Findchips: Parametric Search Results for AM29DL640D90WHI


Select Parts		Part Number

		AM29DL640D90WHI Spansion
		AM29DL640D90WHIN AMD
		AM29DL640D90WHI AMD
		AM29DL640D90WHIN Spansion

				Most Relevant						Technical																						Compliance			Operating Conditions				Physical											Dimensions			Other
Composite Price	Pbfree Code	Rohs Code	Part Life Cycle Code	Memory Density	Memory Width	Sector Size	Organization	Supply Voltage-Nom (Vsup)	Access Time-Max	Memory IC Type	Alternate Memory Width	Boot Block	Command User Interface	Common Flash Interface	Data Polling	Number of Functions	Number of Sectors/Size	Number of Words Code	Number of Words	Operating Mode	Parallel/Serial	Programming Voltage	Ready/Busy	Standby Current-Max	Supply Current-Max	Supply Voltage-Max (Vsup)	Supply Voltage-Min (Vsup)	Technology	Temperature Grade	Toggle Bit	Type	JESD-30 Code	Qualification Status	JESD-609 Code	Moisture Sensitivity Level	Operating Temperature-Max	Operating Temperature-Min	Peak Reflow Temperature (Cel)	Number of Terminals	Package Body Material	Package Code	Package Equivalence Code	Package Shape	Package Style	Surface Mount	Terminal Finish	Terminal Form	Terminal Pitch	Terminal Position	Seated Height-Max	Length	Width	Ihs Manufacturer	Part Package Code	Package Description	Pin Count	Reach Compliance Code	ECCN Code	HTS Code

Check for Price

Obsolete

67.1089 Mbit

8K,64K

4MX16

3 V

90 ns

FLASH

BOTTOM/TOP

YES

16,126

4000000

4.1943 M

ASYNCHRONOUS

PARALLEL

3 V

YES

5 µA

45 µA

3.6 V

2.7 V

CMOS

INDUSTRIAL

YES

NOR TYPE

R-PBGA-B63

Not Qualified

85 °C

-40 °C

260

PLASTIC/EPOXY

TFBGA

BGA63,8X12,32

RECTANGULAR

GRID ARRAY, THIN PROFILE, FINE PITCH

YES

TIN LEAD

BALL

800 µm

BOTTOM

1.2 mm

12 mm

11 mm

SPANSION INC

BGA

12 X 11 MM, 0.80 MM PITCH, FBGA-63

not_compliant

EAR99

8542.32.00.51

Check for Price

Transferred

67.1089 Mbit

8K,64K

4MX16

3 V

90 ns

FLASH

BOTTOM/TOP

YES

16,126

4000000

4.1943 M

ASYNCHRONOUS

PARALLEL

3 V

YES

5 µA

45 µA

3.6 V

2.7 V

CMOS

INDUSTRIAL

YES

NOR TYPE

R-PBGA-B63

Not Qualified

85 °C

-40 °C

PLASTIC/EPOXY

TFBGA

BGA63,8X12,32

RECTANGULAR

GRID ARRAY, THIN PROFILE, FINE PITCH

YES

Tin/Lead (Sn/Pb)

BALL

800 µm

BOTTOM

1.2 mm

12 mm

11 mm

ADVANCED MICRO DEVICES INC

BGA

12 X 11 MM, 0.80 MM PITCH, FBGA-63

unknown

EAR99

8542.32.00.51

Check for Price

Transferred

67.1089 Mbit

8K,64K

4MX16

3 V

90 ns

FLASH

BOTTOM/TOP

YES

16,126

4000000

4.1943 M

ASYNCHRONOUS

PARALLEL

3 V

YES

5 µA

45 µA

3.6 V

2.7 V

CMOS

INDUSTRIAL

YES

NOR TYPE

R-PBGA-B63

Not Qualified

85 °C

-40 °C

PLASTIC/EPOXY

TFBGA

BGA63,8X12,32

RECTANGULAR

GRID ARRAY, THIN PROFILE, FINE PITCH

YES

Tin/Lead (Sn/Pb)

BALL

800 µm

BOTTOM

1.2 mm

12 mm

11 mm

ADVANCED MICRO DEVICES INC

BGA

12 X 11 MM, 0.80 MM PITCH, FBGA-63

unknown

EAR99

8542.32.00.51

Check for Price

Obsolete

67.1089 Mbit

8K,64K

4MX16

3 V

90 ns

FLASH

BOTTOM/TOP

YES

16,126

4000000

4.1943 M

ASYNCHRONOUS

PARALLEL

3 V

YES

5 µA

45 µA

3.6 V

2.7 V

CMOS

INDUSTRIAL

YES

NOR TYPE

R-PBGA-B63

Not Qualified

85 °C

-40 °C

260

PLASTIC/EPOXY

TFBGA

BGA63,8X12,32

RECTANGULAR

GRID ARRAY, THIN PROFILE, FINE PITCH

YES

TIN LEAD

BALL

800 µm

BOTTOM

1.2 mm

12 mm

11 mm

SPANSION INC

BGA

12 X 11 MM, 0.80 MM PITCH, FBGA-63

not_compliant

EAR99

8542.32.00.51

Compare

AM29DL640D90WHI

Spansion

Check for Price

Obsolete

67.1089 Mbit

8K,64K

4MX16

3 V

90 ns

FLASH

BOTTOM/TOP

YES

16,126

4000000

4.1943 M

ASYNCHRONOUS

PARALLEL

3 V

YES

5 µA

45 µA

3.6 V

2.7 V

CMOS

INDUSTRIAL

YES

NOR TYPE

R-PBGA-B63

Not Qualified

85 °C

-40 °C

260

PLASTIC/EPOXY

TFBGA

BGA63,8X12,32

RECTANGULAR

GRID ARRAY, THIN PROFILE, FINE PITCH

YES

TIN LEAD

BALL

800 µm

BOTTOM

1.2 mm

12 mm

11 mm

SPANSION INC

BGA

12 X 11 MM, 0.80 MM PITCH, FBGA-63

not_compliant

EAR99

8542.32.00.51

AM29DL640D90WHIN

AMD

Check for Price

Transferred

67.1089 Mbit

8K,64K

4MX16

3 V

90 ns

FLASH

BOTTOM/TOP

YES

16,126

4000000

4.1943 M

ASYNCHRONOUS

PARALLEL

3 V

YES

5 µA

45 µA

3.6 V

2.7 V

CMOS

INDUSTRIAL

YES

NOR TYPE

R-PBGA-B63

Not Qualified

85 °C

-40 °C

PLASTIC/EPOXY

TFBGA

BGA63,8X12,32

RECTANGULAR

GRID ARRAY, THIN PROFILE, FINE PITCH

YES

Tin/Lead (Sn/Pb)

BALL

800 µm

BOTTOM

1.2 mm

12 mm

11 mm

ADVANCED MICRO DEVICES INC

BGA

12 X 11 MM, 0.80 MM PITCH, FBGA-63

unknown

EAR99

8542.32.00.51

AM29DL640D90WHI

AMD

Check for Price

Transferred

67.1089 Mbit

8K,64K

4MX16

3 V

90 ns

FLASH

BOTTOM/TOP

YES

16,126

4000000

4.1943 M

ASYNCHRONOUS

PARALLEL

3 V

YES

5 µA

45 µA

3.6 V

2.7 V

CMOS

INDUSTRIAL

YES

NOR TYPE

R-PBGA-B63

Not Qualified

85 °C

-40 °C

PLASTIC/EPOXY

TFBGA

BGA63,8X12,32

RECTANGULAR

GRID ARRAY, THIN PROFILE, FINE PITCH

YES

Tin/Lead (Sn/Pb)

BALL

800 µm

BOTTOM

1.2 mm

12 mm

11 mm

ADVANCED MICRO DEVICES INC

BGA

12 X 11 MM, 0.80 MM PITCH, FBGA-63

unknown

EAR99

8542.32.00.51

AM29DL640D90WHIN

Spansion

Check for Price

Obsolete

67.1089 Mbit

8K,64K

4MX16

3 V

90 ns

FLASH

BOTTOM/TOP

YES

16,126

4000000

4.1943 M

ASYNCHRONOUS

PARALLEL

3 V

YES

5 µA

45 µA

3.6 V

2.7 V

CMOS

INDUSTRIAL

YES

NOR TYPE

R-PBGA-B63

Not Qualified

85 °C

-40 °C

260

PLASTIC/EPOXY

TFBGA

BGA63,8X12,32

RECTANGULAR

GRID ARRAY, THIN PROFILE, FINE PITCH

YES

TIN LEAD

BALL

800 µm

BOTTOM

1.2 mm

12 mm

11 mm

SPANSION INC

BGA

12 X 11 MM, 0.80 MM PITCH, FBGA-63

not_compliant

EAR99

8542.32.00.51

Parametric results for: AM29DL640D90WHI under Flash Memories