Findchips: Parametric Search Results for AM29LV033MU

Parametric results for: AM29LV033MU under Flash Memories

Select parts from the table below to compare.

Compare


Select Parts		Part Number

		AM29LV033MU112RFI Spansion
		AM29LV033MU112RWMI AMD
		AM29LV033MU120RWMI Spansion
		AM29LV033MU90RWMF Spansion
		AM29LV033MU120RWMF Spansion
		AM29LV033MU90RWMI Spansion
		AM29LV033MU112WMF Spansion
		AM29LV033MU90RWCI AMD
		AM29LV033MU120REI AMD
		AM29LV033MU101RWCI AMD

			Most Relevant						Technical																								Compliance			Operating Conditions					Physical											Dimensions			Other
Composite Price	Rohs Code	Part Life Cycle Code	Memory Density	Memory Width	Sector Size	Organization	Supply Voltage-Nom (Vsup)	Access Time-Max	Memory IC Type	Alternate Memory Width	Boot Block	Command User Interface	Common Flash Interface	Data Polling	Number of Functions	Number of Sectors/Size	Number of Words Code	Number of Words	Operating Mode	Page Size	Parallel/Serial	Programming Voltage	Ready/Busy	Reverse Pinout	Standby Current-Max	Supply Current-Max	Supply Voltage-Max (Vsup)	Supply Voltage-Min (Vsup)	Technology	Temperature Grade	Toggle Bit	Type	JESD-30 Code	Qualification Status	JESD-609 Code	Moisture Sensitivity Level	Operating Temperature-Max	Operating Temperature-Min	Peak Reflow Temperature (Cel)	Time@Peak Reflow Temperature-Max (s)	Number of Terminals	Package Body Material	Package Code	Package Equivalence Code	Package Shape	Package Style	Surface Mount	Terminal Finish	Terminal Form	Terminal Pitch	Terminal Position	Seated Height-Max	Length	Width	Ihs Manufacturer	Part Package Code	Package Description	Pin Count	Reach Compliance Code	ECCN Code	HTS Code

Check for Price

Obsolete

33.5544 Mbit

64K

4MX8

3.3 V

110 ns

FLASH

BOTTOM/TOP

YES

4000000

4.1943 M

ASYNCHRONOUS

8 words

PARALLEL

3 V

YES

5 µA

80 µA

3.6 V

3 V

CMOS

INDUSTRIAL

YES

NOR TYPE

R-PDSO-G40

Not Qualified

85 °C

-40 °C

260

PLASTIC/EPOXY

TSOP1-R

TSSOP40,.8,20

RECTANGULAR

SMALL OUTLINE, THIN PROFILE

YES

TIN LEAD

GULL WING

500 µm

DUAL

1.2 mm

18.4 mm

10 mm

SPANSION INC

TSOP1

REVERSE, MO-142CD, TSOP-40

not_compliant

EAR99

8542.32.00.51

Check for Price

Transferred

33.5544 Mbit

64K

4MX8

3.3 V

110 ns

FLASH

BOTTOM/TOP

YES

4000000

4.1943 M

ASYNCHRONOUS

8 words

PARALLEL

3 V

YES

5 µA

60 µA

3.6 V

3 V

CMOS

INDUSTRIAL

YES

NOR TYPE

R-PBGA-B48

Not Qualified

85 °C

-40 °C

PLASTIC/EPOXY

TFBGA

BGA48,6X8,32

RECTANGULAR

GRID ARRAY, THIN PROFILE, FINE PITCH

YES

Tin/Lead (Sn/Pb)

BALL

800 µm

BOTTOM

1.2 mm

12 mm

6 mm

ADVANCED MICRO DEVICES INC

BGA

6 X 12 MM, 0.80 MM PITCH, FBGA-48

unknown

EAR99

8542.32.00.51

Check for Price

Obsolete

33.5544 Mbit

64K

4MX8

3.3 V

120 ns

FLASH

BOTTOM/TOP

YES

4000000

4.1943 M

ASYNCHRONOUS

8 words

PARALLEL

3 V

YES

5 µA

60 µA

3.6 V

3 V

CMOS

INDUSTRIAL

YES

NOR TYPE

R-PBGA-B48

Not Qualified

85 °C

-40 °C

260

PLASTIC/EPOXY

TFBGA

BGA48,6X8,32

RECTANGULAR

GRID ARRAY, THIN PROFILE, FINE PITCH

YES

TIN LEAD

BALL

800 µm

BOTTOM

1.2 mm

12 mm

6 mm

SPANSION INC

BGA

6 X 12 MM, 0.80 MM PITCH, FBGA-48

not_compliant

EAR99

8542.32.00.51

Check for Price

Obsolete

33.5544 Mbit

4MX8

3.3 V

90 ns

FLASH

BOTTOM/TOP

4000000

4.1943 M

ASYNCHRONOUS

PARALLEL

3 V

3.6 V

3 V

CMOS

INDUSTRIAL

NOR TYPE

R-PBGA-B48

Not Qualified

85 °C

-40 °C

NOT SPECIFIED

PLASTIC/EPOXY

TFBGA

RECTANGULAR

GRID ARRAY, THIN PROFILE, FINE PITCH

YES

BALL

800 µm

BOTTOM

1.2 mm

12 mm

6 mm

SPANSION INC

BGA

6 X 12 MM, 0.80 MM PITCH, FBGA-48

unknown

EAR99

8542.32.00.51

Check for Price

Obsolete

33.5544 Mbit

4MX8

3.3 V

120 ns

FLASH

BOTTOM/TOP

4000000

4.1943 M

ASYNCHRONOUS

PARALLEL

3 V

3.6 V

3 V

CMOS

INDUSTRIAL

NOR TYPE

R-PBGA-B48

Not Qualified

85 °C

-40 °C

NOT SPECIFIED

PLASTIC/EPOXY

TFBGA

RECTANGULAR

GRID ARRAY, THIN PROFILE, FINE PITCH

YES

BALL

800 µm

BOTTOM

1.2 mm

12 mm

6 mm

SPANSION INC

BGA

6 X 12 MM, 0.80 MM PITCH, FBGA-48

unknown

EAR99

8542.32.00.51

Check for Price

Obsolete

33.5544 Mbit

64K

4MX8

3.3 V

90 ns

FLASH

BOTTOM/TOP

YES

4000000

4.1943 M

ASYNCHRONOUS

8 words

PARALLEL

3 V

YES

5 µA

60 µA

3.6 V

3 V

CMOS

INDUSTRIAL

YES

NOR TYPE

R-PBGA-B48

Not Qualified

85 °C

-40 °C

260

PLASTIC/EPOXY

TFBGA

BGA48,6X8,32

RECTANGULAR

GRID ARRAY, THIN PROFILE, FINE PITCH

YES

TIN LEAD

BALL

800 µm

BOTTOM

1.2 mm

12 mm

6 mm

SPANSION INC

BGA

6 X 12 MM, 0.80 MM PITCH, FBGA-48

not_compliant

EAR99

8542.32.00.51

Check for Price

Obsolete

33.5544 Mbit

4MX8

3 V

110 ns

FLASH

BOTTOM/TOP

4000000

4.1943 M

ASYNCHRONOUS

PARALLEL

3 V

3.6 V

2.7 V

CMOS

INDUSTRIAL

NOR TYPE

R-PBGA-B48

Not Qualified

85 °C

-40 °C

NOT SPECIFIED

PLASTIC/EPOXY

TFBGA

RECTANGULAR

GRID ARRAY, THIN PROFILE, FINE PITCH

YES

BALL

800 µm

BOTTOM

1.2 mm

12 mm

6 mm

SPANSION INC

BGA

6 X 12 MM, 0.80 MM PITCH, FBGA-48

unknown

EAR99

8542.32.00.51

Check for Price

Transferred

33.5544 Mbit

64K

4MX8

3.3 V

90 ns

FLASH

YES

4000000

4.1943 M

ASYNCHRONOUS

8 words

PARALLEL

3 V

YES

5 µA

60 µA

3.6 V

3 V

CMOS

INDUSTRIAL

YES

NOR TYPE

R-PBGA-B48

Not Qualified

85 °C

-40 °C

PLASTIC/EPOXY

TFBGA

BGA48,6X8,32

RECTANGULAR

GRID ARRAY, THIN PROFILE, FINE PITCH

YES

Tin/Lead (Sn/Pb)

BALL

800 µm

BOTTOM

1.2 mm

9 mm

8 mm

ADVANCED MICRO DEVICES INC

BGA

9 X 8 MM, 0.80 MM PITCH, FBGA-48

unknown

EAR99

8542.32.00.51

Check for Price

Transferred

33.5544 Mbit

64K

4MX8

3.3 V

120 ns

FLASH

YES

4000000

4.1943 M

ASYNCHRONOUS

8 words

PARALLEL

3 V

YES

5 µA

60 µA

3.6 V

3 V

CMOS

INDUSTRIAL

YES

NOR TYPE

R-PDSO-G40

Not Qualified

85 °C

-40 °C

PLASTIC/EPOXY

TSOP1

TSSOP40,.8,20

RECTANGULAR

SMALL OUTLINE, THIN PROFILE

YES

Tin/Lead (Sn/Pb)

GULL WING

500 µm

DUAL

1.2 mm

18.4 mm

10 mm

ADVANCED MICRO DEVICES INC

TSOP1

MO-142BCD, TSOP-40

unknown

EAR99

8542.32.00.51

Check for Price

Transferred

33.5544 Mbit

64K

4MX8

3.3 V

100 ns

FLASH

YES

4000000

4.1943 M

ASYNCHRONOUS

8 words

PARALLEL

3 V

YES

5 µA

60 µA

3.6 V

3 V

CMOS

INDUSTRIAL

YES

NOR TYPE

R-PBGA-B48

Not Qualified

85 °C

-40 °C

PLASTIC/EPOXY

TFBGA

BGA48,6X8,32

RECTANGULAR

GRID ARRAY, THIN PROFILE, FINE PITCH

YES

Tin/Lead (Sn/Pb)

BALL

800 µm

BOTTOM

1.2 mm

9 mm

8 mm

ADVANCED MICRO DEVICES INC

BGA

TFBGA, BGA48,6X8,32

unknown

EAR99

8542.32.00.51

1 2 3 4 5 Next

Compare

AM29LV033MU112RFI

Spansion

Check for Price

Obsolete

33.5544 Mbit

64K

4MX8

3.3 V

110 ns

FLASH

BOTTOM/TOP

YES

4000000

4.1943 M

ASYNCHRONOUS

8 words

PARALLEL

3 V

YES

5 µA

80 µA

3.6 V

3 V

CMOS

INDUSTRIAL

YES

NOR TYPE

R-PDSO-G40

Not Qualified

85 °C

-40 °C

260

PLASTIC/EPOXY

TSOP1-R

TSSOP40,.8,20

RECTANGULAR

SMALL OUTLINE, THIN PROFILE

YES

TIN LEAD

GULL WING

500 µm

DUAL

1.2 mm

18.4 mm

10 mm

SPANSION INC

TSOP1

REVERSE, MO-142CD, TSOP-40

not_compliant

EAR99

8542.32.00.51

AM29LV033MU112RWMI

AMD

Check for Price

Transferred

33.5544 Mbit

64K

4MX8

3.3 V

110 ns

FLASH

BOTTOM/TOP

YES

4000000

4.1943 M

ASYNCHRONOUS

8 words

PARALLEL

3 V

YES

5 µA

60 µA

3.6 V

3 V

CMOS

INDUSTRIAL

YES

NOR TYPE

R-PBGA-B48

Not Qualified

85 °C

-40 °C

PLASTIC/EPOXY

TFBGA

BGA48,6X8,32

RECTANGULAR

GRID ARRAY, THIN PROFILE, FINE PITCH

YES

Tin/Lead (Sn/Pb)

BALL

800 µm

BOTTOM

1.2 mm

12 mm

6 mm

ADVANCED MICRO DEVICES INC

BGA

6 X 12 MM, 0.80 MM PITCH, FBGA-48

unknown

EAR99

8542.32.00.51

AM29LV033MU120RWMI

Spansion

Check for Price

Obsolete

33.5544 Mbit

64K

4MX8

3.3 V

120 ns

FLASH

BOTTOM/TOP

YES

4000000

4.1943 M

ASYNCHRONOUS

8 words

PARALLEL

3 V

YES

5 µA

60 µA

3.6 V

3 V

CMOS

INDUSTRIAL

YES

NOR TYPE

R-PBGA-B48

Not Qualified

85 °C

-40 °C

260

PLASTIC/EPOXY

TFBGA

BGA48,6X8,32

RECTANGULAR

GRID ARRAY, THIN PROFILE, FINE PITCH

YES

TIN LEAD

BALL

800 µm

BOTTOM

1.2 mm

12 mm

6 mm

SPANSION INC

BGA

6 X 12 MM, 0.80 MM PITCH, FBGA-48

not_compliant

EAR99

8542.32.00.51

AM29LV033MU90RWMF

Spansion

Check for Price

Obsolete

33.5544 Mbit

4MX8

3.3 V

90 ns

FLASH

BOTTOM/TOP

4000000

4.1943 M

ASYNCHRONOUS

PARALLEL

3 V

3.6 V

3 V

CMOS

INDUSTRIAL

NOR TYPE

R-PBGA-B48

Not Qualified

85 °C

-40 °C

NOT SPECIFIED

PLASTIC/EPOXY

TFBGA

RECTANGULAR

GRID ARRAY, THIN PROFILE, FINE PITCH

YES

BALL

800 µm

BOTTOM

1.2 mm

12 mm

6 mm

SPANSION INC

BGA

6 X 12 MM, 0.80 MM PITCH, FBGA-48

unknown

EAR99

8542.32.00.51

AM29LV033MU120RWMF

Spansion

Check for Price

Obsolete

33.5544 Mbit

4MX8

3.3 V

120 ns

FLASH

BOTTOM/TOP

4000000

4.1943 M

ASYNCHRONOUS

PARALLEL

3 V

3.6 V

3 V

CMOS

INDUSTRIAL

NOR TYPE

R-PBGA-B48

Not Qualified

85 °C

-40 °C

NOT SPECIFIED

PLASTIC/EPOXY

TFBGA

RECTANGULAR

GRID ARRAY, THIN PROFILE, FINE PITCH

YES

BALL

800 µm

BOTTOM

1.2 mm

12 mm

6 mm

SPANSION INC

BGA

6 X 12 MM, 0.80 MM PITCH, FBGA-48

unknown

EAR99

8542.32.00.51

AM29LV033MU90RWMI

Spansion

Check for Price

Obsolete

33.5544 Mbit

64K

4MX8

3.3 V

90 ns

FLASH

BOTTOM/TOP

YES

4000000

4.1943 M

ASYNCHRONOUS

8 words

PARALLEL

3 V

YES

5 µA

60 µA

3.6 V

3 V

CMOS

INDUSTRIAL

YES

NOR TYPE

R-PBGA-B48

Not Qualified

85 °C

-40 °C

260

PLASTIC/EPOXY

TFBGA

BGA48,6X8,32

RECTANGULAR

GRID ARRAY, THIN PROFILE, FINE PITCH

YES

TIN LEAD

BALL

800 µm

BOTTOM

1.2 mm

12 mm

6 mm

SPANSION INC

BGA

6 X 12 MM, 0.80 MM PITCH, FBGA-48

not_compliant

EAR99

8542.32.00.51

AM29LV033MU112WMF

Spansion

Check for Price

Obsolete

33.5544 Mbit

4MX8

3 V

110 ns

FLASH

BOTTOM/TOP

4000000

4.1943 M

ASYNCHRONOUS

PARALLEL

3 V

3.6 V

2.7 V

CMOS

INDUSTRIAL

NOR TYPE

R-PBGA-B48

Not Qualified

85 °C

-40 °C

NOT SPECIFIED

PLASTIC/EPOXY

TFBGA

RECTANGULAR

GRID ARRAY, THIN PROFILE, FINE PITCH

YES

BALL

800 µm

BOTTOM

1.2 mm

12 mm

6 mm

SPANSION INC

BGA

6 X 12 MM, 0.80 MM PITCH, FBGA-48

unknown

EAR99

8542.32.00.51

AM29LV033MU90RWCI

AMD

Check for Price

Transferred

33.5544 Mbit

64K

4MX8

3.3 V

90 ns

FLASH

YES

4000000

4.1943 M

ASYNCHRONOUS

8 words

PARALLEL

3 V

YES

5 µA

60 µA

3.6 V

3 V

CMOS

INDUSTRIAL

YES

NOR TYPE

R-PBGA-B48

Not Qualified

85 °C

-40 °C

PLASTIC/EPOXY

TFBGA

BGA48,6X8,32

RECTANGULAR

GRID ARRAY, THIN PROFILE, FINE PITCH

YES

Tin/Lead (Sn/Pb)

BALL

800 µm

BOTTOM

1.2 mm

9 mm

8 mm

ADVANCED MICRO DEVICES INC

BGA

9 X 8 MM, 0.80 MM PITCH, FBGA-48

unknown

EAR99

8542.32.00.51

AM29LV033MU120REI

AMD

Check for Price

Transferred

33.5544 Mbit

64K

4MX8

3.3 V

120 ns

FLASH

YES

4000000

4.1943 M

ASYNCHRONOUS

8 words

PARALLEL

3 V

YES

5 µA

60 µA

3.6 V

3 V

CMOS

INDUSTRIAL

YES

NOR TYPE

R-PDSO-G40

Not Qualified

85 °C

-40 °C

PLASTIC/EPOXY

TSOP1

TSSOP40,.8,20

RECTANGULAR

SMALL OUTLINE, THIN PROFILE

YES

Tin/Lead (Sn/Pb)

GULL WING

500 µm

DUAL

1.2 mm

18.4 mm

10 mm

ADVANCED MICRO DEVICES INC

TSOP1

MO-142BCD, TSOP-40

unknown

EAR99

8542.32.00.51

AM29LV033MU101RWCI

AMD

Check for Price

Transferred

33.5544 Mbit

64K

4MX8

3.3 V

100 ns

FLASH

YES

4000000

4.1943 M

ASYNCHRONOUS

8 words

PARALLEL

3 V

YES

5 µA

60 µA

3.6 V

3 V

CMOS

INDUSTRIAL

YES

NOR TYPE

R-PBGA-B48

Not Qualified

85 °C

-40 °C

PLASTIC/EPOXY

TFBGA

BGA48,6X8,32

RECTANGULAR

GRID ARRAY, THIN PROFILE, FINE PITCH

YES

Tin/Lead (Sn/Pb)

BALL

800 µm

BOTTOM

1.2 mm

9 mm

8 mm

ADVANCED MICRO DEVICES INC

BGA

TFBGA, BGA48,6X8,32

unknown

EAR99

8542.32.00.51

1 2 3 4 5 Next