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Manufacturer Part Number: am29lv033c120wdi
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AM29LV033C120WDIB
 Spansion 		Check for Price No Obsolete 33.5544 Mbit 8 4MX8 3 V 120 ns FLASH 1 4000000 4.1943 M ASYNCHRONOUS PARALLEL 3 V 3.6 V 2.7 V CMOS INDUSTRIAL NOR TYPE R-PBGA-B63 Not Qualified e0 3 85 °C -40 °C 63 PLASTIC/EPOXY TFBGA RECTANGULAR GRID ARRAY, THIN PROFILE, FINE PITCH YES TIN LEAD BALL 800 µm BOTTOM 1.2 mm 14 mm 8 mm SPANSION INC BGA 8 X 14 MM, 0.80 MM PITCH, FBGA-63 63 compliant EAR99 8542.32.00.51
AM29LV033C-120WDI
 Spansion 		Check for Price No No Obsolete 33.5544 Mbit 8 64K 4MX8 3 V 120 ns FLASH YES YES 1 64 4000000 4.1943 M ASYNCHRONOUS PARALLEL 3 V YES 5 µA 30 µA 3.6 V 2.7 V CMOS INDUSTRIAL YES NOR TYPE R-PBGA-B63 Not Qualified e0 3 85 °C -40 °C 260 63 PLASTIC/EPOXY TFBGA BGA63,8X12,32 RECTANGULAR GRID ARRAY, THIN PROFILE, FINE PITCH YES TIN LEAD BALL 800 µm BOTTOM 1.2 mm 14 mm 8 mm SPANSION INC BGA 8 X 14 MM, 0.80 MM PITCH, FBGA-63 63 not_compliant EAR99 8542.32.00.51
AM29LV033C120WDI
 Spansion 		Check for Price No No Obsolete 33.5544 Mbit 8 4MX8 3 V 120 ns FLASH MINIMUM 1000K WRITE CYCLES; 20 YEAR DATA RETENTION 1 4000000 4.1943 M ASYNCHRONOUS PARALLEL 3 V 3.6 V 2.7 V CMOS INDUSTRIAL R-PBGA-B63 Not Qualified e0 3 85 °C -40 °C 240 30 63 PLASTIC/EPOXY TFBGA RECTANGULAR GRID ARRAY, THIN PROFILE, FINE PITCH YES TIN LEAD BALL 800 µm BOTTOM 1.2 mm 14 mm 8 mm SPANSION INC BGA TFBGA, 63 compliant
AM29LV033C120WDIB
 AMD 		Check for Price Transferred 33.5544 Mbit 8 4MX8 3 V 120 ns FLASH 1 4000000 4.1943 M ASYNCHRONOUS PARALLEL 3 V 3.6 V 2.7 V CMOS INDUSTRIAL NOR TYPE R-PBGA-B63 Not Qualified 85 °C -40 °C 63 PLASTIC/EPOXY TFBGA RECTANGULAR GRID ARRAY, THIN PROFILE, FINE PITCH YES BALL 800 µm BOTTOM 1.2 mm 14 mm 8 mm ADVANCED MICRO DEVICES INC BGA 8 X 14 MM, 0.80 MM PITCH, FBGA-63 63 unknown EAR99 8542.32.00.51
AM29LV033C-120WDI
 AMD 		Check for Price No Transferred 33.5544 Mbit 8 64K 4MX8 3 V 120 ns FLASH YES YES 1 64 4000000 4.1943 M ASYNCHRONOUS PARALLEL 3 V YES 5 µA 30 µA 3.6 V 2.7 V CMOS INDUSTRIAL YES NOR TYPE R-PBGA-B63 Not Qualified e0 85 °C -40 °C 63 PLASTIC/EPOXY TFBGA BGA63,8X12,32 RECTANGULAR GRID ARRAY, THIN PROFILE, FINE PITCH YES Tin/Lead (Sn/Pb) BALL 800 µm BOTTOM 1.2 mm 14 mm 8 mm ADVANCED MICRO DEVICES INC BGA 8 X 14 MM, 0.80 MM PITCH, FBGA-63 63 unknown EAR99 8542.32.00.51
AM29LV033C120WDI
 AMD 		Check for Price Transferred 33.5544 Mbit 8 4MX8 3 V 120 ns FLASH MINIMUM 1000K WRITE CYCLES; 20 YEAR DATA RETENTION 1 4000000 4.1943 M ASYNCHRONOUS PARALLEL 3 V 3.6 V 2.7 V CMOS INDUSTRIAL R-PBGA-B63 Not Qualified 85 °C -40 °C 63 PLASTIC/EPOXY TFBGA RECTANGULAR GRID ARRAY, THIN PROFILE, FINE PITCH YES BALL 800 µm BOTTOM 1.2 mm 14 mm 8 mm ADVANCED MICRO DEVICES INC BGA 8 X 14 MM, 0.80 MM PITCH, FBGA-63 63 unknown