Findchips: Parametric Search Results for AM29DL324GB120WDI


Select Parts		Part Number

		AM29DL324GB120WDIN AMD
		AM29DL324GB120WDI AMD
		AM29DL324GB120WDI Spansion
		AM29DL324GB120WDIN Spansion

				Most Relevant						Technical																						Compliance			Operating Conditions				Physical											Dimensions			Other
Composite Price	Pbfree Code	Rohs Code	Part Life Cycle Code	Memory Density	Memory Width	Sector Size	Organization	Supply Voltage-Nom (Vsup)	Access Time-Max	Memory IC Type	Alternate Memory Width	Boot Block	Command User Interface	Common Flash Interface	Data Polling	Number of Functions	Number of Sectors/Size	Number of Words Code	Number of Words	Operating Mode	Parallel/Serial	Programming Voltage	Ready/Busy	Standby Current-Max	Supply Current-Max	Supply Voltage-Max (Vsup)	Supply Voltage-Min (Vsup)	Technology	Temperature Grade	Toggle Bit	Type	JESD-30 Code	Qualification Status	JESD-609 Code	Moisture Sensitivity Level	Operating Temperature-Max	Operating Temperature-Min	Peak Reflow Temperature (Cel)	Number of Terminals	Package Body Material	Package Code	Package Equivalence Code	Package Shape	Package Style	Surface Mount	Terminal Finish	Terminal Form	Terminal Pitch	Terminal Position	Seated Height-Max	Length	Width	Ihs Manufacturer	Part Package Code	Package Description	Pin Count	Reach Compliance Code	ECCN Code	HTS Code

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Transferred

33.5544 Mbit

8K,64K

2MX16

3 V

120 ns

FLASH

BOTTOM

YES

8,63

2000000

2.0972 M

ASYNCHRONOUS

PARALLEL

3 V

YES

5 µA

45 µA

3.6 V

2.7 V

CMOS

INDUSTRIAL

YES

NOR TYPE

R-PBGA-B63

Not Qualified

85 °C

-40 °C

PLASTIC/EPOXY

TFBGA

BGA63,8X12,32

RECTANGULAR

GRID ARRAY, THIN PROFILE, FINE PITCH

YES

Tin/Lead (Sn/Pb)

BALL

800 µm

BOTTOM

1.2 mm

14 mm

8 mm

ADVANCED MICRO DEVICES INC

BGA

TFBGA, BGA63,8X12,32

unknown

EAR99

8542.32.00.51

Check for Price

Transferred

33.5544 Mbit

8K,64K

2MX16

3 V

120 ns

FLASH

BOTTOM

YES

8,63

2000000

2.0972 M

ASYNCHRONOUS

PARALLEL

3 V

YES

5 µA

45 µA

3.6 V

2.7 V

CMOS

INDUSTRIAL

YES

NOR TYPE

R-PBGA-B63

Not Qualified

85 °C

-40 °C

PLASTIC/EPOXY

TFBGA

BGA63,8X12,32

RECTANGULAR

GRID ARRAY, THIN PROFILE, FINE PITCH

YES

Tin/Lead (Sn/Pb)

BALL

800 µm

BOTTOM

1.2 mm

14 mm

8 mm

ADVANCED MICRO DEVICES INC

BGA

TFBGA, BGA63,8X12,32

unknown

EAR99

8542.32.00.51

Check for Price

Obsolete

33.5544 Mbit

8K,64K

2MX16

3 V

120 ns

FLASH

BOTTOM

YES

8,63

2000000

2.0972 M

ASYNCHRONOUS

PARALLEL

3 V

YES

5 µA

45 µA

3.6 V

2.7 V

CMOS

INDUSTRIAL

YES

NOR TYPE

R-PBGA-B63

Not Qualified

85 °C

-40 °C

260

PLASTIC/EPOXY

TFBGA

BGA63,8X12,32

RECTANGULAR

GRID ARRAY, THIN PROFILE, FINE PITCH

YES

TIN LEAD

BALL

800 µm

BOTTOM

1.2 mm

14 mm

8 mm

SPANSION INC

BGA

8 X 14 MM, 0.80 MM PITCH, FBGA-63

not_compliant

EAR99

8542.32.00.51

Check for Price

Obsolete

33.5544 Mbit

8K,64K

2MX16

3 V

120 ns

FLASH

BOTTOM

YES

8,63

2000000

2.0972 M

ASYNCHRONOUS

PARALLEL

3 V

YES

5 µA

45 µA

3.6 V

2.7 V

CMOS

INDUSTRIAL

YES

NOR TYPE

R-PBGA-B63

Not Qualified

85 °C

-40 °C

260

PLASTIC/EPOXY

TFBGA

BGA63,8X12,32

RECTANGULAR

GRID ARRAY, THIN PROFILE, FINE PITCH

YES

TIN LEAD

BALL

800 µm

BOTTOM

1.2 mm

14 mm

8 mm

SPANSION INC

BGA

8 X 14 MM, 0.80 MM PITCH, FBGA-63

not_compliant

EAR99

8542.32.00.51

Compare

AM29DL324GB120WDIN

AMD

Check for Price

Transferred

33.5544 Mbit

8K,64K

2MX16

3 V

120 ns

FLASH

BOTTOM

YES

8,63

2000000

2.0972 M

ASYNCHRONOUS

PARALLEL

3 V

YES

5 µA

45 µA

3.6 V

2.7 V

CMOS

INDUSTRIAL

YES

NOR TYPE

R-PBGA-B63

Not Qualified

85 °C

-40 °C

PLASTIC/EPOXY

TFBGA

BGA63,8X12,32

RECTANGULAR

GRID ARRAY, THIN PROFILE, FINE PITCH

YES

Tin/Lead (Sn/Pb)

BALL

800 µm

BOTTOM

1.2 mm

14 mm

8 mm

ADVANCED MICRO DEVICES INC

BGA

TFBGA, BGA63,8X12,32

unknown

EAR99

8542.32.00.51

AM29DL324GB120WDI

AMD

Check for Price

Transferred

33.5544 Mbit

8K,64K

2MX16

3 V

120 ns

FLASH

BOTTOM

YES

8,63

2000000

2.0972 M

ASYNCHRONOUS

PARALLEL

3 V

YES

5 µA

45 µA

3.6 V

2.7 V

CMOS

INDUSTRIAL

YES

NOR TYPE

R-PBGA-B63

Not Qualified

85 °C

-40 °C

PLASTIC/EPOXY

TFBGA

BGA63,8X12,32

RECTANGULAR

GRID ARRAY, THIN PROFILE, FINE PITCH

YES

Tin/Lead (Sn/Pb)

BALL

800 µm

BOTTOM

1.2 mm

14 mm

8 mm

ADVANCED MICRO DEVICES INC

BGA

TFBGA, BGA63,8X12,32

unknown

EAR99

8542.32.00.51

AM29DL324GB120WDI

Spansion

Check for Price

Obsolete

33.5544 Mbit

8K,64K

2MX16

3 V

120 ns

FLASH

BOTTOM

YES

8,63

2000000

2.0972 M

ASYNCHRONOUS

PARALLEL

3 V

YES

5 µA

45 µA

3.6 V

2.7 V

CMOS

INDUSTRIAL

YES

NOR TYPE

R-PBGA-B63

Not Qualified

85 °C

-40 °C

260

PLASTIC/EPOXY

TFBGA

BGA63,8X12,32

RECTANGULAR

GRID ARRAY, THIN PROFILE, FINE PITCH

YES

TIN LEAD

BALL

800 µm

BOTTOM

1.2 mm

14 mm

8 mm

SPANSION INC

BGA

8 X 14 MM, 0.80 MM PITCH, FBGA-63

not_compliant

EAR99

8542.32.00.51

AM29DL324GB120WDIN

Spansion

Check for Price

Obsolete

33.5544 Mbit

8K,64K

2MX16

3 V

120 ns

FLASH

BOTTOM

YES

8,63

2000000

2.0972 M

ASYNCHRONOUS

PARALLEL

3 V

YES

5 µA

45 µA

3.6 V

2.7 V

CMOS

INDUSTRIAL

YES

NOR TYPE

R-PBGA-B63

Not Qualified

85 °C

-40 °C

260

PLASTIC/EPOXY

TFBGA

BGA63,8X12,32

RECTANGULAR

GRID ARRAY, THIN PROFILE, FINE PITCH

YES

TIN LEAD

BALL

800 µm

BOTTOM

1.2 mm

14 mm

8 mm

SPANSION INC

BGA

8 X 14 MM, 0.80 MM PITCH, FBGA-63

not_compliant

EAR99

8542.32.00.51

Parametric results for: AM29DL324GB120WDI under Flash Memories