6X8,32

unknown

3A001.A.2.C

8542.32.00.51

Check for Price

Obsolete

4.1943 Mbit

16K,8K,32K,64K

256KX16

3 V

90 ns

FLASH

BOTTOM BOOT BLOCK

BOTTOM

YES

1000000 Write/Erase Cycles

1,2,1,7

256000

262.144 k

ASYNCHRONOUS

PARALLEL

3 V

YES

5 µA

30 µA

3.6 V

2.7 V

CMOS

MILITARY

YES

NOR TYPE

R-PBGA-B48

Not Qualified

125 °C

-55 °C

260

PLASTIC/EPOXY

TFBGA

BGA48,6X8,32

RECTANGULAR

GRID ARRAY, THIN PROFILE, FINE PITCH

YES

TIN LEAD

BALL

800 µm

BOTTOM

1.2 mm

8.15 mm

6.15 mm

SPANSION INC

BGA

6 X 8 MM, 0.80 MM PITCH, FBGA-48

not_compliant

3A001.A.2.C

8542.32.00.51

Compare

AM29LV400BB-90WAE

Spansion

Check for Price

Obsolete

4.1943 Mbit

512KX8

3 V

90 ns

FLASH

CONFG AS 256K X 16; EMBEDDED ALGORITHMS;... more

512000

524.288 k

ASYNCHRONOUS

PARALLEL

3 V

3.6 V

2.7 V

CMOS

MILITARY

R-PBGA-B48

Not Qualified

125 °C

-55 °C

240

PLASTIC/EPOXY

TFBGA

RECTANGULAR

GRID ARRAY, THIN PROFILE, FINE PITCH

YES

TIN LEAD

BALL

800 µm

BOTTOM

1.2 mm

8 mm

6 mm

SPANSION INC

BGA

TFBGA,

compliant

AM29LV400BB-90WAE

AMD

Check for Price

Transferred

4.1943 Mbit

512KX8

3 V

90 ns

FLASH

CONFG AS 256K X 16; EMBEDDED ALGORITHMS;... more

512000

524.288 k

ASYNCHRONOUS

PARALLEL

3 V

3.6 V

2.7 V

CMOS

MILITARY

R-PBGA-B48

Not Qualified

125 °C

-55 °C

PLASTIC/EPOXY

TFBGA

RECTANGULAR

GRID ARRAY, THIN PROFILE, FINE PITCH

YES

BALL

800 µm

BOTTOM

1.2 mm

8 mm

6 mm

ADVANCED MICRO DEVICES INC

BGA

6 X 8 MM, 0.80 MM PITCH, FBGA-48

unknown

AM29LV400BB90WAE

AMD

Check for Price

Transferred

4.1943 Mbit

16K,8K,32K,64K

256KX16

3 V

90 ns

FLASH

MINIMUM 1000K WRITE CYCLES; 20 YEAR DATA... more

BOTTOM

YES

1000000 Write/Erase Cycles

1,2,1,7

256000

262.144 k

ASYNCHRONOUS

PARALLEL

3 V

YES

5 µA

30 µA

3.6 V

2.7 V

CMOS

MILITARY

YES

NOR TYPE

R-PBGA-B48

Not Qualified

125 °C

-55 °C

PLASTIC/EPOXY

TFBGA

BGA48,6X8,32

RECTANGULAR

GRID ARRAY, THIN PROFILE, FINE PITCH

YES

Tin/Lead (Sn/Pb)

BALL

800 µm

BOTTOM

1.2 mm

8.15 mm

6.15 mm

ADVANCED MICRO DEVICES INC

BGA

TFBGA, BGA48,6X8,32

unknown

3A001.A.2.C

8542.32.00.51

AM29LV400BB90WAE

Spansion

Check for Price

Obsolete

4.1943 Mbit

16K,8K,32K,64K

256KX16

3 V

90 ns

FLASH

BOTTOM BOOT BLOCK

BOTTOM

YES

1000000 Write/Erase Cycles

1,2,1,7

256000

262.144 k

ASYNCHRONOUS

PARALLEL

3 V

YES

5 µA

30 µA

3.6 V

2.7 V

CMOS

MILITARY

YES

NOR TYPE

R-PBGA-B48

Not Qualified

125 °C

-55 °C

260

PLASTIC/EPOXY

TFBGA

BGA48,6X8,32

RECTANGULAR

GRID ARRAY, THIN PROFILE, FINE PITCH

YES

TIN LEAD

BALL

800 µm

BOTTOM

1.2 mm

8.15 mm

6.15 mm

SPANSION INC

BGA

6 X 8 MM, 0.80 MM PITCH, FBGA-48

not_compliant

3A001.A.2.C

8542.32.00.51

Parametric results for: AM29LV400BB90WAE under Flash Memories